CN1273994C - 导电性有机硅及其制造方法 - Google Patents
导电性有机硅及其制造方法 Download PDFInfo
- Publication number
- CN1273994C CN1273994C CNB028097580A CN02809758A CN1273994C CN 1273994 C CN1273994 C CN 1273994C CN B028097580 A CNB028097580 A CN B028097580A CN 02809758 A CN02809758 A CN 02809758A CN 1273994 C CN1273994 C CN 1273994C
- Authority
- CN
- China
- Prior art keywords
- cured silicone
- organopolysiloxane
- less
- equal
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28202701P | 2001-04-06 | 2001-04-06 | |
| US60/282,027 | 2001-04-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1528000A CN1528000A (zh) | 2004-09-08 |
| CN1273994C true CN1273994C (zh) | 2006-09-06 |
Family
ID=23079779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028097580A Expired - Lifetime CN1273994C (zh) | 2001-04-06 | 2002-04-05 | 导电性有机硅及其制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6902688B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1399928B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4375968B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1273994C (cg-RX-API-DMAC7.html) |
| WO (1) | WO2002082468A1 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105315669A (zh) * | 2014-06-26 | 2016-02-10 | (株)普奈科斯 | 导电硅树脂组合物和由其制备的电磁波屏蔽垫片 |
| CN110431188A (zh) * | 2017-12-08 | 2019-11-08 | Lg化学株式会社 | 导电聚硅氧烷组合物及由其制造的聚硅氧烷复合材料 |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040092655A1 (en) * | 2001-04-02 | 2004-05-13 | Takayoshi Otomo | Mouldable silicone gel compositions |
| WO2003085681A1 (en) * | 2002-04-01 | 2003-10-16 | World Properties, Inc. | Electrically conductive polymeric foams and elastomers and methods of manufacture thereof |
| US6783692B2 (en) * | 2002-10-17 | 2004-08-31 | Dow Corning Corporation | Heat softening thermally conductive compositions and methods for their preparation |
| US7135767B2 (en) * | 2003-07-29 | 2006-11-14 | Agilent Technologies, Inc. | Integrated circuit substrate material and method |
| JP2005286195A (ja) * | 2004-03-30 | 2005-10-13 | Geltec Co Ltd | 押出し可能な架橋済グリース状電磁波吸収材、これを充填・封入した容器、その容器の製法、及びこれらを利用した電磁波吸収方法 |
| US20070267603A1 (en) * | 2004-12-17 | 2007-11-22 | Kazuhisa Takagi | Method of Controlling Specific Inductive Capacity, Dielectric Material, Mobil Phone and Human Phantom Model |
| WO2006064782A1 (ja) | 2004-12-17 | 2006-06-22 | Kabushiki Kaisha Fine Rubber Kenkyuusho | 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体 |
| KR101271662B1 (ko) | 2005-02-16 | 2013-06-05 | 다우 코닝 도레이 캄파니 리미티드 | 강화 실리콘 수지 필름 및 이의 제조방법 |
| US8092910B2 (en) * | 2005-02-16 | 2012-01-10 | Dow Corning Toray Co., Ltd. | Reinforced silicone resin film and method of preparing same |
| EP1708317A3 (de) | 2005-03-29 | 2007-11-14 | Karl Ronald Schoeller | Rollband-Kontakt-Einheit zur permanenten oder bewegungsabhängig intermittierenden galvanischen Verbindung zweier Systeme |
| WO2006114786A2 (en) | 2005-04-25 | 2006-11-02 | G & G Biotechnology Ltd. | Lightweight implantable prosthetic device |
| US20090162596A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
| US20090162651A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
| US20100183814A1 (en) * | 2005-08-02 | 2010-07-22 | Victor Rios | Silicone compositions, methods of manufacture, and articles formed therefrom |
| WO2007018756A1 (en) * | 2005-08-04 | 2007-02-15 | Dow Corning Corporation | Reinforced silicone resin film and method of preparing same |
| US7589284B2 (en) * | 2005-09-12 | 2009-09-15 | Parker Hannifin Corporation | Composite polymeric material for EMI shielding |
| AU2006292615A1 (en) * | 2005-09-16 | 2007-03-29 | Hyperion Catalysis International, Inc. | Conductive silicone and methods for preparing same |
| JP5362363B2 (ja) * | 2005-12-21 | 2013-12-11 | ダウ・コーニング・コーポレイション | シリコーン樹脂フィルム、その調製方法、及びナノ材料充填シリコーン組成物 |
| KR20140060557A (ko) * | 2006-01-19 | 2014-05-20 | 다우 코닝 코포레이션 | 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된 실리콘 조성물 |
| ATE516331T1 (de) * | 2006-02-02 | 2011-07-15 | Dow Corning | Silikonharzfilm, herstellungsverfahren dafür und mit nanomaterial gefüllte silikonzusammensetzung |
| US8084097B2 (en) * | 2006-02-20 | 2011-12-27 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
| KR20090074758A (ko) * | 2006-10-05 | 2009-07-07 | 다우 코닝 코포레이션 | 실리콘 수지 필름 및 이의 제조방법 |
| EP2125936A1 (en) * | 2007-02-06 | 2009-12-02 | Dow Corning Corporation | Silicone resin, silicone composition, coated substrate, and reinforced silicone resin film |
| JP2010519382A (ja) * | 2007-02-22 | 2010-06-03 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルムおよびその調製方法 |
| DE602008001879D1 (de) * | 2007-02-22 | 2010-09-02 | Dow Corning | Verfahren zur herstellung leitfähiger folien sowie in diesem verfahren hergestellte artikel |
| US20100075127A1 (en) * | 2007-02-22 | 2010-03-25 | Mark Fisher | Reinforced Silicone Resin Film and Method of Preparing Same |
| JP5377334B2 (ja) | 2007-02-22 | 2013-12-25 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルム |
| JP5426402B2 (ja) | 2007-02-22 | 2014-02-26 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルム |
| JP5269885B2 (ja) * | 2007-05-01 | 2013-08-21 | ダウ・コーニング・コーポレイション | ナノ材料充填シリコーン組成物及び強化シリコーン樹脂フィルム |
| JP5250025B2 (ja) * | 2007-05-01 | 2013-07-31 | ダウ・コーニング・コーポレイション | 強化シリコーン樹脂フィルム |
| US20100209687A1 (en) * | 2007-10-12 | 2010-08-19 | Bizhong Zhu | Reinforced Silicone Resin Film and Nanofiber-Filled Silicone Composition |
| CN101412851B (zh) * | 2008-11-25 | 2011-10-05 | 上海市合成树脂研究所 | 一种有机硅导电胶 |
| US20120012382A1 (en) * | 2009-05-13 | 2012-01-19 | Laird Technologies, Inc. | Conductive Films for EMI Shielding Applications |
| WO2011019719A1 (en) * | 2009-08-12 | 2011-02-17 | Parker-Hannifin Corporation | Fully-cured thermally or electrically-conductive form-in-place gap filler |
| US9339371B2 (en) * | 2010-01-18 | 2016-05-17 | G & G Biotechnology Ltd | Lightweight breast implant material |
| US8355770B2 (en) * | 2010-03-22 | 2013-01-15 | Idt Technology Limited | Conductive silicone material for human skin electrode |
| US8766108B2 (en) | 2010-08-30 | 2014-07-01 | Parker Hannifin Corporation | Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications |
| US8759692B2 (en) | 2010-08-30 | 2014-06-24 | Parker-Hannifin Corporation | Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications |
| US9049777B2 (en) * | 2010-11-01 | 2015-06-02 | Plastics Research Corporation | EMI shielded thermoset article |
| CN102276988B (zh) * | 2011-06-08 | 2012-10-31 | 北京工业大学 | 一种单组份Ni-C填充型FIP热硫化高导电硅橡胶及其制备方法 |
| JP5872440B2 (ja) * | 2012-02-13 | 2016-03-01 | Dowaエレクトロニクス株式会社 | 球状銀粉およびその製造方法 |
| RU2522614C2 (ru) * | 2012-07-11 | 2014-07-20 | Федеральное государственное унитарное предприятие "Государственный ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (ФГУП "ГНИИХТЭОС") | Способ улучшения адгезии к металлам силиконовых композиционных материалов, получаемых по реакции полиприсоединения |
| DE102012220700A1 (de) * | 2012-11-13 | 2014-05-15 | Wacker Chemie Ag | Füllstoffhaltige Siliconzusammensetzungen |
| WO2014080789A1 (ja) * | 2012-11-20 | 2014-05-30 | 横浜ゴム株式会社 | 低温焼成用導電性組成物および太陽電池セル |
| KR102132587B1 (ko) * | 2012-12-20 | 2020-07-10 | 다우 실리콘즈 코포레이션 | 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스 |
| US9428680B2 (en) | 2013-03-14 | 2016-08-30 | Dow Corning Corporation | Conductive silicone materials and uses |
| CN105008484B (zh) * | 2013-03-14 | 2017-12-22 | 道康宁公司 | 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置 |
| CN103289410A (zh) * | 2013-05-22 | 2013-09-11 | 吴江市德佐日用化学品有限公司 | 一种具有低压缩永久变形特性的导电硅橡胶 |
| CN103351839A (zh) * | 2013-07-23 | 2013-10-16 | 上海魁固塑胶制品有限公司 | 单组分脱胺型高导电硅橡胶及其制备方法 |
| EP3059286B1 (en) * | 2013-10-17 | 2020-08-26 | Shin-Etsu Chemical Co., Ltd. | Silicone gel composition, and silicone gel cured product |
| AR099038A1 (es) | 2014-01-08 | 2016-06-22 | General Cable Tech Corp | Conductor aéreo recubierto |
| CN106663500A (zh) * | 2014-08-05 | 2017-05-10 | 通用线缆技术公司 | 用于架空导体的含氟共聚物涂料 |
| CR20170466A (es) | 2015-03-12 | 2018-02-02 | G & G Biotechnology Ltd | Material de implante compuesto |
| MX392932B (es) | 2015-11-13 | 2025-03-24 | Gen Cable Technologies Corp | Cables recubiertos con recubrimientos de fluorocopolímero. |
| US10312638B2 (en) | 2016-05-31 | 2019-06-04 | Amphenol Corporation | High performance cable termination |
| CN106085341B (zh) * | 2016-06-12 | 2019-01-11 | 江苏明昊新材料科技股份有限公司 | 单组分硅酮导电银胶及其制备方法 |
| CN106085340B (zh) * | 2016-06-12 | 2019-01-11 | 江苏明昊新材料科技股份有限公司 | 具有触变特性的高导热导电银胶及其制备方法 |
| US10191519B2 (en) * | 2016-09-19 | 2019-01-29 | Google Llc | Electronic device with gasket sealing receptacle for tongue |
| WO2018077725A1 (en) * | 2016-10-24 | 2018-05-03 | Luxembourg Institute Of Science And Technology (List) | Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate |
| CN108117757B (zh) * | 2016-11-28 | 2021-06-04 | 天迈科技股份有限公司 | 具有导电与防水特性的多功能胶体 |
| US10640232B2 (en) | 2016-12-20 | 2020-05-05 | The Boeing Company | Conductive fastening system for composite structures |
| CN119209123A (zh) | 2017-08-03 | 2024-12-27 | 安费诺有限公司 | 用于高速互连的线缆连接器 |
| CN107364065B (zh) * | 2017-08-14 | 2023-11-28 | 深圳市康利邦科技有限公司 | 曲面玻璃屏保护膜的一体成型加工工艺及其保护膜 |
| WO2019135969A1 (en) * | 2018-01-03 | 2019-07-11 | Texting Tip LLC | Fingernail tip stylus |
| KR20200123101A (ko) | 2018-02-18 | 2020-10-28 | 지 & 지 바이오테크놀로지 엘티디 | 강화된 쉘 접착력을 가진 보형물 |
| LU100768B1 (en) * | 2018-04-18 | 2019-10-22 | Luxembourg Inst Science & Tech List | Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate |
| KR102540533B1 (ko) * | 2018-06-01 | 2023-06-07 | 현대자동차주식회사 | 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품 |
| CN109054729A (zh) * | 2018-07-17 | 2018-12-21 | 泰州隆基乐叶光伏科技有限公司 | 一种湿/热双固化的导电胶及其制备方法 |
| US12022642B2 (en) | 2018-08-21 | 2024-06-25 | Laird Technologies, Inc. | Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes |
| WO2020061988A1 (en) | 2018-09-28 | 2020-04-02 | Dow Silicones Corporation | Liquid silicone rubber composition |
| CN113366044A (zh) | 2018-12-26 | 2021-09-07 | 迈图高新材料公司 | 基于有机硅的固化性组合物和其应用 |
| CN113348204A (zh) | 2018-12-26 | 2021-09-03 | 迈图高新材料公司 | 基于有机硅的固化性组合物和其应用对相关申请的交叉引用 |
| KR20210108431A (ko) * | 2018-12-26 | 2021-09-02 | 모멘티브 퍼포먼스 머티리얼즈 인크. | 경화성 실리콘 기반 조성물 및 그 용도 |
| US11137014B2 (en) | 2019-01-08 | 2021-10-05 | The Boeing Company | Conductive fastening system and method for improved EME performance |
| WO2020172395A1 (en) | 2019-02-22 | 2020-08-27 | Amphenol Corporation | High performance cable connector assembly |
| CN110294940A (zh) * | 2019-06-28 | 2019-10-01 | 深圳市飞荣达科技股份有限公司 | 屏蔽衬垫及其制备方法 |
| CN113511146A (zh) * | 2020-04-09 | 2021-10-19 | 莱尔德技术股份有限公司 | 电磁干扰emi吸收体、雷达支架、汽车和汽车部件 |
| US11454661B2 (en) | 2020-11-05 | 2022-09-27 | Amplifier Research Corp. | Field probe |
| KR20230118078A (ko) | 2020-12-04 | 2023-08-10 | 로저스코포레이션 | 열 폭주 방지용 다층 시트 |
| CN112940510A (zh) * | 2021-03-11 | 2021-06-11 | 广东思泉新材料股份有限公司 | 一种基于泡沫金属的三维骨架结构的致密导热硅胶复合材料及其制备方法 |
| US12453500B2 (en) * | 2021-05-11 | 2025-10-28 | Purdue Research Foundation | Poroelastic materials, biosensors comprising poroelastic materials, and methods of making and using poroelastic materials and biosensors |
| CN113338050A (zh) * | 2021-06-07 | 2021-09-03 | 深圳先进电子材料国际创新研究院 | 一种耐高温金属化纤维布和导电硅胶复合材料及其制备方法和smt方面的用途 |
| TW202330798A (zh) * | 2021-11-01 | 2023-08-01 | 美商羅傑斯公司 | 經填充之聚矽氧發泡層、其製造組成物及製造方法、及包含該經填充之聚矽氧發泡層之製品 |
| CN115260985A (zh) * | 2022-08-26 | 2022-11-01 | 韦尔通(厦门)科技股份有限公司 | 一种双组份低粘度高导热灌封胶及其制备方法和应用 |
| US12300888B2 (en) | 2023-02-02 | 2025-05-13 | Microsonic, Inc. | System and method for attenuating radiation emissions from earpiece devices |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3583930A (en) * | 1968-04-16 | 1971-06-08 | Chomerics Inc | Plastics made conductive with coarse metal fillers |
| US4011360A (en) * | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| US4279783A (en) * | 1979-04-04 | 1981-07-21 | Dow Corning Corporation | Electrically conductive silicone elastomers |
| JPS59199756A (ja) * | 1983-04-27 | 1984-11-12 | Toshiba Silicone Co Ltd | 導電性シリコ−ンゴム組成物 |
| JPS63117065A (ja) | 1986-11-05 | 1988-05-21 | Toshiba Silicone Co Ltd | 室温硬化型導電性シリコ−ンゴム組成物 |
| JPS63251464A (ja) * | 1987-04-08 | 1988-10-18 | Toray Silicone Co Ltd | 導電性シリコ−ンゴム粒状物 |
| JP2618663B2 (ja) | 1987-11-30 | 1997-06-11 | 東レ・ダウコーニング・シリコーン株式会社 | 磁性シリコーンゴム粉状物の製造方法 |
| CA2000787A1 (en) | 1988-11-04 | 1990-05-04 | Richard L. Cole | Electrically conductive silicone compositions |
| US5075038A (en) * | 1988-11-04 | 1991-12-24 | Dow Corning Corporation | Electrically conductive silicone compositions |
| JPH05325647A (ja) | 1991-03-29 | 1993-12-10 | Siegel:Kk | シリコーンゲル多孔質導電体並びにその製造方法 |
| JP3084380B2 (ja) | 1991-06-06 | 2000-09-04 | 株式会社ジェルテック | 導電性シリコーンゲル材の使用方法と改質方法 |
| US5182050A (en) * | 1991-10-24 | 1993-01-26 | Amp Incorporated | Extrinsically/intrinsically conductive gel |
| JP3318338B2 (ja) | 1992-02-28 | 2002-08-26 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性ポリオルガノシロキサン組成物の製造方法 |
| JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
| US5366664A (en) * | 1992-05-04 | 1994-11-22 | The Penn State Research Foundation | Electromagnetic shielding materials |
| DE4320527A1 (de) * | 1992-06-22 | 1993-12-23 | Whitaker Corp | Elektrisch leitfähiges Gel |
| JPH06144951A (ja) | 1992-11-11 | 1994-05-24 | Hiroyuki Kobayashi | セラミックス発泡体とその製造方法 |
| CA2129073C (en) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| US5498644A (en) * | 1993-09-10 | 1996-03-12 | Specialty Silicone Products, Inc. | Silcone elastomer incorporating electrically conductive microballoons and method for producing same |
| JP2868986B2 (ja) | 1993-10-06 | 1999-03-10 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
| JP2819444B2 (ja) | 1993-11-08 | 1998-10-30 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
| US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
| JP3950493B2 (ja) * | 1996-04-26 | 2007-08-01 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
| JP3436464B2 (ja) | 1996-10-31 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 |
| US5928569A (en) * | 1997-02-26 | 1999-07-27 | Specialty Silicone Products, Inc. | Substantially uniform moldable blends of silver particulate and organopolysiloxane |
| US6017587A (en) | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
| JP3922332B2 (ja) * | 2000-01-17 | 2007-05-30 | 信越化学工業株式会社 | 導電性液状シリコーンゴム組成物 |
| JP3810976B2 (ja) * | 2000-02-15 | 2006-08-16 | 株式会社小糸製作所 | 自動車用赤外光照射ランプ |
-
2002
- 2002-04-05 CN CNB028097580A patent/CN1273994C/zh not_active Expired - Lifetime
- 2002-04-05 WO PCT/US2002/012765 patent/WO2002082468A1/en not_active Ceased
- 2002-04-05 JP JP2002580347A patent/JP4375968B2/ja not_active Expired - Lifetime
- 2002-04-05 EP EP02764008A patent/EP1399928B1/en not_active Expired - Lifetime
- 2002-04-05 US US10/117,439 patent/US6902688B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105315669A (zh) * | 2014-06-26 | 2016-02-10 | (株)普奈科斯 | 导电硅树脂组合物和由其制备的电磁波屏蔽垫片 |
| CN110431188A (zh) * | 2017-12-08 | 2019-11-08 | Lg化学株式会社 | 导电聚硅氧烷组合物及由其制造的聚硅氧烷复合材料 |
| CN110431188B (zh) * | 2017-12-08 | 2022-03-25 | Lg化学株式会社 | 导电聚硅氧烷组合物及由其制造的聚硅氧烷复合材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1528000A (zh) | 2004-09-08 |
| JP4375968B2 (ja) | 2009-12-02 |
| JP2004533501A (ja) | 2004-11-04 |
| US6902688B2 (en) | 2005-06-07 |
| WO2002082468A1 (en) | 2002-10-17 |
| US20030047718A1 (en) | 2003-03-13 |
| EP1399928B1 (en) | 2012-06-13 |
| EP1399928A1 (en) | 2004-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1273994C (zh) | 导电性有机硅及其制造方法 | |
| CN1276028C (zh) | 导电硅橡胶组合物 | |
| US5075038A (en) | Electrically conductive silicone compositions | |
| JP5471868B2 (ja) | 熱伝導性シリコーンゴム複合シート | |
| CN1311050C (zh) | 导热硅橡胶复合片材 | |
| JPH10130508A (ja) | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 | |
| JP6136952B2 (ja) | 熱伝導性複合シリコーンゴムシート | |
| CN114729193B (zh) | 热传导性硅酮组合物和热传导性硅酮片材 | |
| JP6662458B2 (ja) | 熱伝導性シリコーンゴム複合シート | |
| KR20080093997A (ko) | 방열재와 이를 이용한 반도체 장치 | |
| TWI791706B (zh) | 用於將導熱組成物施加於電子組件上之方法 | |
| EP3211667A1 (en) | Heat dissipation sheet | |
| WO2020100439A1 (ja) | 導電性シリコーン組成物、硬化物、積層体、及び、電子回路 | |
| TW202134396A (zh) | 導熱性矽酮樹脂組成物、硬化物及導熱性矽酮散熱片材 | |
| JP6669258B2 (ja) | 熱伝導性シート | |
| JP5154010B2 (ja) | 熱伝導性シリコーンゴム組成物 | |
| JP2017082125A (ja) | 導電性樹脂組成物、配線、配線基板および電子装置 | |
| JP6217303B2 (ja) | 導電性シリコーンゴム製電極パターンの作製方法並びにオールシリコーンゴム製静電チャック及びその製造方法 | |
| TW202248352A (zh) | 熱傳導性矽酮組合物及其固化物 | |
| CN111117259A (zh) | 一种双组份导热界面材料及其使用方法和应用 | |
| JP2004161944A (ja) | 難燃性液状シリコーンゴム組成物 | |
| JP4993555B2 (ja) | 付加反応硬化型シリコーン組成物 | |
| TWI757112B (zh) | 熱傳導性組成物及其製造方法 | |
| JP2002363410A (ja) | エネルギー高伝導性シリコーンゴム組成物 | |
| JP5482631B2 (ja) | 静電チャック |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20060906 |
|
| CX01 | Expiry of patent term |