CN1258098A - 背面电极型电子部件和将其装于印刷电路板上的电子组件 - Google Patents

背面电极型电子部件和将其装于印刷电路板上的电子组件 Download PDF

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CN1258098A
CN1258098A CN99126131A CN99126131A CN1258098A CN 1258098 A CN1258098 A CN 1258098A CN 99126131 A CN99126131 A CN 99126131A CN 99126131 A CN99126131 A CN 99126131A CN 1258098 A CN1258098 A CN 1258098A
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山田康义
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NEC Corp
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Abstract

一种背电极型电子部件包括一个包括电路的主体和为所述电子部件的背面部分上的焊块(7,8)而安排并连接到所述电路的电极(9)。电极安排的部分中电极组的每一组设有单个的第一类焊块(7),后者比安排在角部以外的电极用的第二类焊块(8)大。另外,该组电极包括所述电路工作时具有大体上相同电平的电极。

Description

背面电极型电子部件和将其装于 印刷电路板上的电子组件
本发明涉及背面电极型电子部件以及具有装于印刷电路板上的背面电极型电子部件的电子组件。
随着诸如便携式信息终端等小尺寸电子设备的出现，用于这样的电子设备上的背面电极型或网格焊球阵列(BGA)型电子部件也做成小尺寸的。另外，BGA电极也做得小了。因此，电子设备中的BGA型电子部件和印刷电路板之间的焊接部分缩小，使得它对热循环应力和外部应力的耐力降低。
图1表示其上安装了传统BGA型电子部件的印刷电路板的电子组件的截面视图。参见图1，在电子部件11的电极焊盘12和印刷电路板15的焊盘16之间设置焊球13。角上的焊球特意用标号14表示。
在公开让公众审查的日本专利申请(JP-A-Heisei 10-56093)中，描述了一种半导体器件和其中装有该种半导体器件的电器。在这个参考文献中，在BGA电极布局的角落部分设置空电极，而同时一个基片电极对应于一部件电极。这样，即使由于热循环而在空电极焊接部分产生开裂，信号电极的焊接仍旧得到保证。
由于环境温度的变化和BGA型电子部件本身发热的变化而在其上装有BGA型电子部件的印刷电路板上施加了热循环应力。这时，BGA型电子部件和印刷电路板之间在热膨胀率上的差异会引起任意的挠曲。这一挠曲往往集中在BGA型电子部件电极布局的周边四角的焊接部分。当焊接部分不能忍受这一挠曲时，很可能就在焊接部分出现开裂。
另外，当外部应力施加在其上装有BGA型电子部件的印刷电路板上时，印刷电路板被弯曲，BGA型电子部件电极布局的四个角落部分最容易接受应力变形。这是因为这里几乎没有能够分散应力的相邻电极，而且由外部应力造成的印刷电路板变形也变为最大。应力变形造成的印刷电路板焊接部分的破坏往往从四个角落部分向电极布局的内部发展。
鉴于以上的描述，公开让公众审查的日本专利公告(JP-A-heisei4-314355)公开了一种芯片载体。在这个参考文献中，在芯片载体的背面设有一些定位焊盘，其面积比连接焊盘大。在基片上设置导电电路，使其面积比与连接焊盘对应的连接导电电路大。并且芯片载体预先焊接，芯片载体定位在基片上。然后进行软熔焊接。这样，利用定位焊盘上的焊球进行定位，并且把连接焊盘连接在基片上。
此外，公开让公众审查的日本专利公告(JP-A-Heisei 9-330993)公开了一种半导体器件。在这个参考文献中，以BGA结构中的焊盘3a和3b的形式分开地形成构成焊盘3的焊块。半导体芯片模制之后，利用焊盘3a和3b进行测试。此后，当形成焊块时，利用单个的焊块将焊盘3a和3b电连接。
另外，公开让公众审查的日本专利公告(JP-A-Heisei 7-321247)公开了一种BGA半导体器件。在这个参考文献中，形成焊盘14，它具有在通过变形中心12的线的方向上的长度大于与该线垂直的方向上的长度的形状。这样，令热挠曲产生方向上的接触角大于传统器件，以便延长相对于热挠曲的焊接寿命。
此外，公开让公众审查的日本专利公告(JP-A-Heisei 9-307022)公开了一种表面安装型的半导体封装。在这个参考文献中，半导体封装3具有矩形的封装体15。被焊料层23覆盖的焊球22在封装体的背面16b上排列成矩阵。通过软熔焊接把焊球22焊接在印刷电路板2的焊盘8上。焊球排列区最外侧的焊球22a的直径比其它焊球大。
另外，日本已登记的实用新型No.3012948公开了一种BGA电子部件。在这个参考文献中，在容易由于热循环而产生任何开裂的焊接区域中，设置空端子8。空端子安排在端子布局的最外部分或各个角落部分。
因此，本发明的一个目的是提供一种背面电极型电子部件，其中增强了电极布局的四个角落部分焊接部分的强度，以便改善安装可靠性。
本发明的另一个目的是提供一种其中把这样一种背面电极型电子部件安装在印刷电路板上的电子组件，借此增大该组件的可靠性。
为了实现本发明的一个方面，背面电极型电子部件包括包含电路的主体以及为电子部件的背面部分上的焊块而安排的并连接到该电路的电极。电极布局各部分中的每一组电极是为单个的第一焊块而设的，后者比排列在角落部分以外的电极的第二焊块大。另外，所述电极组包括电路工作时具有大体上相同电平的各电极。
可以把电极安排成矩阵形式，并且所述角落部分可以是四个角落部分。
此外，所述电极组可以包括不与所述电路连接的非接触电极。
另外，所述电极组中的一个电极可以是信号电极、地电位电极或者电源电位电极。
为了本发明的另一个方面，电子组件包括背面电极型电子部件、印刷电路板和焊块。背面电极型电子部件包括设置在电子部件的背面部分并与所述电路连接的电极。电极布局的各角落部分上的各电极组是几组集合电极，并且所述集合电极组包括电路工作时具有大体上相同电平的各电极。印刷电路板具有基片电极，后者与为电子部件设置的电极对应。基片电极中作为第一基片电极的一个是为每一组集合电极设置的，并且作为第一基片电极以外的第二基片电极的基片电极是为集合电极以外的电子部件电极设置的。焊块包括连接到各组集合电极和第一基片电极的第一焊块以及连接到第二基片电极和集合电极以外的电子部件电极的第二焊块。
此外，电子部件的电极可以排列成矩阵，并且所述各部分是四个角落部分。
另外，所述集合电极组中的一个电极可以是不与所述电路连接的非接触电极、信号电极或电源电平电极。
图1是表示传统的BGA型电子部件装在印刷电路板上的状态的截面视图；
图2是背平面视图，表示按照本发明第一实施例的BGA型电子部件的电极排列；
图3是部分平面视图，表示其上安装图2的BGA型电子部件的印刷电路板的电极排列；
图4是平面视图，表示图2的BGA型电子部件安装在图3的印刷电路板上的状态；
图5是当图2的BGA型电子部件安装在图3的印刷电路板上时沿着图4的A-A线的截面视图；
图6是平面视图，表示按照本发明第二实施例的BGA型电子部件的电极排列；以及
图7是平面视图，表示图6的BGA型电子部件安装在印刷电路板上的状态。
下面将描述背面电极型电子部件以及其中背面电极型电子部件安装在印刷电路板上的组件。
图2是背平面视图，表示按照本发明第一实施例的背面电极型或BGA型电子部件。图2中的标号1表示BGA型电子部件，2表示可集合的专用电极，而3表示一般电极。该电子部件包括在其中的电路(未示出)，而专用电极2和一般电极3连接到该电路上。在第一实施例中，在BGA型电子部件4个角落部分的每一个角落上设置一组4个地电位电极作为专用电极2。如图2所示，电极排列成矩阵，在行和列的方向上相邻电极之间的距离是恒定的。但是，专用电极之间的间距可以短于一般电极之间的间距。此外，在图3中，所有电极都具有相同的尺寸。但是，专用电极在尺寸上可以不同于一般电极。例如，专用电极可以大于或小于一般电极。
尽管地电位电极用作专用电极，但是其它电极也可以用作专用电极。例如，用①至⑦表示的下列电极可以用作一组可集合电极。亦即，
①地电位电极集合在一起或重新配成一组；
②不连接到电子部件1的电路上的非接触电极集合在一起或重新配成一组；
③电路工作时具有相同信号电平的信号电极集合在一起或重新配成一组；
④电源电位电极集合在一起或重新配成一组；
⑤地电位电极和非接触电极集合成一组；
⑥相同信号电极和非接触电极集合成为一组；以及
⑦电源电极和非接触电极集合成一组。
图3表示其上安装了图2所示的BGA型电子部件的印刷电路板。在图3中，标号4表示基片，5表示集合电极，而6表示一般电极。本实施例中的基片4具有作为图2所示BGA型电子部件中的专用电极2的集合电极5，以及作为一般电极3的一般电极6。所述集合电极设置在4个角落的部分，并且4个专用电极集成在同一个集合电极5中。这时，焊接部分变大，使得有可能改善焊接的BGA型电子部件和印刷电路板之间的连接强度。
图4表示图1所示的BGA型电子部件焊接在图3所示的印刷电路板4上的状态。BGA型电子部件1的一组专用电极2焊接在印刷电路板4的集合电极5上。这时，如图5所示，用于BGA型电子部件的专用电极2和集合电极5的焊块大。用于BGA型电子部件的一般电极3和印刷电路板4的一般电极6的焊块小。
就是说，BGA型电子部件的专用电极2和印刷电路板4的集合电极5之间的焊接部分大。结果，四个角落部分的焊接部分的连接强度明显改善。因此，就能防止上面指出的热循环应力造成的开裂的出现和外部应力造成的破坏，结果改善了安装的BGA型电子部件的可靠性。
在本发明中，集合在四个角落部分中每一个角落的专用电极数目不限于4个电极，而可以是任意数目。例如，如图6中所示，把3个专用电极3，也就是位于BGA型电子部件1四个角落中每一个角落的专用电极2和两个沿着BGA型电子部件1边缘排列并位于上述电极2旁边的电极2设置为可集合专用电极。集合电极的数目亦不限于4。集合电极的数目可以是任意数目。
另外，如图7所示，基片4设置了方形集合电极10，用以安装图6所示的BGA型电子部件1。这种集合电极10与图6所示的BGA型电子部件1的3个专用电极2焊接在一起。
基片4上设置的集合电极可以如图3和图4所示呈圆形、如图7所示呈方形，或呈椭圆形和卵形等任意形状。
按照本发明，所述专用电极组焊接在基片的集合电极上，同时，BGA型电子部件的一般电极焊接在印刷电路板上的一般电极上。BGA型电子部件的焊接部分可以在四个角落的每一个角落中做得大些。因此，四个角落的焊接部分的连接强度得以增大。也就有可能防止上面指出的热循环应力造成的开裂的出现和外部应力造成的破坏，结果改善了所安装的BGA型电子部件的可靠性。

Claims (12)

1.一种背面电极型电子部件，它包括：
包含电路的主体，以及
为所述电子部件的背面部分上的焊块而安排的并且连接到所述电路的电极，
其特征在于：
电极布局的一些部分中所述电极组的每一组是为单个第一焊块设置的，后者比安排在所述角落部分以外的电极的第二焊块大，以及
所述电极组包括所述电路工作时具有大体上相同电平的电极。
2.按照权利要求1的背面电极型电子部件，其特征在于：所述电极排列成矩阵形式，并且所述一些部分是四个角落部分。
3.按照权利要求1的背面电极型电子部件，其特征在于：所述电极组包括不与所述电路连接的非接触电极。
4.按照权利要求1至3中任何一个的背面电极型电子部件，其特征在于：所述组的所述电极中的一个是信号电极。
5.按照权利要求1至3中任何一个的背面电极型电子部件，其特征在于：所述组的所述电极中的一个是地电位电极。
6.按照权利要求1至3中任何一个的背面电极型电子部件，其特征在于：所述组的所述电极中的一个是电源电位电极。
7.一种电子组件，它包括：
背面电极型电子部件，它包括：包含电路的主体；以及一些设置在所述电子部件的背面部分并连接到所述电路的电极，其中，电极布局的一些部分处所述电极的一些组是一些集合电极组，并且，所述集合电极组包括所述电路工作时具有大体上相同电平的所述电极；
印刷电路板，它具有对应于为所述电子部件设置的所述电极的基片电极，其中作为第一基片电极的所述基片电极中的一个是为所述各组集合电极中的每一个设置的，并且所述第一基片电极以外的作为第二基片电极的所述基片电极是为所述电子部件的所述集合电极以外的所述电极设置的；以及
一些焊块，它们包括与所述集合电极组和所述第一基片电极连接的第一类焊块以及与所述第二基片电极和所述电子部件的除所述集合电极以外的所述电极连接的第二类焊块。
8.按照权利要求7的背面电极型电子部件，其特征在于：所述电子部件的所述电极排列成矩阵形式，并且所述一些部分是四个角落部分。
9.按照权利要求7的背面电极型电子部件，其特征在于：所述组的所述集合电极中的一个是不与所述电路连接的非接触电极。
10.按照权利要求7至9中任何一个的背面电极型电子部件，其特征在于：所述组的所述集合电极中的一个是信号电极。
11.按照权利要求7至9中任何一个的背面电极型电子部件，其特征在于：所述组的所述电极中的一个是地电位电极。
12.按照权利要求7至9中任何一个的背面电极型电子部件，其特征在于：所述组的所述电极中的一个是电源电位电极。
CN99126131A 1998-12-04 1999-12-06 背面电极型电子部件和将其装于印刷电路板上的电子组件 Pending CN1258098A (zh)

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