CN1212354C - 不燃树脂组合物、预浸片、层压板、金属包皮层压板、印刷电路板和多层印刷电路板 - Google Patents

不燃树脂组合物、预浸片、层压板、金属包皮层压板、印刷电路板和多层印刷电路板 Download PDF

Info

Publication number
CN1212354C
CN1212354C CNB011365218A CN01136521A CN1212354C CN 1212354 C CN1212354 C CN 1212354C CN B011365218 A CNB011365218 A CN B011365218A CN 01136521 A CN01136521 A CN 01136521A CN 1212354 C CN1212354 C CN 1212354C
Authority
CN
China
Prior art keywords
silicone oligomer
resin composition
resin
prepared
metal hydrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB011365218A
Other languages
English (en)
Chinese (zh)
Other versions
CN1350031A (zh
Inventor
高野希
福田富男
宫武正人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN1350031A publication Critical patent/CN1350031A/zh
Application granted granted Critical
Publication of CN1212354C publication Critical patent/CN1212354C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31862—Melamine-aldehyde

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB011365218A 2000-10-13 2001-10-15 不燃树脂组合物、预浸片、层压板、金属包皮层压板、印刷电路板和多层印刷电路板 Expired - Fee Related CN1212354C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000313720 2000-10-13
JP2000313720 2000-10-13

Publications (2)

Publication Number Publication Date
CN1350031A CN1350031A (zh) 2002-05-22
CN1212354C true CN1212354C (zh) 2005-07-27

Family

ID=18793092

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011365218A Expired - Fee Related CN1212354C (zh) 2000-10-13 2001-10-15 不燃树脂组合物、预浸片、层压板、金属包皮层压板、印刷电路板和多层印刷电路板

Country Status (9)

Country Link
US (1) US6706409B2 (enExample)
EP (1) EP1197514B1 (enExample)
JP (3) JP5186221B2 (enExample)
KR (2) KR100572532B1 (enExample)
CN (1) CN1212354C (enExample)
AT (1) ATE248203T1 (enExample)
DE (1) DE60100652T2 (enExample)
SG (1) SG108282A1 (enExample)
TW (2) TWI293320B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP2003003076A (ja) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、金属箔張積層板及びプリント配線板
KR20040111516A (ko) 2002-04-15 2004-12-31 니폰 제온 가부시키가이샤 니스, 성형물, 전기 절연막, 적층체, 난연제 슬러리, 및난연제 입자 및 니스의 제조방법
DE602005017509D1 (de) * 2004-11-26 2009-12-17 Lg Chemical Ltd Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
US7851536B2 (en) * 2005-09-15 2010-12-14 Rutgers, The State University Flame-retardant coating
TW200831583A (en) * 2006-09-29 2008-08-01 Nippon Catalytic Chem Ind Curable resin composition, optical material, and method of regulating optical material
AU2007322017B2 (en) * 2006-11-20 2013-11-07 Monsanto Technology Llc Plant growth and imaging devices and related methods and computer program products
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5539706B2 (ja) * 2009-12-16 2014-07-02 旭化成ケミカルズ株式会社 プリプレグ、金属箔張積層板、及びプリント配線板
WO2012169591A1 (ja) * 2011-06-09 2012-12-13 住友精化株式会社 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
CN106364067B (zh) * 2016-08-29 2021-10-12 上海国纪电子材料有限公司 一种p10覆铜板
CN114026102A (zh) * 2019-07-18 2022-02-08 巴斯夫欧洲公司 孪生单体组合物及其介电膜
KR102601266B1 (ko) * 2021-04-19 2023-11-13 주식회사 액시드 난연성 필름 및 난연성 필름을 위한 코팅 조성물
KR102807057B1 (ko) * 2021-06-18 2025-05-15 (주)엠케이켐앤텍 폴리실록산 난연성 코팅제, 난연성 폴리실록산, 이의 제조방법 및 이로부터 제조된 난연물품
JP7594819B2 (ja) 2022-10-25 2024-12-05 共立エレックス株式会社 自己消火性を有する樹脂材料

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686135A (en) * 1985-01-29 1987-08-11 Hiraoka & Co., Ltd. Composite sheet material
US4666765A (en) * 1985-10-02 1987-05-19 Caldwell James M Silicone coated fabric
JPS62143953A (ja) 1985-12-18 1987-06-27 Shin Etsu Chem Co Ltd 低発煙性ゴム組成物
JPS6322853A (ja) * 1987-02-13 1988-01-30 Hitachi Ltd シリコ−ンフエノ−ル系化合物の組成物、及びその用途
JP2550808B2 (ja) * 1991-08-23 1996-11-06 日立電線株式会社 難燃性電気絶縁組成物および難燃性電線・ケーブル
EP0837090B1 (en) * 1995-06-27 2001-08-29 Hitachi Chemical Co., Ltd. Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
JP4164883B2 (ja) * 1997-08-19 2008-10-15 日立化成工業株式会社 印刷配線板用樹脂組成物及びそれを用いたプリプレグ、金属張り積層板
US6130282A (en) 1997-10-01 2000-10-10 Kyowa Chemical Industry Co Ltd Flame retardant resin composition
JP3297014B2 (ja) 1997-10-01 2002-07-02 協和化学工業株式会社 難燃性樹脂組成物
JP4245197B2 (ja) * 1997-10-08 2009-03-25 日立化成工業株式会社 印刷配線板用プリプレグの製造方法及びこれを用いた金属張積層板
JP3611435B2 (ja) 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JPH11181243A (ja) 1997-12-18 1999-07-06 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
JPH11181380A (ja) 1997-12-19 1999-07-06 Mitsui Chem Inc 難燃性接着剤組成物
JPH11199753A (ja) 1998-01-05 1999-07-27 Toshiba Chem Corp 積層用難燃性樹脂組成物
JPH11217467A (ja) 1998-02-03 1999-08-10 Yazaki Corp ノンハロゲン難燃性樹脂組成物
CA2272448A1 (en) 1998-05-29 1999-11-29 Martinswerk Gmbh Fur Chemische Und Metallurgische Produktion Non-hygroscopic thermally stable aluminium hydroxide
EP0960855A1 (en) 1998-05-29 1999-12-01 Martinswerk GmbH für chemische und metallurgische Produktion Non hygroscopic thermally stable aluminium hydroxide
JP4399061B2 (ja) 1999-10-13 2010-01-13 東レ・ダウコーニング株式会社 難燃性ポリオレフィン系樹脂組成物、その製造方法および難燃性ケーブル
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP2001226676A (ja) * 2000-02-14 2001-08-21 Kansai Research Institute 難燃剤、その製造方法及び難燃樹脂組成物
JP4872160B2 (ja) * 2000-03-21 2012-02-08 日立化成工業株式会社 誘電特性に優れる樹脂組成物並びにこれを用いて作製されるワニス、ワニスの製造方法、プリプレグ及び金属張積層板
JP4365987B2 (ja) * 2000-05-15 2009-11-18 協和化学工業株式会社 積層板用材料および電機および電子機器用樹脂組成物およびその成型品
JP3664124B2 (ja) * 2000-10-13 2005-06-22 日立化成工業株式会社 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Also Published As

Publication number Publication date
US20020068173A1 (en) 2002-06-06
KR100570924B1 (ko) 2006-04-13
KR100572532B1 (ko) 2006-04-24
DE60100652T2 (de) 2004-06-24
TWI293320B (enExample) 2008-02-11
JP5186221B2 (ja) 2013-04-17
US6706409B2 (en) 2004-03-16
DE60100652D1 (de) 2003-10-02
JP2011099113A (ja) 2011-05-19
JP2012122081A (ja) 2012-06-28
JP2008179819A (ja) 2008-08-07
KR20040111217A (ko) 2004-12-31
KR20020029639A (ko) 2002-04-19
TW200423831A (en) 2004-11-01
TWI293544B (enExample) 2008-02-11
CN1350031A (zh) 2002-05-22
EP1197514A1 (en) 2002-04-17
ATE248203T1 (de) 2003-09-15
SG108282A1 (en) 2005-01-28
EP1197514B1 (en) 2003-08-27

Similar Documents

Publication Publication Date Title
CN1212354C (zh) 不燃树脂组合物、预浸片、层压板、金属包皮层压板、印刷电路板和多层印刷电路板
CN100341938C (zh) 不含卤素的阻燃性环氧树脂组合物和含该组合物的制品
CN1390246A (zh) 阻燃环氧树脂组合物和由其制得的层压物
CN1100816C (zh) 印刷线路板用预浸坯料、树脂漆以及树脂组合物，及用其制成的印刷线路用层压板
CN1206279C (zh) 热固性聚亚苯基醚树脂组合物、由其得到的可固化树脂组合物及层压结构体
CN1130427C (zh) 环氧树脂组成物及其制成的半固化片和多层印刷电路板
CN1318077A (zh) 含有缩水甘油醚基团的烷氧基硅烷的部分缩合物,硅烷改性树脂,它们的组合物和制备它们的方法
CN1717451A (zh) 用于环氧树脂的硬化剂组合物
CN1419587A (zh) 介电特性优良的树脂组合物和该树脂组合物的制备方法及用其生产的树脂清漆和树脂清漆的制备方法及用它们生产的层压材料和金属贴合的层压板
CN1608100A (zh) 树脂组合物、预浸料、层压板及半导体封装结构
CN1556830A (zh) 官能化聚苯醚
CN1425034A (zh) 新的聚硅氧烷聚合物的制备方法,用该方法制备的聚硅氧烷聚合物,热固性树脂组合物,树脂膜,贴有绝缘材料的金属箔,两面贴有金属箔的绝缘膜,贴有金属的层压板,多层贴有金属的层压板和多层印刷电路布线板
CN1558931A (zh) 低热膨胀性的热固性树脂组合物以及树脂膜
CN1324088C (zh) 阻燃性树脂组合物、其生产方法、包含其的成型制品和硅石
CN1914246A (zh) 热固性树脂组合物及其应用
CN1250599C (zh) 环氧树脂组合物和半导体装置
CN100339446C (zh) 清漆、成型物、电绝缘膜、层压物、阻燃剂淤浆以及阻燃剂粒子和清漆的制造方法
CN1317329C (zh) 树脂组合物、使用该树脂组合物的预浸料及叠层板
CN1239615C (zh) 可固化树脂组合物
CN1432047A (zh) 环氧树脂组合物和半导体设备
CN101044204A (zh) 非卤素阻燃剂环氧树脂组合物，和使用其的预浸料坯和包铜的层压制品
CN1636987A (zh) 环氧化合物，其制备方法以及应用
CN1890286A (zh) 热固性树脂组合物、树脂片以及用于绝缘基板的树脂片
JP3664124B2 (ja) 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板
CN1771274A (zh) 印刷线路板用树脂组成物、半固化片及采用了半固化片的层叠板

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050727

Termination date: 20191015

CF01 Termination of patent right due to non-payment of annual fee