WO2012169591A1 - 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 - Google Patents
不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 Download PDFInfo
- Publication number
- WO2012169591A1 WO2012169591A1 PCT/JP2012/064699 JP2012064699W WO2012169591A1 WO 2012169591 A1 WO2012169591 A1 WO 2012169591A1 JP 2012064699 W JP2012064699 W JP 2012064699W WO 2012169591 A1 WO2012169591 A1 WO 2012169591A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- dispersion
- weight
- incombustible
- combustible
- Prior art date
Links
- 239000006185 dispersion Substances 0.000 title claims abstract description 121
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000007788 liquid Substances 0.000 title abstract description 9
- 238000012360 testing method Methods 0.000 claims abstract description 75
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 60
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 60
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 27
- 239000000057 synthetic resin Substances 0.000 claims abstract description 27
- 229910052623 talc Inorganic materials 0.000 claims description 100
- 239000000454 talc Substances 0.000 claims description 87
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 74
- -1 silica compound Chemical class 0.000 claims description 72
- 229920001721 polyimide Polymers 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 33
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 32
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 32
- 239000009719 polyimide resin Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 28
- 239000004743 Polypropylene Substances 0.000 claims description 25
- 229920001155 polypropylene Polymers 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 19
- 238000002485 combustion reaction Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 18
- 239000002612 dispersion medium Substances 0.000 claims description 15
- 229920002577 polybenzoxazole Polymers 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 230000035699 permeability Effects 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000002243 precursor Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 239000004962 Polyamide-imide Substances 0.000 claims description 9
- 229920002312 polyamide-imide Polymers 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 230000015556 catabolic process Effects 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000005995 Aluminium silicate Substances 0.000 claims description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- 235000012211 aluminium silicate Nutrition 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 6
- 230000020169 heat generation Effects 0.000 claims description 6
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 229910052604 silicate mineral Inorganic materials 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052903 pyrophyllite Inorganic materials 0.000 claims description 4
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 claims description 3
- 235000002017 Zea mays subsp mays Nutrition 0.000 claims description 3
- 229940043430 calcium compound Drugs 0.000 claims description 3
- 150000001674 calcium compounds Chemical class 0.000 claims description 3
- 239000002734 clay mineral Substances 0.000 claims description 3
- 235000005822 corn Nutrition 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 240000008042 Zea mays Species 0.000 claims 1
- 229920005575 poly(amic acid) Polymers 0.000 description 49
- 230000000052 comparative effect Effects 0.000 description 18
- 229920003023 plastic Polymers 0.000 description 18
- 239000004033 plastic Substances 0.000 description 18
- 239000010410 layer Substances 0.000 description 15
- 239000002966 varnish Substances 0.000 description 15
- 238000002156 mixing Methods 0.000 description 14
- 239000007822 coupling agent Substances 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 239000004952 Polyamide Substances 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229920002647 polyamide Polymers 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 7
- 229920000742 Cotton Polymers 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 4
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 3
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical compound C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 241000209149 Zea Species 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- 238000002411 thermogravimetry Methods 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- CQHYICHMGNSGQH-UHFFFAOYSA-N 1,3-oxazole-2-carboxylic acid Chemical compound OC(=O)C1=NC=CO1 CQHYICHMGNSGQH-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- QNVRIHYSUZMSGM-LURJTMIESA-N 2-Hexanol Natural products CCCC[C@H](C)O QNVRIHYSUZMSGM-LURJTMIESA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 0 CCC[C@](C)(C=CC)C1=N*2(OC(*C(C)(CC)CC)=N2)O1 Chemical compound CCC[C@](C)(C=CC)C1=N*2(OC(*C(C)(CC)CC)=N2)O1 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical group [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 229910000271 hectorite Inorganic materials 0.000 description 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- MBHINSULENHCMF-UHFFFAOYSA-N n,n-dimethylpropanamide Chemical compound CCC(=O)N(C)C MBHINSULENHCMF-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N n-butyl methyl ketone Natural products CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
- B29C39/006—Monomers or prepolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Definitions
- the present invention relates to an incombustible film having excellent flexibility and moisture resistance and high mechanical strength.
- the present invention also relates to a non-combustible film dispersion used for the production of the non-combustible film, a non-combustible film production method using the non-combustible film dispersion, a solar battery backsheet using the non-combustible film, and a flexible Regarding the substrate. Furthermore, it is related with the solar cell which uses this solar cell backsheet.
- non-combustible materials are required for building materials, vehicle materials, and electrical product materials in order to guarantee the safety and reliability of products.
- non-combustible films for example, films using fluororesins and thin glass have been developed.
- fluororesins are expensive and have a large coefficient of thermal expansion, resulting in poor dimensional stability and a maximum operating temperature of 200 ° C.
- Thin glass is inexpensive and has excellent heat resistance and moisture resistance, but is not flexible enough.
- plastic films such as polyimide films are flexible, but they are poor in moisture resistance and heat resistance.
- many attempts have been made to produce more sophisticated films by mixing synthetic resins and inorganic compounds. Has been made.
- the compounding amount of the inorganic compound is increased, the moisture resistance and heat resistance are improved, but on the contrary, it is inferior in flexibility and mechanical strength, so it has excellent nonflammability, flexibility and moisture resistance, and high mechanical properties. It has been difficult to produce a film having strength.
- an inorganic compound is generally not mixed uniformly with a polyimide resin, and since an inorganic compound isolate
- Patent Documents 1 to 4 disclose a film prepared by preparing a material in which an interlayer ion of clay is replaced with an organic ion as an additive in order to obtain a uniform dispersion of polyimide and an inorganic compound. Since an organic substance is contained in clay, the produced film has low heat resistance and has a drawback of burning when exposed to a flame.
- Patent Documents 5 and 6 disclose films prepared using a dilute dispersion whose non-volatile component is 5% by weight or less of the total amount of the non-combustible film dispersion. Only a film of 8% by weight or less of the component was obtained, and the organic component accounted for the majority, so the incombustibility was poor.
- Patent Document 7 discloses a film in which the content of the inorganic compound is 90% by weight or more based on the total nonvolatile components.
- the film disclosed in Patent Document 7 is produced using a dilute dispersion liquid in which the non-volatile component is 1% by weight or less of the total amount.
- productivity is poor, and further, there is a problem that the obtained film is easily broken and difficult to handle because of low mechanical strength.
- Patent Document 8 in a solar cell backsheet composed of a laminate in which at least two layers of substrates are bonded together with a polyurethane adhesive, in an accelerated test under an environment of 85 ° C. and 85% RH, A technique for improving the durability of a polyurethane-based adhesive is disclosed. However, even if the technique disclosed in Patent Document 8 is used, durability is not sufficient because an adhesive is used.
- An object of this invention is to provide the nonflammable film which is excellent in a softness
- the present invention also relates to a non-combustible film dispersion used for the production of the non-combustible film, a non-combustible film production method using the non-combustible film dispersion, a solar battery backsheet using the non-combustible film, and a flexible
- An object is to provide a substrate. Furthermore, it aims at providing the solar cell which uses this solar cell backsheet.
- the present invention is a noncombustible film containing a water-insoluble inorganic compound and a heat-resistant synthetic resin, wherein the content of the water-insoluble inorganic compound is 30% by weight or more and 90% by weight or less with respect to the total weight of the non-combustible film.
- the nonflammable film has a flammability classification of VTM-0. The present invention is described in detail below.
- the noncombustible film of the present invention contains a water-insoluble inorganic compound.
- the “water-insoluble” means that the solubility in 100 ml of water at 20 ° C. is less than 1.0 g.
- the water-insoluble inorganic compound is preferably at least one selected from the group consisting of a silica compound, a silica alumina compound, an aluminum compound, a calcium compound, and a nitride, for example. Especially, it is more preferable that they are a silica compound and a silica alumina compound, and it is still more preferable that it is a layered silicate mineral from a viewpoint of reducing water vapor permeability.
- the layered silicate mineral examples include natural or synthetic mica, talc, kaolin, pyrophyllite, sericite, vermiculite, smectite, bentonite, stevensite, montmorillonite, beidellite, saponite, hectorite, nontron. Night etc. are mentioned.
- non-swelling clay minerals such as talc, kaolin, pyrophyllite, non-swelling mica, and sericite are preferable because a uniform incombustible film can be produced at low cost
- Examples of the silica-alumina compound include zeolite and mullite.
- Examples of the silica compound include wollastonite and glass beads.
- Examples of the aluminum compound include spinel, aluminum hydroxide, aluminum oxide (alumina), and aluminum borate.
- the aluminum compound is preferably used in combination with the layered silicate mineral, more preferably in combination with talc, from the viewpoint of lowering the linear expansion coefficient of the incombustible film to be obtained, and alumina is used as the aluminum compound, and More preferably, it is used in combination with talc.
- Examples of the calcium compound include calcium carbonate.
- Examples of the nitride include silicon nitride and boron nitride.
- the said water-insoluble inorganic compound may be used independently and may use 2 or more types together.
- the water-insoluble inorganic compound is preferably used after selecting the particle size.
- the preferable lower limit of the average particle size of the water-insoluble inorganic compound is 0.1 ⁇ m, and the preferable upper limit is 50 ⁇ m.
- the average particle size of the water-insoluble inorganic compound is less than 0.1 ⁇ m, the mechanical strength of the resulting noncombustible film may be weakened.
- the average particle size of the water-insoluble inorganic compound exceeds 50 ⁇ m, the resulting noncombustible film may be inferior in surface flatness.
- the more preferable lower limit of the average particle size of the water-insoluble inorganic compound is 0.2 ⁇ m, the more preferable upper limit is 20 ⁇ m, the still more preferable lower limit is 0.5 ⁇ m, and the still more preferable upper limit is 15 ⁇ m.
- the average particle size of the water-insoluble inorganic compound can be determined by measuring the particle size distribution using a laser diffraction particle size distribution meter or the like.
- a non-combustible film having a low dielectric constant can be produced.
- the relative dielectric constant of the incombustible film of the present invention depends on the use, but for example, when used for a flexible printed board, it is preferably 4 or less, more preferably 3 or less, and even more preferably 2.5 or less.
- the lower limit of the content of the water-insoluble inorganic compound is 30% by weight with respect to the total weight of the incombustible film.
- the content of the water-insoluble inorganic compound is less than 30% by weight, not only the water vapor permeability and linear expansion coefficient of the resulting film are increased, but also the flammability of the film is increased.
- the preferable lower limit of the content of the water-insoluble inorganic compound is 35% by weight, the more preferable lower limit is 40% by weight, the still more preferable lower limit is 50% by weight, and the particularly preferable lower limit. Is 60% by weight.
- the upper limit of the content of the water-insoluble inorganic compound is 90% by weight with respect to the total weight of the incombustible film. When the content of the water-insoluble inorganic compound exceeds 90% by weight, the resulting film is inferior in mechanical strength.
- a preferable upper limit of the content of the water-insoluble inorganic compound is 85% by weight, a more preferable upper limit is 80% by weight, and a still more preferable upper limit is 70% by weight.
- the noncombustible film of the present invention contains a heat resistant synthetic resin.
- the heat-resistant synthetic resin refers to super engineering plastic (super engineering plastic), for example, polyimide resin, polyamideimide resin, fluorine resin, polyphenylene sulfide resin, polysulfone resin, polyarylate resin, polyethersulfone resin, polyetherimide resin, Examples include polyetheretherketone resins, polybenzoxazole resins, polybenzimidazole resins, and the like.
- at least 1 sort (s) selected from the group which consists of a polyimide resin, a polyamidoimide resin, and a polybenzoxazole resin is used suitably.
- the heat-resistant synthetic resin preferably has a structure that does not contain a saturated cyclic hydrocarbon such as a cyclohexane ring. Since the obtained incombustible film is particularly excellent in heat resistance, the heat-resistant synthetic resin is more preferably a structure containing an aromatic ring, an aromatic polyimide resin, an aromatic polyamideimide resin, and an aromatic More preferably, it is at least one selected from the group consisting of polybenzoxazole resins. Moreover, it is preferable that a polybenzoxazole resin is included from a viewpoint of reducing water vapor permeability.
- the polyimide resin is a compound having a repeating structure of the following formula (1)
- the polyamideimide resin is a compound having a repeating structure of the following formula (2)
- the polybenzoxazole resin is represented by the following formula (3). It is a compound which has the repeating structure of these.
- R 1 is a tetravalent organic group having one or two benzene rings.
- R 1 preferably has a structure represented by the following formula (4)
- the polyimide resin may have a structure represented by the following formula (4) alone as R 1 , or two types. It may be a copolymer having the above.
- R 2 is trivalent and is an organic group having one or two benzene rings.
- R 2 preferably has a structure represented by the following formula (5)
- the polyamideimide resin may have a structure represented by the following formula (5) alone as R 2 , or 2 It may be a copolymer having more than one kind.
- R 1 is a tetravalent organic group having one or two benzene rings.
- R 1 preferably has a structure represented by the following formula (4), and the polybenzoxazole resin may have a structure represented by the following formula (4) alone as R 1 , Two or more types of copolymers may be used.
- R 3 is a divalent organic group having one or two benzene rings.
- R 3 preferably has a structure represented by the following formula (6)
- the polyimide resin, the polyamideimide resin, and the polybenzoxazole resin have a structure represented by the following formula (6) as R 3. You may have independently and the copolymer which has 2 or more types may be sufficient.
- R 1 , R 2 , and R 3 have a structure represented by the following formula (7).
- the polyimide resin and the polybenzoxazole resin may have a structure represented by the following formula (7) as R 1 and R 3 , or may be a copolymer having two or more types.
- the polyamideimide resin may have a structure represented by the following formula (7) as R 2 and R 3 , or may be a copolymer having two or more types.
- the heat resistant synthetic resin may be a copolymer composed of at least two of the polyimide resin, the polybenzoxazole resin, and the polyamideimide resin.
- the nonflammable film of the present invention may contain a coupling agent such as a silane coupling agent and a titanate coupling agent in order to increase mechanical strength.
- a coupling agent such as a silane coupling agent and a titanate coupling agent
- examples of the silane coupling agent include amino silane coupling agents, ureido silane coupling agents, vinyl silane coupling agents, methacrylic silane coupling agents, epoxy silane coupling agents, and mercapto silane cups.
- a ring agent, an isocyanate type silane coupling agent, etc. are mentioned.
- titanate coupling agent examples include a titanate coupling agent having an alkylate group having at least 1 to 60 carbon atoms, a titanate coupling agent having an alkyl phosphite group, and a titanate coupling agent having an alkyl phosphate group. And titanate coupling agents having an agent or an alkyl pyrophosphate group.
- the coupling agent may be previously mixed with a water-insoluble inorganic compound and allowed to act, or may be mixed in a nonflammable film dispersion described later.
- the lower limit of the amount of the coupling agent used is preferably 0.1% by weight and the upper limit is preferably 3.0% by weight with respect to the total weight of the water-insoluble inorganic compound. If the amount of the coupling agent used is less than 0.1% by weight, the effect of using the coupling agent may not be sufficiently exhibited. Even if the coupling agent is used in an amount exceeding 3.0% by weight, an effect commensurate with the amount used may not be obtained. A more preferable lower limit of the amount of the coupling agent used is 0.5% by weight, and a more preferable upper limit is 2.0% by weight.
- the thickness of the incombustible film of the present invention is preferably 10 ⁇ m or more. When the thickness of the incombustible film is less than 10 ⁇ m, the mechanical strength is weak and handling may be difficult.
- the thickness of the noncombustible film is more preferably 20 ⁇ m or more. Moreover, it is preferable that the thickness of the nonflammable film of this invention is 250 micrometers or less. If the thickness of the non-combustible film is larger than 250 ⁇ m, it may become hard and the bending strength may be reduced.
- the thickness of the incombustible film is more preferably 200 ⁇ m or less.
- the incombustible film of the present invention has a flammability classification of VTM-0 in the UL94 standard thin material vertical combustion test (VTM test).
- VTM test a film test piece was wound in a cylindrical shape, attached vertically to a clamp, and subjected to a 3 second indirect flame with a 20 mm size flame twice. This determination is performed.
- the film thickness when performing the UL94 standard VTM test is preferably 100 ⁇ m or less, and more preferably 80 ⁇ m or less.
- the noncombustible film of the present invention preferably has a flammability classification of V-0 in the UL94 standard vertical combustion test (V test).
- V test is mounted vertically on the test piece clamp, 10-second indirect flame with a flame of 20 mm is performed twice, and the combustibility classification shown in Table 2 is determined based on the combustion behavior. .
- the noncombustible film of the present invention preferably has a flammability classification of 5V-A or 5V-B in the UL94 standard 125 mm vertical combustion test (5V test).
- 5V test a strip test piece is mounted vertically on a clamp, a 5-second indirect flame with a flame of 125 mm is performed five times, and the flammability classification is determined based on the combustion behavior. Is held horizontally, and a 5-second indirect flame of 125 mm in size is performed five times from below, and the combustibility classification shown in Table 3 is determined based on the combustion behavior.
- the non-combustible film of the present invention preferably corresponds to “non-combustible” of the material combustion test for railway vehicles based on the Ministry of Land, Infrastructure, Transport and Tourism Ordinance No. 151 “Law for establishing technical standards relating to railways”.
- the incombustible film of the present invention has a total calorific value of 20 MJ / m 2 or less with respect to the sample area in a heat generation test using a cone calorimeter in accordance with ISO 5660-1 for 20 minutes after the start of heating. Is preferably 300 kW / m 2 or less with respect to the sample area, and the time from the start of the test to ignition is preferably 60 seconds or more.
- the non-combustible film of the present invention preferably has a heat shrinkage of 0.6% or less when heated at 350 ° C. for 30 minutes. When the heat shrinkage rate exceeds 0.6%, it is difficult to use the heat shrinkage rate in applications such as electrical materials.
- the thermal shrinkage rate is more preferably 0.3% or less, still more preferably 0.2% or less, and particularly preferably 0.1% or less.
- the non-combustible film of the present invention preferably has a linear expansion coefficient at 50 to 250 ° C. of 5.0 ⁇ 10 ⁇ 5 / ° C. or less.
- the linear expansion coefficient is more preferably 4.0 ⁇ 10 -5 / °C or less, and more preferably 3.0 ⁇ 10 -5 / °C or less.
- the tear strength of the incombustible film of the present invention is preferably 25 N / mm or more. When the tear strength is less than 25 N / mm, the film is easily broken and handling becomes difficult.
- the tear strength is more preferably 30 N / mm or more, and still more preferably 40 N / mm or more. In the present specification, the tear strength is a value determined by a measurement method based on JIS K7128-1.
- the tensile strength of the incombustible film of the present invention is preferably 25 N / mm 2 or more. When the tensile strength is less than 25 N / mm 2 , the film is easily torn and handling becomes difficult.
- the tensile strength is more preferably 30 N / mm 2 or more, more preferably 40N / mm 2 or more.
- the tensile strength is a value determined by a measuring method based on JIS K7127-1, and is measured using a tensile strength tester under the conditions of a grip interval of 80 mm and a tensile speed of 20 mm / min.
- the incombustible film of the present invention preferably has a mandrel diameter of 10 mm or less in which the film is cracked in a bending resistance test by a cylindrical mandrel method according to JIS-K5600-5-1 (1999). If the mandrel diameter at which the film is cracked exceeds 10 mm, the flexibility may be inferior.
- the mandrel diameter at which the film is cracked is more preferably 8 mm or less, still more preferably 5 mm or less, and particularly preferably 4 mm or less.
- the nonflammable film of the present invention preferably has a dielectric breakdown voltage of 20 kV / mm or more.
- the dielectric breakdown voltage is more preferably 25 kV / mm or more, and further preferably 30 kV / mm or more.
- the non-combustible film of the present invention preferably has a partial discharge voltage of at least 700 V or more when a partial discharge test according to IEC 61730-2: 2004 clause 11.1 is performed.
- the partial discharge voltage is preferably 1000 V or higher, more preferably 1500 V or higher, and still more preferably 2000 V or higher.
- the incombustible film of the present invention preferably has a water vapor permeability of 20 g / m 2 ⁇ day or less in an environment of 40 ° C. and 90% RH.
- the water vapor permeability at 40 ° C. and 90% RH is more preferably 10 g / m 2 ⁇ day or less, and still more preferably 5 g / m 2 ⁇ day or less.
- the water absorption after being immersed in water at 40 ° C. for 24 hours is preferably 2.0% by weight or less.
- the water absorption is more preferably 1.0% by weight.
- the moisture absorption after leaving for 24 hours in an environment of 40 ° C. and RH 90% is preferably 2.0% by weight or less.
- the moisture absorption rate is more preferably 1.0% by weight or less.
- the incombustible film of the present invention preferably has no discoloration or peeling change in the surface or cross section even when stored for at least 500 hours in a weather resistance test in an overhumid state at 85 ° C. and 85% RH. In the weather resistance test, if the change appears in 500 hours or less, it becomes difficult to use it for outdoor use such as a solar cell.
- the time during which the discoloration or peeling change appears on the surface or cross section in the weather resistance test is preferably 1000 hours or more, more preferably 2000 hours or more, and still more preferably 3000 hours or more.
- the non-combustible film of the present invention comprises a step 1 for preparing a dispersion for a non-combustible film, a step 2 for developing the prepared dispersion for a non-combustible film and allowing it to stand, and a dispersion for a non-combustible film developed on the substrate.
- the dispersion medium can be removed from the liquid, formed into a film, and then manufactured by a method having Step 3 of separating the film from the substrate.
- Such a method for producing an incombustible film is also one aspect of the present invention.
- the present inventors By using a dispersion liquid in which the content of the non-volatile component and the content of the water-insoluble inorganic compound in the non-volatile component are within a specific range, the present inventors have achieved flexibility and moisture resistance that have been difficult in the past. It was found that a non-combustible film (non-combustible film of the present invention) having excellent mechanical properties and high mechanical strength can be produced. Further, in the method for producing a non-combustible film of the present invention, an inexpensive water-insoluble inorganic compound can be used, and furthermore, the amount of the dispersion medium volatilized from the dispersion can be reduced, so that the productivity is high.
- Step 1 as the incombustible film dispersion, a dispersion medium, a water-insoluble inorganic compound as a nonvolatile component, a heat-resistant synthetic resin, and / or a precursor of a heat-resistant synthetic resin are used. And the content of the water-insoluble inorganic compound is 30% by weight or more and 90% by weight or less with respect to the total weight of the nonvolatile component, and the content of the nonvolatile component is equal to the total weight of the dispersion for incombustible film On the other hand, a dispersion of more than 18% by weight and not more than 65% by weight is prepared.
- nonflammable film dispersion is also one aspect of the present invention.
- the “nonvolatile component” refers to those having no boiling point at normal pressure or having a boiling point of 300 ° C. or higher.
- the water-insoluble inorganic compound and the heat-resistant synthetic resin in the dispersion for an incombustible film of the present invention are the same as those of the incombustible film of the present invention, and thus description thereof is omitted.
- the precursor of the heat-resistant synthetic resin include polyamic acid, and a polyimide resin, a polyamidoimide resin, or a polybenzoxazole resin can be obtained by imidizing or oxazolating the polyamic acid.
- the method for imidizing or oxazolating the polyamic acid include, for example, a method in which polyamic acid is heated and closed to imidize or oxazole, a method in which polyamic acid is chemically closed and imidized, and a polyimide acid is chemically closed. After imidation, there is a method of further heating to oxazolate.
- the method of immobilization or oxazolization by heating and ring closure of the polyamic acid there is no particular limitation on the method of immobilization or oxazolization by heating and ring closure of the polyamic acid.
- the polyamic acid is dispersed in a dispersion medium and heated at 120 to 400 ° C. for 0.5 to 10 hours. Can be mentioned.
- the preferred lower limit of the content of the precursor of the heat resistant synthetic resin is 2% by weight, and the preferred upper limit is 45% by weight.
- the content of the precursor of the heat resistant synthetic resin is less than 2% by weight, the mechanical strength of the obtained incombustible film may be weakened.
- the content of the precursor of the heat resistant synthetic resin exceeds 45% by weight, the heat resistance of the obtained incombustible film may be lowered.
- a more preferable lower limit of the content of the precursor of the heat resistant synthetic resin is 5% by weight, and a more preferable upper limit is 30% by weight.
- dispersion medium examples include hydrocarbon solvents such as n-pentane, n-hexane, n-octane, n-decane, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, and 2-butanol.
- hydrocarbon solvents such as n-pentane, n-hexane, n-octane, n-decane, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, and 2-butanol.
- Alcohol solvents such as isobutanol, tert-butanol, 1-pentanol, 2-pentanol, 1-hexanol, 2-hexanol, ethylene glycol, propylene glycol, acetone, methyl ethyl ketone, diethyl ketone, methyl-isobutyl ketone, Ketone solvents such as cyclohexanone, amide solvents such as N, N-dimethylformamide, N, N-dimethylacetamide, N, N-dimethylpropionamide, N-methyl-2-pyrrolidone, diethyl ether, methyl-tert Butyl ether, Ether solvents such as oxane, tetrahydrofuran, cyclopentyl methyl ether, benzene, chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, tol
- water may be used as the dispersion medium as long as the additive does not precipitate.
- the heat-resistant synthetic resin since the heat-resistant synthetic resin has high solubility, it is selected from the group consisting of N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, tetrahydrofuran, and sulfolane. It is preferable that it is at least one selected.
- These dispersion media may be used alone or in combination of two or more.
- the lower limit of the content of the water-insoluble inorganic compound in the nonflammable film dispersion of the present invention is 30% by weight with respect to the total weight of the nonvolatile components.
- the content of the water-insoluble inorganic compound is less than 30% by weight, not only the water vapor permeability and linear expansion coefficient of the resulting film are increased, but also the flammability of the film is increased.
- a preferred lower limit for the content of the water-insoluble inorganic compound is 35% by weight, a more preferred lower limit is 40% by weight, a still more preferred lower limit is 50% by weight, and a particularly preferred lower limit is 60% by weight.
- the upper limit of the content of the water-insoluble inorganic compound in the nonflammable film dispersion of the present invention is 90% by weight with respect to the total weight of the nonvolatile components.
- the content of the water-insoluble inorganic compound exceeds 90% by weight, the resulting film is inferior in mechanical strength.
- a preferable upper limit of the content of the water-insoluble inorganic compound is 85% by weight, a more preferable upper limit is 80% by weight, and a still more preferable upper limit is 70% by weight.
- the non-volatile component content in the nonflammable film dispersion of the present invention is more than 18% by weight and 65% by weight or less. If the content of the non-volatile component is 18% by weight or less, the dispersion for non-combustible film becomes non-uniform, and a uniform film cannot be obtained. On the other hand, when the content of the non-volatile component is more than 65% by weight, the viscosity of the non-combustible film dispersion increases so much that film formation cannot be performed.
- the content of the nonvolatile component is preferably more than 20% by weight and 55% by weight or less, more preferably more than 25% by weight and 45% by weight or less.
- the ratio of the non-volatile component in the nonflammable film dispersion of the present invention remained after removing the solvent by vacuum evaporation using thermogravimetry (TG), differential thermo-thermogravimetric measurement (TG-DTA), an evaporator, or the like. It can be determined from the weight of the solid.
- Examples of the method of developing the dispersion on the substrate in the step 2 include a method of applying the dispersion in a film form using a doctor blade, a bar coater, or the like.
- the thickness of the dispersion developed on the substrate is preferably 50 ⁇ m or more. If the thickness of the dispersion is less than 50 ⁇ m, the resulting non-combustible film may be thin and the mechanical strength may be weakened. A more preferable lower limit of the thickness of the dispersion is 100 ⁇ m, and a more preferable lower limit is 150 ⁇ m.
- the substrate on which the dispersion is developed is made of glass, polyethylene terephthalate, polyimide, polyethylene, or polypropylene. Is preferred.
- step 3 as a method for removing the dispersion medium from the nonflammable film dispersion developed on the substrate, various solid-liquid separation methods such as centrifugation, filtration, vacuum drying, freeze vacuum drying, heat evaporation, A combination of these methods is possible.
- various solid-liquid separation methods such as centrifugation, filtration, vacuum drying, freeze vacuum drying, heat evaporation, A combination of these methods is possible.
- the temperature condition is 20 to 150 ° C. in a forced air oven.
- the film is preferably obtained by drying under a temperature condition of 30 to 120 ° C. for about 0.5 to 24 hours, preferably 2 to 12 hours.
- the incombustible film can be obtained by further heating the obtained film using an electric furnace or the like.
- a noncombustible film can be obtained by heat-treating the film obtained above at 120 to 400 ° C. for 0.5 to 10 hours. it can.
- the incombustible film of the present invention may be a laminate in which two or more films are laminated and integrated.
- the film of each layer which comprises the said laminated body may be the same, and may differ.
- the content of the water-insoluble inorganic compound is not particularly limited. That is, the content of the water-insoluble inorganic compound is 30% by weight or more and 90% by weight or less with respect to the total weight of the laminate, and in the UL94 standard VTM test for the laminate, the flammability classification is VTM-0. If it exists, it can be used without problems as the non-combustible film of the present invention.
- Examples of such a laminate include a laminate having improved flexibility by laminating a polyimide film not containing a water-insoluble inorganic compound on both sides of a polyimide film containing a water-insoluble inorganic compound. .
- the film produced by removing the dispersion medium from the dispersion for incombustible film in Step 3 in the method for producing an incombustible film is used as a substrate, and further, the removal of the dispersion medium in Steps 1 to 3 is performed. And a method of heating in an electric furnace or the like, if necessary, and the like.
- the incombustible film of the present invention is excellent in flexibility, moisture resistance, and electrical insulation, and has high mechanical strength, so that it can be used for a solar cell backsheet.
- a solar battery back sheet is also one aspect of the present invention.
- a solar cell using the solar cell backsheet of the present invention is also one aspect of the present invention. Since the solar cell backsheet of the present invention is excellent in flexibility, moisture resistance and electrical insulation and has high mechanical strength, the solar cell of the present invention using the solar cell backsheet is excellent in durability and weather resistance. . Moreover, since the solar cell backsheet usually has a multilayer structure composed of a plurality of resin layers, there has been a problem that an adhesive layer or the like for bonding the resin layers deteriorates when used for a long period of time. However, since the incombustible film of the present invention can be used for a solar cell back sheet as a single layer or a laminate in which two or more layers are laminated and integrated, it is possible to suppress such aged deterioration of the solar cell.
- FIG. 1 A schematic cross-sectional view showing an example of the solar cell of the present invention is shown in FIG.
- a solar cell 1 of the present invention has a solar cell element 2 that converts light energy into electric energy by photovoltaic power, and the solar cell element 2 is sealed with a sealant 3.
- the solar cell 1 of the present invention has the light transmissive substrate 4 on the surface that receives sunlight, and the solar cell backsheet 5 of the present invention on the surface opposite to the light transmissive substrate 4.
- the solar cell element 2 is not particularly limited as long as it can convert light energy into electric energy by photovoltaic power.
- single crystal silicon, polycrystalline silicon, amorphous silicon, compound semiconductor (Group 3-5, Group 2-6, etc.) can be used, among which polycrystalline silicon is preferred.
- sealing agent 3 examples include an ethylene-vinyl acetate copolymer, an ethylene-aliphatic unsaturated carboxylic acid copolymer, an ethylene-aliphatic carboxylic acid ester copolymer, or a saponified product thereof. Stop agents are mentioned.
- the light-transmitting substrate 4 is located on the outermost layer of the solar cell 1 on the side receiving sunlight, it is preferable to have excellent weather resistance, water repellency, contamination resistance, mechanical strength and the like in addition to transparency.
- the material of the light transmissive substrate 4 include a resin substrate made of a polyester resin, a fluororesin, an acrylic resin, an ethylene-vinyl acetate copolymer, a glass substrate, and the like.
- a glass substrate is preferred because it is excellent in impact properties and can be produced at low cost.
- a fluororesin is also preferably used.
- the method of manufacturing the solar cell 1 of the present invention is not particularly limited, for example, the light-transmitting substrate 4, the sealing agent 3 in which the solar cell element 2 is sealed, and the solar cell backsheet 5 of the present invention are stacked in this order.
- a vacuum lamination method may be used.
- the nonflammable film of the present invention has high flexibility, mechanical strength, and low coefficient of linear expansion, it can be used for a flexible substrate.
- a flexible substrate a flexible printed circuit board etc. are mentioned, for example.
- Such a flexible substrate is also one aspect of the present invention.
- the nonflammable film which is excellent in a softness
- a non-combustible film dispersion used for the production of the non-combustible film a non-combustible film production method using the non-combustible film dispersion, a solar battery backsheet using the non-combustible film, and A flexible substrate
- the solar cell using this solar cell backsheet can be provided.
- FIG. 1 It is a cross-sectional schematic diagram showing an example of the solar cell of this invention. It is the photograph of the (a) surface and (b) back surface of the solar cell module produced using the nonflammable film produced in Example 14.
- FIG. 1 It is a cross-sectional schematic diagram showing an example of the solar cell of this invention. It is the photograph of the (a) surface and (b) back surface of the solar cell module produced using the nonflammable film produced in Example 14.
- Example 1 Preparation of non-combustible film dispersion
- Talc Nahon Talc Co., Ltd., “Talc MS-K”
- 6.0 g and 18.6 wt% polyamic acid N-methyl-2-pyrrolidone solution Ube Industries, Ltd., “U-Varnish A”
- 20 0.0 g polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g
- ARE-310 rotating and rotating mixer
- the polyamic acid contained in “U-Varnish A” is an aromatic polyamic acid having a repeating structural unit of the following formula (8).
- the obtained dispersion for incombustible film was applied to a polypropylene sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 400 ⁇ m. With the polypropylene sheet kept horizontal, it was dried in a forced air oven at 50 ° C. for 10 hours to form a film on the polypropylene sheet. This film was peeled from the polypropylene sheet and, in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 30 minutes, and consisted of talc and polyimide resin. An incombustible film having a thickness of 80 ⁇ m with a talc ratio of 61.9% by weight was obtained.
- Example 2 Except that the blending amount of talc was 2.7 g, the same as in Example 1, the ratio of talc to the total nonvolatile components was 42.2% by weight, and the ratio of the nonvolatile components to the total amount of the dispersion was 28.2%. % Of a uniform nonflammable film dispersion was obtained. Using the obtained dispersion for incombustible film, in the same manner as in Example 1, an incombustible film having a thickness of 80 ⁇ m composed of talc and a polyimide resin and having a talc ratio of 42.2% by weight with respect to the total weight was obtained. .
- Example 3 Preparation of Nonflammable Film Dispersion 1
- 3.0 g of talc Nippon Talc, “Talc MS-K”
- polyamic acid in N-methyl-2-pyrrolidone Ube Industries, “U-Varnish A”
- 37 .6 g 7.0 g of polyamic acid, 30.6 g of N-methyl-2-pyrrolidone
- ARE-310 rotating / revolving mixer
- Dispersion liquid 1 for film was obtained.
- the obtained dispersion 1 for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so as to have a thickness of 100 ⁇ m.
- a polyethylene terephthalate sheet With the polyethylene terephthalate sheet kept horizontal, it was dried in a forced air oven at 120 ° C. for 1 hour. Next, the sheet was taken out of the oven, and the dispersion 2 for incombustible film was applied and laminated on the surface of the sheet on which the dispersion 1 for incombustible film was applied using a doctor blade so as to have a thickness of 400 ⁇ m. With the sheet kept horizontal, it was dried in a forced air oven at 140 ° C. for 2 hours.
- the sheet was taken out from the oven, and the dispersion 1 for incombustible film was applied to the surface of the sheet on which the dispersion 2 for incombustible film was applied using a doctor blade so that the thickness was 100 ⁇ m.
- the sheet was dried in a forced air oven at 150 ° C. for 1 hour to form a film on the polyethylene terephthalate sheet.
- This film is peeled from the polyethylene terephthalate sheet and, in order, heat-treated at 200 ° C. for 5 minutes and at 350 ° C. for 30 minutes, consisting of talc and polyimide resin, and the ratio of talc to the total weight is 50.0% by weight.
- a non-combustible film having a thickness of 120 ⁇ m was obtained.
- the obtained non-combustible film has a first layer having a thickness of 20 ⁇ m in which the ratio of talc to the weight of the layer is 30.0% by weight, and a thickness of 80 ⁇ m in which the ratio of talc to the weight of the layer is 60.0% by weight.
- Three layers of a second layer and a third layer having a thickness of 20 ⁇ m in which the ratio of talc to the weight of the layer is 30.0% by weight are laminated, and each layer is integrated.
- Example 4 Synthesis of polyamic acid varnish
- 70.1 g (0.35 mol) of 4,4-diaminodiphenyl ether, 37.8 g (0.35 mol) of p-phenylenediamine, and N, N— 1273.9 g of dimethylacetamide was charged and dissolved at 50 ° C.
- 152.7 g (0.70 mol) of pyromellitic anhydride was added to the reaction vessel over 2 hours while maintaining the temperature at 45-50 ° C.
- the obtained incombustible film dispersion was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so as to have a thickness of 500 ⁇ m. With the polyethylene terephthalate sheet kept horizontal, it was dried in a forced air oven at 80 ° C. for 2 hours to form a film on the polyethylene terephthalate sheet. This film was peeled from the polyethylene terephthalate sheet, and in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 1 hour, consisting of talc and polyimide resin, total weight A 110 ⁇ m-thick incombustible film having a talc ratio of 70.0% by weight was obtained.
- Example 5 Synthesis of polyamic acid varnish
- 140.1 g (0.70 mol) of 4,4-diaminodiphenyl ether and 1603.0 g of N, N-dimethylacetamide were charged and dissolved at 50 ° C.
- 74.5 g (0.34 mol) of pyromellitic anhydride, 99.8 g (0.34 mol) of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride were added to the reaction vessel, and the temperature was changed to 45. It was added over 2 hours while maintaining -50 ° C.
- the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m. With the polyethylene terephthalate sheet kept horizontal, it was dried in a forced air oven at 80 ° C. for 2 hours to form a film on the polyethylene terephthalate sheet. This film was peeled from the polyethylene terephthalate sheet, and in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 1 hour, consisting of talc and polyimide resin, total weight A 90 ⁇ m-thick incombustible film having a talc ratio of 59.8% by weight was obtained.
- Example 6 2.8 g of talc (manufactured by Nippon Talc Co., Ltd., “Talc MS-K”), 2.8 g of alumina (manufactured by Showa Denko KK, “A-42-2”), and 18.6 wt% polyamic acid N-methyl -2-pyrrolidone solution (“U-Varnish A” manufactured by Ube Industries, Ltd.) 20.0 g (polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g), N-methyl-2-pyrrolidone 4.2 g In a plastic sealed container, and mixing and stirring in the same manner as in Example 1.
- the ratio of the water-insoluble inorganic compound (talc + alumina) to the total nonvolatile components was 60.2% by weight, and the nonvolatile components were A uniform dispersion for an incombustible film having a ratio of 31.2% by weight was obtained.
- Example 1 with the exception that the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m.
- a non-combustible film having a thickness of 100 ⁇ m was obtained, which was composed of talc, alumina, and polyimide resin, and the ratio of the water-insoluble inorganic compound (talc + alumina) to the total weight was 60.2% by weight.
- Example 7 1.6 g of talc (manufactured by Nippon Talc Co., Ltd., “Talc MS-K”) and N-methyl-2-pyrrolidone solution of 18.6 wt% polyamic acid (manufactured by Ube Industries, Ltd., “U-Varnish A”) 20 0.0 g (polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g) was placed in a plastic closed container and mixed and stirred in the same manner as in Example 1 so that the ratio of talc to the total nonvolatile components was 30.2.
- Example 1 A uniform non-flammable film dispersion having a weight percentage of 24.5% by weight of non-volatile components relative to the total amount of the dispersion was obtained.
- Example 1 except that the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m.
- a non-combustible film having a thickness of 90 ⁇ m was obtained which was made of talc and polyimide resin, and the ratio of talc to the total weight was 30.2% by weight.
- Example 8 14.9 g of talc (manufactured by Nippon Talc Co., Ltd., “Talc MS-K”) and N-methyl-2-pyrrolidone solution of 18.6% by weight polyamic acid (manufactured by Ube Industries, Ltd., “U-Varnish A”) 20 0.0 g (polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g) and N-methyl-2-pyrrolidone 11.3 g were placed in a plastic airtight container and mixed and stirred in the same manner as in Example 1.
- a uniform nonflammable film dispersion was obtained in which the ratio of talc to the total amount of non-volatile components was 80.1% by weight and the ratio of the non-volatile components to the total amount of the dispersion was 40.3% by weight.
- Example 1 except that the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m.
- a non-combustible film having a thickness of 90 ⁇ m was obtained which consisted of talc and polyimide resin, and the ratio of talc to the total weight was 80.1% by weight.
- Example 9 5.6 g of Kaolin (Imeris, “XP01-6100”) and 20.0 g of N-methyl-2-pyrrolidone solution of 18.6 wt% polyamic acid (“U-Vanice A”, Ube Industries) (3.7 g of polyamic acid, 16.3 g of N-methyl-2-pyrrolidone) and 2.8 g of N-methyl-2-pyrrolidone were placed in a plastic sealed container, and mixed and stirred in the same manner as in Example 1 to make it completely non-volatile.
- Kaolin Imeris, “XP01-6100”
- N-methyl-2-pyrrolidone solution of 18.6 wt% polyamic acid (“U-Vanice A”, Ube Industries)
- Polyamic acid 16.3 g of N-methyl-2-pyrrolidone
- 2.8 g of N-methyl-2-pyrrolidone were placed in a plastic sealed container, and mixed and stirred in the same manner as in Example 1 to make it completely non-vola
- a uniform non-flammable film dispersion was obtained in which the ratio of the water-insoluble inorganic compound to the components was 60.2% by weight and the ratio of the non-volatile components to the total amount of the dispersion was 32.7% by weight.
- Example 1 with the exception that the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m.
- an incombustible film having a thickness of 110 ⁇ m was obtained which was made of kaolin and polyimide resin, and the ratio of the water-insoluble inorganic compound to the total weight was 60.2% by weight.
- Example 10 (Example 10) 5.6 g of non-swelling mica (Yamaguchi Mica, “SJ-010”) and 18.6% by weight polyamic acid in N-methyl-2-pyrrolidone (Ube Industries, “U-Varnish A”) ) 20.0 g (polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g) and N-methyl-2-pyrrolidone 3.2 g were placed in a plastic sealed container and mixed and stirred in the same manner as in Example 1.
- Example 1 with the exception that the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m. Similarly, a non-combustible film having a thickness of 100 ⁇ m was obtained, which was composed of non-swellable mica and polyimide resin, and the ratio of the water-insoluble inorganic compound to the total weight was 60.2% by weight.
- Example 11 5.6 g of alumina (“A-42-2” manufactured by Showa Denko KK) and N-methyl-2-pyrrolidone solution of 18.6 wt% polyamic acid (“U-Varnish A” manufactured by Ube Industries, Ltd.) 20.0 g (polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g) and N-methyl-2-pyrrolidone 1.2 g are placed in a plastic sealed container and mixed and stirred in the same manner as in Example 1.
- A-42-2 manufactured by Showa Denko KK
- N-methyl-2-pyrrolidone solution of 18.6 wt% polyamic acid (“U-Varnish A” manufactured by Ube Industries, Ltd.) 20.0 g (polyamide acid 3.7 g, N-methyl-2-pyrrolidone 16.3 g) and N-methyl-2-pyrrolidone 1.2 g are placed in a plastic sealed container and mixed and stirred in the same manner as in Example 1.
- a uniform non-flammable film dispersion was obtained in which the ratio of the water-insoluble inorganic compound to the total nonvolatile components was 60.2% by weight and the ratio of the nonvolatile components to the total amount of the dispersion was 34.7% by weight.
- Example 1 with the exception that the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so that the thickness was 700 ⁇ m.
- an incombustible film having a thickness of 110 ⁇ m was obtained which was made of alumina and polyimide resin, and the ratio of the water-insoluble inorganic compound to the total weight was 60.2% by weight.
- Example 12 Synthesis of polyamic acid varnish
- a 200 mL reaction vessel equipped with a stirrer and a thermometer was charged with 6.49 g (0.030 mol) of 3,3′-dihydroxybenzidine and 126.9 g of N, N-dimethylacetamide and dissolved at room temperature. .
- the mixture was cooled to 0 ° C., and 1.96 g (0.0090 mol) of pyromellitic anhydride and 6.18 g (0.021 mol) of biphenyltetracarboxylic dianhydride were added at 0 to 10 ° C. over 2 hours. And stirred for 30 minutes. Thereafter, the mixture was stirred at room temperature for 24 hours to obtain 141.5 g of a polyamic acid varnish having a concentration of 10.2%.
- the obtained dispersion for incombustible film was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so as to have a thickness of 1000 ⁇ m.
- the polyethylene terephthalate sheet With the polyethylene terephthalate sheet kept horizontal, it was dried in a forced air oven at 80 ° C. for 2 hours to form a film on the polyethylene terephthalate sheet.
- This film was peeled from the polyethylene terephthalate sheet, and in order, heat-treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 1 hour, consisting of talc and polybenzoxazole resin, A 70 ⁇ m-thick incombustible film having a talc to weight ratio of 60.1% by weight was obtained.
- the obtained incombustible film dispersion was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so as to have a thickness of 600 ⁇ m. With the polyethylene terephthalate sheet kept horizontal, it was dried in a forced air oven at 80 ° C. for 2 hours to form a film on the polyethylene terephthalate sheet. The film was peeled from the polyethylene terephthalate sheet, and heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 1 hour to produce talc, polybenzoxazole resin and polyimide resin. A non-combustible film having a thickness of 60 ⁇ m was obtained, in which the ratio of talc to the total weight was 59.8% by weight.
- the ratio of talc to the total nonvolatile components is 90.7 wt%, and the ratio of the nonvolatile components to the total amount of the dispersion
- a uniform nonflammable film dispersion having a weight of 48.0% by weight was obtained.
- the obtained dispersion for incombustible film was applied to a polypropylene sheet having a flat bottom and a rectangular bottom using a doctor blade so as to have a thickness of 250 ⁇ m. With the polypropylene sheet kept horizontal, it was dried in a forced air oven at 50 ° C. for 10 hours to form a film on the polypropylene sheet.
- This film was peeled from the polypropylene sheet and, in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 30 minutes, and consisted of talc and polyimide resin.
- a 70 ⁇ m-thick incombustible film having a talc ratio of 90.7% by weight was obtained.
- polypropylene sheet With the polypropylene sheet kept horizontal, it was dried in a forced air oven at 50 ° C. for 10 hours to form a film on the polypropylene sheet. This film was peeled from the polypropylene sheet and, in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 30 minutes to have a thickness of 80 ⁇ m containing no water-insoluble inorganic compound. A polyimide resin film was obtained.
- the mode (2200 rpm) was performed for 10 minutes and stirred to obtain a dispersion in which the ratio of talc to the total nonvolatile components was 62.5% by weight and the ratio of the nonvolatile components to the total amount of the dispersion was 36.9% by weight.
- the obtained dispersion was applied to a polypropylene sheet having a flat bottom surface and a rectangular bottom surface using a doctor blade so as to have a thickness of 500 ⁇ m. With the polypropylene sheet kept horizontal, it was dried in a forced air oven at 50 ° C. for 10 hours to form a film on the polypropylene sheet. The film is peeled from the polypropylene sheet, and is sequentially heat treated at 120 ° C. for 30 minutes and 150 ° C. for 60 minutes, and is made of talc and nylon resin. The thickness is 62.5% by weight based on the total weight of talc. A 120 ⁇ m white film was obtained.
- the obtained incombustible film dispersion was applied to a polyethylene terephthalate sheet having a flat bottom and a rectangular bottom using a doctor blade so as to have a thickness of 500 ⁇ m.
- a polyethylene terephthalate sheet With the polyethylene terephthalate sheet kept horizontal, it was dried in a forced air oven at 80 ° C. for 2 hours to form a film on the polyethylene terephthalate sheet.
- This film was peeled off from the polyethylene terephthalate sheet and, in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, and 200 ° C. for 1 hour, and consisted of talc and polyimide resin.
- VTM-0 is the highest flammability classification, and flame retardancy decreases as VTM-1 and VTM-2. However, those not corresponding to any of the ranks of VTM-0 to VTM-2 were rejected.
- the nonflammable film obtained by the comparative example 4 and the comparative example 6 as a result of implementing the VTM test similarly, it was disqualified.
- V test Vertical combustion test
- the obtained incombustible film was subjected to a vertical combustion test (V test) according to the UL94 standard.
- V test vertical combustion test
- the size of the flame was 20 mm.
- the flame contact time was 10 seconds, and the after flame time after the flame contact was measured.
- the second flame contact was performed for 10 seconds, and the afterflame time after the flame contact was measured in the same manner as the first time. Furthermore, it was also evaluated at the same time whether or not the cotton placed under the test piece ignites due to the falling fire type.
- the flammability classification was determined according to the UL-94V standard from the first and second burning times and the presence or absence of ignition of cotton.
- V-0 is the highest combustibility classification, and the flame retardance decreases as V-1 and V-2.
- those not corresponding to any of the ranks V-0 to V-2 were rejected.
- the nonflammable film obtained by the comparative example 4 and the comparative example 6 as a result of implementing the V test similarly, it was disqualified.
- the obtained incombustible film was subjected to a 125 mm vertical combustion test (5 V test) according to the UL94 standard.
- a test piece (length 127 mm, width 13 mm) was used.
- the size of the flame was 125 mm.
- the flame contact time was 5 seconds, and the afterflame time after the flame contact was measured.
- the second flame contact was performed for 5 seconds, and the afterflame time after the flame contact was measured in the same manner as the first time. This was repeated 5 times. Furthermore, it was also evaluated at the same time whether or not the cotton placed under the test piece ignites due to the falling fire type.
- the flammability classification was determined according to the UL-94, 5V standards from the 1st to 5th combustion time and the presence or absence of cotton ignition. About what passed these, the flat plate combustion test was done further. In the evaluation of the flat plate combustion test, a flat plate test piece (length 150 mm, width 150 mm) was used. The size of the flame was 125 mm. The flame contact time was 5 seconds, and at the same time that the fire was extinguished, the second flame contact was performed for 5 seconds, and this was repeated 5 times. After the flame contact, the presence or absence of perforation of the flat plate test piece was confirmed. Evaluation was made with 5V-A for those without holes and 5V-B for those with holes.
- a short test piece (length: 257 mm, width: 182 mm) made from a non-combustible film obtained in accordance with the Ministry of Land, Infrastructure, Transport and Tourism Ordinance No. 151 “Rules for Establishing Technical Standards for Railways”
- the side of the fuel container (made of iron, thickness 0.8 mm, diameter 17.5 mm, height 7.1 mm) is held at an angle of 45 ° so that the sides are up and down. Place on a table so that the vertical position is 25.4 mm, place 0.5 mL of pure ethyl alcohol, ignite, and let stand until the fuel burns, and flammability is divided into alcohol combustion and after combustion.
- test piece was not ignited, emits little smoke, and the color change does not reach the edge of the test piece after the combustion of ethyl alcohol, it is considered “extremely flame retardant”. It was determined as “nonflammable”.
- a test piece having a width of 5 mm and a length of 10 mm was prepared from the obtained noncombustible film, and using a TMA apparatus (manufactured by Shimadzu Corporation, “TMA-60”) under the conditions of a tensile mode and a load of 1.0 g, The temperature was raised from room temperature at 10 ° C./min, maintained at 350 ° C. for 30 minutes, and then cooled at 10 ° C./min. After cooling, the heat shrinkage rate was measured from the change in the stretch rate before and after the temperature rise at 60 ° C. In addition, about the polyimide resin film obtained by the comparative example 3, it was 1.6% as a result of measuring a thermal contraction rate similarly.
- Linear expansion coefficient A test piece having a width of 5 mm and a length of 10 mm was prepared from the obtained incombustible film, and using a TMA apparatus (manufactured by Shimadzu Corporation, “TMA-60”), a tensile mode, a load of 1.0 g, 10 ° C. / The linear expansion coefficient at 50 to 250 ° C. was measured under the conditions of minutes.
- the linear expansion coefficient of the polyimide resin film obtained in Comparative Example 3 was measured in the same manner and found to be 3.5 ⁇ 10 ⁇ 5 K ⁇ 1 .
- the obtained non-combustible film was subjected to a bending resistance (cylindrical mandrel method) test by a method based on JIS-K5600-5-1.
- a bending resistance (cylindrical mandrel method) test by a method based on JIS-K5600-5-1.
- a mandrel having a diameter of 1 to 5 mm was used, and one mandrel was tested in order from a large diameter mandrel to a small mandrel, and the mandrel diameter at which film cracking or cracking first occurred was shown.
- the film in which no crack was generated even with a 1 mm mandrel was set to 1 mm or less.
- the nonflammable film obtained in the comparative example 2 it was 25 mm as a result of implementing the bending resistance test similarly.
- the tear strength of the obtained noncombustible film was measured by a measuring method based on JIS K7128-1. A non-combustible film was cut to a sample size of 150 mm ⁇ 50 mm, and further, 75 mm was cut in the longitudinal direction from the center portion of the cut non-combustible film to produce a slit. Using a tabletop precision universal testing machine (“AGS-J” manufactured by Shimadzu Corporation), the tear propagation resistance value was measured at a tear rate of 200 mm / min. The tear propagation resistance value was determined by excluding 20 mm at the start of tearing and 5 mm before the end of tearing, and calculating the average value of the tear strength of the remaining 50 mm. The number of measurements was 5 per example, and the average value of the respective values (a1 to a5) was calculated to obtain the desired tear strength.
- Test piece having a width of 40 mm was prepared from the obtained non-combustible film, and was pulled using a desktop precision universal testing machine (“AGS-J” manufactured by Shimadzu Corporation) under the conditions of a grip interval of 40 mm and a pulling speed of 200 mm / min. A test was conducted and the breaking strength was measured.
- the dielectric breakdown voltage was measured by a method based on JIS C2110. An aluminum foil electrode having a thickness of 100 ⁇ m and a 10 cm square is used as the anode, and a brass 25 mm ⁇ electrode is used as the cathode. A non-combustible film is sandwiched between them, and a DC high-voltage stabilized power source (manufactured by Kasuga Electric Co., Ltd.) is used. A voltage was applied while boosting, and the case where current flowed 10 mA or more was assumed to be dielectric breakdown. The value obtained by dividing the voltage at that time by the film thickness at the measurement point was taken as the dielectric breakdown strength, and was shown as the median value when five points were measured.
- Moisture absorption rate (% by weight) ((W 2 ⁇ W 0 ) / W 0 ) ⁇ 100
- the obtained incombustible film was placed in a constant temperature and humidity chamber maintained at 85 ° C. and 85% RH and allowed to stand. After the time shown in Table 1 had elapsed, the film was taken out and the appearance and the like were confirmed. As a result, the weather resistance was evaluated as “ ⁇ ” when no discoloration or peeling was observed on the surface or cross section, and “X” when discoloration or peeling was observed on the surface or cross section.
- Example 14 The dispersion for an incombustible film obtained in Example 1 was applied to a polypropylene sheet having a flat bottom surface and a rectangular bottom surface using a doctor blade so as to have a thickness of 300 ⁇ m. With the polypropylene sheet kept horizontal, it was dried in a forced air oven at 50 ° C. for 10 hours to form a film on the polypropylene sheet. On the film formed on this polypropylene sheet, the nonflammable film dispersion obtained in Example 1 was again applied using a doctor blade so that the thickness was 300 ⁇ m. With the polypropylene sheet kept horizontal, it was dried in a forced air oven at 50 ° C. for 10 hours to form a film on the polypropylene sheet.
- This film was peeled from the polypropylene sheet and, in order, heat treated at 120 ° C. for 30 minutes, 150 ° C. for 5 minutes, 200 ° C. for 5 minutes, and 350 ° C. for 30 minutes, and consisted of talc and polyimide resin. A 120 ⁇ m-thick incombustible film having a talc ratio of 61.9% by weight was obtained.
- thermocompression-bonded plate The EVA protruding from the edge of the thermocompression-bonded plate was peeled off with an electric cutter, and an aluminum frame in which a sealing material (“SH780 sealant” manufactured by Toray Dow Corning Co., Ltd.) was poured into the groove was fitted into the four corners of the plate. It was attached with screws and air dried at room temperature to seal the end face. After drying the sealing material, a terminal box (manufactured by Onamba Co., Ltd.) was attached on the back sheet so as to cover the attachment terminal portion, and was naturally dried at room temperature, and then the attachment terminal was soldered to the terminal box.
- a sealing material (“SH780 sealant” manufactured by Toray Dow Corning Co., Ltd.) was poured into the groove was fitted into the four corners of the plate. It was attached with screws and air dried at room temperature to seal the end face.
- a terminal box manufactured by Onamba Co., Ltd. was attached on the back sheet so as to cover the attachment terminal portion, and was naturally dried at room temperature
- potting agent manufactured by Toray Dow Corning, PV-7321
- a terminal box a mixture of a base agent and a curing agent in a ratio of 10: 1
- a cover of the terminal box was attached to complete the solar cell module.
- the photograph of the (a) front surface and (b) back surface of the produced solar cell module is shown in FIG.
- the curve factor (FF) value of the module was about 0.7 in the IV characteristic evaluation, and it was confirmed that the solar cell module had no problem as a solar cell.
- the nonflammable film which is excellent in a softness
- a non-combustible film dispersion used for the production of the non-combustible film a non-combustible film production method using the non-combustible film dispersion, a solar battery backsheet using the non-combustible film, and A flexible substrate
- the solar cell using this solar cell backsheet can be provided.
- the non-combustible film of the present invention is a film having sufficient mechanical strength and excellent flexibility and non-combustibility, such as various electrical materials and mechanical materials, such as capacitor dielectrics, various sensor substrates, It can be used as an insulating film for batteries, an insulating film for capacitors, various laminates, release films, non-combustible fabrics, non-combustible building materials, industrial packing, and the like. We can provide new materials in these fields and contribute to the development of new technologies.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
不燃フィルムとしては、例えば、フッ素樹脂を用いたフィルムや薄板ガラスが開発されているが、フッ素樹脂は高価である上、熱膨張係数が大きいため寸法安定性に乏しく、更に最高使用温度が200℃前後と低く、高温での使用ができないという欠点がある。また、薄板ガラスは安価で耐熱性や耐湿性は非常に優れるものの、柔軟性が充分ではない。
また、ポリイミド樹脂に粘土等の無機化合物を用いたフィルムが報告されているが、無機化合物は一般的にポリイミド樹脂と均一に混合されず、無機化合物が分離するため均一なフィルムが得られない。特許文献1~4には、ポリイミドと無機化合物の均一な分散液を得るために、添加物として粘土の層間イオンを有機イオンに交換したものを調製して作製したフィルムが開示されているが、粘土に有機物を含むため、作製されたフィルムは耐熱性が低く、炎にさらすと燃焼するという欠点がある。
以下に本発明を詳述する。
なお、本発明において前記「水不溶性」とは、20℃の水100mlへの溶解度が1.0g未満であるものをいう。
前記シリカ化合物としては、ワラステナイト、ガラスビーズ等が挙げられる。
前記アルミニウム化合物としては、例えば、スピネル、水酸化アルミニウム、酸化アルミニウム(アルミナ)、ホウ酸アルミニウム等が挙げられる。前記アルミニウム化合物は、得られる不燃フィルムの線膨張係数を低くする観点から、前記層状ケイ酸塩鉱物と併用することが好ましく、タルクと併用することがより好ましく、前記アルミニウム化合物としてアルミナを用い、かつ、タルクと併用することが更に好ましい。
前記カルシウム化合物としては、例えば、炭酸カルシウム等が挙げられる。
前記窒化物としては、例えば、窒化ケイ素、窒化ホウ素等が挙げられる。
前記水不溶性無機化合物は、単独で用いてもよいし、2種以上を併用してもよい。
前記水不溶性無機化合物の平均粒子径の好ましい下限は0.1μm、好ましい上限は50μmである。前記水不溶性無機化合物の平均粒子径が0.1μm未満であると、得られる不燃フィルムの機械的強度が弱くなることがある。前記水不溶性無機化合物の平均粒子径が50μmを超えると、得られる不燃フィルムが表面の平坦性に劣るものとなることがある。前記水不溶性無機化合物の平均粒子径のより好ましい下限は0.2μm、より好ましい上限は20μm、更に好ましい下限は0.5μm、更に好ましい上限は15μmである。
なお、前記水不溶性無機化合物の平均粒子径は、レーザー回折式粒度分布計等を用いて粒度分布を測定することにより求めることができる。
本発明の不燃フィルムの比誘電率は、用途にもよるが、例えば、フレキシブルプリント基板に用いる場合は4以下が好ましく、3以下がより好ましく、2.5以下が更に好ましい。
前記耐熱性合成樹脂は、スーパーエンジニアリングプラスチック(スーパーエンプラ)を指し、例えば、ポリイミド樹脂、ポリアミドイミド樹脂、フッ素樹脂、ポリフェニレンスルフィド樹脂、ポリスルホン樹脂、ポリアリレート樹脂、ポリエーテルスルホン樹脂、ポリエーテルイミド樹脂、ポリエーテルエーテルケトン樹脂、ポリベンゾオキサゾール樹脂、ポリベンゾイミダゾール樹脂等が挙げられる。なかでも、製膜性、耐熱性、及び、機械的強度に優れることから、ポリイミド樹脂、ポリアミドイミド樹脂、及び、ポリベンゾオキサゾール樹脂からなる群より選択される少なくとも1種が好適に使用される。
なお、耐熱性の観点から、前記耐熱性合成樹脂は、シクロヘキサン環等の飽和環式炭化水素を含まない構造であることが好ましい。得られる不燃フィルムが特に耐熱性に優れるものとなることから、前記耐熱性合成樹脂は、芳香環を含む構造であることがより好ましく、芳香族ポリイミド樹脂、芳香族ポリアミドイミド樹脂、及び、芳香族ポリベンゾオキサゾール樹脂からなる群より選択される少なくとも1種であることが更に好ましい。
また、水蒸気透過度を減少させる観点から、ポリベンゾオキサゾール樹脂を含むことが好ましい。
また、前記耐熱性合成樹脂は、前記ポリイミド樹脂、前記ポリベンゾオキサゾール樹脂、及び、前記ポリアミドイミド樹脂の少なくとも2種からなる共重合体でもよい。
前記シラン系カップリング剤としては、例えば、アミノ系シランカップリング剤、ウレイド系シランカップリング剤、ビニル系シランカップリング剤、メタクリル系シランカップリング剤、エポキシ系シランカップリング剤、メルカプト系シランカップリング剤及びイソシアネート系シランカップリング剤等が挙げられる。
前記チタネート系カップリング剤としては、例えば、少なくとも炭素数1~60のアルキレート基を有するチタネート系カップリング剤、アルキルホスファイト基を有するチタネート系カップリング剤、アルキルホスフェート基を有するチタネート系カップリング剤もしくはアルキルパイロホスフェート基を有するチタネート系カップリング剤等が挙げられる。
前記カップリング剤は、事前に水不溶性無機化合物と混合させて作用させておいてもよいし、後述する不燃性フィルム用分散液に混合しても良い。
また、本発明の不燃フィルムの厚みは、250μm以下であることが好ましい。不燃フィルムの厚みが250μmより大きいと、硬くなり曲げ強度が低下することがある。不燃フィルムの厚みは200μm以下であることがより好ましい。
本発明の不燃フィルムにおいて、UL94規格VTM試験を行う際のフィルム厚みは100μm以下であることが好ましく、80μm以下であることがより好ましい。
なお、本明細書において前記引裂強度は、JIS K7128-1に準拠した測定法によって求められる値である。
なお、本明細書において前記引っ張り強度は、JIS K7127-1に準拠した測定法によって求められる値であり、引っ張り強度試験機を用い、つかみ間隔80mm、引っ張り速度20mm/分の条件で測定される。
本発明者らは、不揮発成分の含有量、及び、不揮発成分中の水不溶性無機化合物の含有割合が特定の範囲内にある分散液を用いることにより、従来は困難であった、柔軟性及び耐湿性に優れ、高い機械的強度を有する不燃フィルム(本発明の不燃フィルム)を製造することができることを見出した。
また、本発明の不燃フィルムの製造方法では、安価な水不溶性無機化合物を用いることができ、更に、分散液から揮発させる分散媒の量を少なくすることができるため、生産性も高い。
なお、本明細書において前記「不揮発成分」とは、常圧で沸点を持たない、又は、沸点が300℃以上のものを指す。本発明の不燃フィルム用分散液における水不溶性無機化合物、耐熱性合成樹脂については、本発明の不燃フィルムと同様のものであるため、その説明を省略する。
前記耐熱性合成樹脂の前駆体としては、例えば、ポリアミド酸が挙げられ、該ポリアミド酸をイミド化又はオキサゾール化することにより、ポリイミド樹脂、ポリアミドイミド樹脂又はポリベンゾオキサゾール樹脂が得られる。前記ポリアミド酸をイミド化又はオキサゾール化する方法としては、例えば、ポリアミド酸を加熱閉環してイミド化又はオキサゾール化する方法、ポリアミド酸を化学閉環してイミド化する方法、ポリイミド酸を化学閉環してイミド化した後、更に加熱しオキサゾール化する方法が挙げられる。
本発明の不燃フィルム用分散液における前記水不溶性無機化合物の含有量の上限は、不揮発成分の全重量に対して90重量%である。前記水不溶性無機化合物の含有量が90重量%を超えると、得られるフィルムが機械的強度に劣るものとなる。前記水不溶性無機化合物の含有量の好ましい上限は85重量%、より好ましい上限は80重量%、更に好ましい上限は70重量%である。
本発明の不燃フィルム用分散液における不揮発成分の割合は、熱重量測定(TG)や示差熱-熱重量同時測定(TG-DTA)やエバポレーター等を用いて真空蒸発により溶媒を除去し、残存した固形物の重量から求めることができる。
不燃フィルム用分散液に耐熱性合成樹脂の前駆体を配合した場合は、得られたフィルムを更に電気炉等を使用し加熱することにより、不燃フィルムを得ることができる。具体的には例えば、耐熱性合成樹脂の前駆体としてポリアミド酸を配合した場合、前記で得られたフィルムを120~400℃で0.5~10時間熱処理することにより、不燃フィルムを得ることができる。
前記積層体を構成する各層のフィルムは同一であってもよいし、異なっていてもよい。
なお、前記積層体の各層のフィルムにおいて、水不溶性無機化合物の含有量は特に限定されない。即ち、積層体の全重量に対して水不溶性無機化合物の含有量が不燃フィルム30重量%以上90重量%以下であり、かつ、積層体に対するUL94規格VTM試験において、燃焼性分類がVTM-0であれば、本発明の不燃フィルムとして問題なく使用できる。
このような積層体としては、例えば、水不溶性無機化合物を含有するポリイミドフィルムの両面に、水不溶性無機化合物を含有しないポリイミドフィルムを積層させることにより、柔軟性を向上させた積層体等が挙げられる。
図1に示すように、本発明の太陽電池1は、光起電力により光エネルギーを電気エネルギーに変換する太陽電池素子2を有しており、該太陽電池素子2は封止剤3によって封止されている。また、本発明の太陽電池1は、太陽光を受ける側の表面に光透過性基板4を有し、光透過性基板4と反対側の面に、本発明の太陽電池バックシート5を有する。
上記光透過性基板4の材料としては、ポリエステル樹脂、フッ素樹脂、アクリル樹脂、エチレン-酢酸ビニル共重合体等からなる樹脂製の基板や、ガラス基板等が挙げられ、なかでも、耐候性及び耐衝撃性に優れ、安価に作製することができることからガラス基板が好ましい。また、特に耐侯性が優れることから、フッ素樹脂も好適に用いられる。
(不燃フィルム用分散液の調製)
タルク(日本タルク社製、「タルクMS-K」)6.0g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が61.9重量%、分散液の全体量に対する不揮発成分の割合が37.3重量%である均一な不燃フィルム用分散液を得た。
なお、「U-ワニスA」に含まれるポリアミド酸は、下記式(8)の繰り返し構造単位を有する芳香族系ポリアミド酸である。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリプロピレン製シートに、ドクターブレードを用いて厚みが400μmとなるように塗布した。ポリプロピレン製シートを水平に保った状態で、強制送風式オーブンで50℃の温度条件で10時間乾燥して、ポリプロピレン製シート上にフィルムを形成した。このフィルムをポリプロピレン製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で30分熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が61.9重量%である厚さ80μmの不燃フィルムを得た。
タルクの配合量を2.7gとしたこと以外は実施例1と同様にして、全不揮発成分に対するタルクの割合が42.2重量%、分散液の全体量に対する不揮発成分の割合が28.2重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を用い、実施例1と同様にして、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が42.2重量%である厚さ80μmの不燃フィルムを得た。
(不燃フィルム用分散液1の調製)
タルク(日本タルク社製、「タルクMS-K」)3.0g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)37.6g(ポリアミド酸7.0g、N-メチル-2-ピロリドン30.6g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って攪拌し、全不揮発成分に対するタルクの割合が30.0重量%、分散液の全体量に対する不揮発成分の割合が24.6重量%である均一な不燃フィルム用分散液1を得た。
タルク(日本タルク社製、「タルクMS-K」)6.0g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)21.5g(ポリアミド酸4.0g、N-メチル-2-ピロリドン17.5g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って攪拌し、全不揮発成分に対するタルクの割合が60.0重量%、分散液の全体量に対する不揮発成分の割合が36.4重量%である均一な不燃フィルム用分散液2を得た。
得られた不燃フィルム用分散液1を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが100μmとなるように塗布した。ポリエチレンテレフタレート製シートを水平に保った状態で、強制送風式オーブンで120℃の温度条件で1時間乾燥した。次に該シートをオーブンより取り出し、不燃フィルム用分散液2を該シートの不燃フィルム用分散液1が塗布された面上にドクターブレードを用いて厚みが400μmとなるように塗布、積層した。該シートを水平に保った状態で、強制送風式オーブンで140℃の温度条件で2時間乾燥した。次に該シートをオーブンより取り出し、不燃フィルム用分散液1を該シートの不燃フィルム用分散液2が塗布された面上にドクターブレードを用いて厚みが100μmとなるように塗布した。該シートを水平に保った状態で、強制送風式オーブンで150℃の温度条件で1時間乾燥し、ポリエチレンテレフタレート製シート上にフィルムを形成した。このフィルムをポリエチレンテレフタレート製シートから剥離し、順に、200℃で5分、350℃で30分熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が50.0重量%である厚さ120μmの不燃フィルムを得た。得られた不燃フィルムは、層の重量に対するタルクの割合が30.0重量%である厚さ20μmの第1層と、層の重量に対するタルクの割合が60.0重量%である厚さ80μmの第2層と、層の重量に対するタルクの割合が30.0重量%である厚さ20μmの第3層との3つの層を積層させたものであり、各層が一体化したものである。
(ポリアミド酸ワニスの合成)
撹拌機及び温度計を備えた2L容の反応容器に4,4-ジアミノジフェニルエーテル70.1g(0.35モル)、p-フェニレンジアミン37.8g(0.35モル)、及び、N,N-ジメチルアセトアミド1273.9gを仕込み、50℃で溶解させた。次いで、反応容器に無水ピロメリット酸152.7g(0.70モル)を、温度を45~50℃に保ちながら、2時間かけて添加した。同温度で30分間撹拌した後、4.2重量%の無水フタル酸のN,N-ジメチルアセトアミド溶液7.4g(0.002モル)を加えて反応を停止させ、濃度16.9%、粘度5.8Pa・sのポリアミド酸ワニス1541.9gを得た。
タルク(日本タルク社製、「タルクMS-K」)7.0g、及び、合成したポリアミド酸ワニス17.8g(ポリアミド酸3.0g、N,N-ジメチルアセトアミド14.8g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が70.0重量%、分散液の全体量に対する不揮発成分の割合が40.3重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが500μmとなるように塗布した。ポリエチレンテレフタレート製シートを水平に保った状態で、強制送風式オーブンで80℃の温度条件で2時間乾燥して、ポリエチレンテレフタレート製シート上にフィルムを形成した。このフィルムをポリエチレンテレフタレート製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で1時間熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が70.0重量%である厚さ110μmの不燃フィルムを得た。
(ポリアミド酸ワニスの合成)
撹拌機及び温度計を備えた2L容の反応容器に4,4-ジアミノジフェニルエーテル140.1g(0.70モル)、及び、N,N-ジメチルアセトアミド1603.0gを仕込み、50℃で溶解させた。次いで、反応容器に無水ピロメリット酸74.5g(0.34モル)、3,3’,4,4’-ビフェニルテトラカルボン酸二無水物99.8g(0.34モル)を、温度を45~50℃に保ちながら、2時間かけて添加した。同温度で60分間撹拌した後、4.2重量%の無水フタル酸のN,N-ジメチルアセトアミド溶液7.4g(0.002モル)を加えて反応を停止させ、濃度16.3%、粘度5.8Pa・sのポリアミド酸ワニス1924.8gを得た。
タルク(日本タルク社製、「タルクMS-K」)6.1g、及び、合成したポリアミド酸ワニス25.0g(ポリアミド酸4.1g、N,N-ジメチルアセトアミド20.9g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が59.8重量%、分散液の全体量に対する不揮発成分の割合が32.8重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが700μmとなるように塗布した。ポリエチレンテレフタレート製シートを水平に保った状態で、強制送風式オーブンで80℃の温度条件で2時間乾燥して、ポリエチレンテレフタレート製シート上にフィルムを形成した。このフィルムをポリエチレンテレフタレート製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で1時間熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が59.8重量%である厚さ90μmの不燃フィルムを得た。
タルク(日本タルク社製、「タルクMS-K」)2.8g、アルミナ(昭和電工社製、「A-42-2」)2.8g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)、N-メチル-2-ピロリドン4.2gをプラスチック製密閉容器にとり、実施例1と同様に混合と撹拌を行い、全不揮発成分に対する水不溶性無機化合物(タルク+アルミナ)の割合が60.2重量%、分散液の全体量に対する不揮発成分の割合が31.2重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが700μmとなるように塗布したこと以外は実施例1と同様にして、タルクとアルミナとポリイミド樹脂とからなり、全重量に対する水不溶性無機化合物(タルク+アルミナ)の割合が60.2重量%である厚さ100μmの不燃フィルムを得た。
タルク(日本タルク社製、「タルクMS-K」)1.6g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)をプラスチック製密閉容器にとり、実施例1と同様に混合と撹拌を行い、全不揮発成分に対するタルクの割合が30.2重量%、分散液の全体量に対する不揮発成分の割合が24.5重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みを700μmとなるように塗布したこと以外は実施例1と同様にして、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が30.2重量%である厚さ90μmの不燃フィルムを得た。
タルク(日本タルク社製、「タルクMS-K」)14.9g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)、N-メチル-2-ピロリドン11.3gをプラスチック製密閉容器にとり、実施例1と同様に混合と撹拌を行い、全不揮発成分に対するタルクの割合が80.1重量%、分散液の全体量に対する不揮発成分の割合が40.3重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みを700μmとなるように塗布したこと以外は実施例1と同様にして、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が80.1重量%である厚さ90μmの不燃フィルムを得た。
カオリン(イメリス社製、「XP01-6100」)5.6g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)、N-メチル-2-ピロリドン2.8gをプラスチック製密閉容器にとり、実施例1と同様に混合と撹拌を行い、全不揮発成分に対する水不溶性無機化合物の割合が60.2重量%、分散液の全体量に対する不揮発成分の割合が32.7重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが700μmとなるように塗布したこと以外は実施例1と同様にして、カオリンとポリイミド樹脂とからなり、全重量に対する水不溶性無機化合物の割合が60.2重量%である厚さ110μmの不燃フィルムを得た。
非膨潤性雲母(ヤマグチマイカ社製、「SJ-010」)5.6g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)、N-メチル-2-ピロリドン3.2gをプラスチック製密閉容器にとり、実施例1と同様に混合と撹拌を行い、全不揮発成分に対する水不溶性無機化合物の割合が60.2重量%、分散液の全体量に対する不揮発成分の割合が32.3重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが700μmとなるように塗布したこと以外は実施例1と同様にして、非膨潤性雲母とポリイミド樹脂とからなり、全重量に対する水不溶性無機化合物の割合が60.2重量%である厚さ100μmの不燃フィルムを得た。
アルミナ(昭和電工社製、「A-42-2」)5.6g、及び、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)、N-メチル-2-ピロリドン1.2gをプラスチック製密閉容器にとり、実施例1と同様に混合と撹拌を行い、全不揮発成分に対する水不溶性無機化合物の割合が60.2重量%、分散液の全体量に対する不揮発成分の割合が34.7重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが700μmとなるように塗布したこと以外は実施例1と同様にして、アルミナとポリイミド樹脂とからなり、全重量に対する水不溶性無機化合物の割合が60.2重量%である厚さ110μmの不燃フィルムを得た。
(ポリアミド酸ワニスの合成)
撹拌機及び温度計を備えた200mL容の反応容器に3,3’-ジヒドロキシベンジジン6.49g(0.030モル)、及び、N,N-ジメチルアセトアミド126.9gを仕込み、室温で溶解させた。次いで、0℃に冷却し、無水ピロメリット酸1.96g(0.0090モル)、ビフェニルテトラカルボン酸二無水物6.18g(0.021モル)を0~10℃で2時間かけて添加し、30分撹拌した。その後、室温で24時間撹拌し、濃度10.2%のポリアミド酸ワニス141.5gを得た。
タルク(日本タルク社製、「タルクMS-K」)9.2g、及び、合成したポリアミド酸ワニス60.0g(ポリアミド酸6.1g、N,N-ジメチルアセトアミド53.9g)、N,N-ジメチルアセトアミド15.0gをプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が60.1重量%、分散液の全体量に対する不揮発成分の割合が18.2重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが1000μmとなるように塗布した。ポリエチレンテレフタレート製シートを水平に保った状態で、強制送風式オーブンで80℃の温度条件で2時間乾燥して、ポリエチレンテレフタレート製シート上にフィルムを形成した。このフィルムをポリエチレンテレフタレート製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で1時間熱処理して、タルクとポリベンゾオキサゾール樹脂からなり、全重量に対するタルクの割合が60.1重量%である厚さ70μmの不燃フィルムを得た。
(ポリアミド酸ワニスの合成)
撹拌機及び温度計を備えた200mL容の反応容器に3,3’-ジヒドロキシベンジジン3.24g(0.015モル)、4,4-ジアミノジフェニルエーテル3.00g(0.015モル)、及び、N,N-ジメチルアセトアミド65.8gを仕込み、室温で溶解させた。次いで、0℃に冷却し、無水ピロメリット酸1.96g(0.0090モル)、ビフェニルテトラカルボン酸二無水物6.18g(0.021モル)を0~10℃で2時間かけて添加し、30分撹拌した。その後、室温で24時間撹拌し、濃度17.9%のポリアミド酸ワニス80.2gを得た。
タルク(日本タルク社製、「タルクMS-K」)10.7g、及び、合成したポリアミド酸ワニス40.0g(ポリアミド酸7.2g、N,N-ジメチルアセトアミド32.8g)、N,N-ジメチルアセトアミド18.0gをプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が59.8重量%、分散液の全体量に対する不揮発成分の割合が26.1重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが600μmとなるように塗布した。ポリエチレンテレフタレート製シートを水平に保った状態で、強制送風式オーブンで80℃の温度条件で2時間乾燥して、ポリエチレンテレフタレート製シート上にフィルムを形成した。このフィルムをポリエチレンテレフタレート製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で1時間熱処理して、タルクと、ポリベンゾオキサゾール樹脂とポリイミド樹脂の共重合樹脂からなり、全重量に対するタルクの割合が59.8重量%である厚さ60μmの不燃フィルムを得た。
全不揮発成分に対するタルクの割合が61.7重量%、分散液の全体量に対する不揮発成分の割合が18.0重量%となるように、タルク(日本タルク社製、「タルクMS-K」)6.0g、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g、及び、N-メチル-2-ピロリドン28.0gをプラスチック製密閉容器にとった。振とう機で激しく振とうしたが、静置して数分後にタルクが沈殿し、均一な分散液は得られなかった。
更に実施例1と同様にしてフィルムの作製を試みたが、タルクが沈み均一なフィルムが得られなかった。
タルク(日本タルク社製、「タルクMS-K」)18.5g、18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)10.0g(ポリアミド酸1.9g、N-メチル-2-ピロリドン8.1g)、及び、N-メチル-2-ピロリドン14.0gをプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が90.7重量%、分散液の全体量に対する不揮発成分の割合が48.0重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリプロピレン製シートに、ドクターブレードを用いて厚みが250μmとなるように塗布した。ポリプロピレン製シートを水平に保った状態で、強制送風式オーブンで50℃の温度条件で10時間乾燥して、ポリプロピレン製シート上にフィルムを形成した。このフィルムをポリプロピレン製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で30分熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が90.7重量%である厚さ70μmの不燃フィルムを得た。
18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)50.0g(ポリアミド酸9.3g、N-メチル-2-ピロリドン40.7g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で脱泡モード(2200rpm)を10分間行った。次に底面が平坦であり、底面の形状が長方形であるポリプロピレン製シートに、ドクターブレードを用いて厚みが750μmとなるように塗布した。ポリプロピレン製シートを水平に保った状態で、強制送風式オーブンで50℃の温度条件で10時間乾燥して、ポリプロピレン製シート上にフィルムを形成した。このフィルムをポリプロピレン製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で30分熱処理して、水不溶性無機化合物を含有しない厚さ80μmのポリイミド樹脂フィルムを得た。
タルク(日本タルク社製、「タルクMS-K」)6.0g、及び、18.0重量%N-メトキシメチル化ナイロンのアルコール溶液(ナガセケムテックス社製、「トレジンFS-350」)20.0g(N-メトキシメチル化ナイロン3.6g、アルコール16.4g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が62.5重量%、分散液の全体量に対する不揮発成分の割合が36.9重量%である分散液を得た。
得られた分散液を、底面が平坦であり、底面の形状が長方形であるポリプロピレン製シートに、ドクターブレードを用いて厚みが500μmとなるように塗布した。ポリプロピレン製シートを水平に保った状態で、強制送風式オーブンで50℃の温度条件で10時間乾燥して、ポリプロピレン製シート上にフィルムを形成した。このフィルムをポリプロピレン製シートから剥離し、順に、120℃で30分、150℃で60分熱処理して、タルクとナイロン樹脂からなり、全重量に対するタルクの割合が62.5重量%である厚さ120μmの白色フィルムを得た。
18.6重量%ポリアミド酸のN-メチル-2-ピロリドン溶液(宇部興産社製、「U-ワニスA」)20.0g(ポリアミド酸3.7g、N-メチル-2-ピロリドン16.3g)をプラスチック製密閉容器にとり、全体量が10.0gになるまで60℃のオーブンに入れ溶媒を蒸発させ、37.2重量%のポリアミド酸N-メチル-2-ピロリドン溶液(ポリアミド酸3.7g、N-メチル-2-ピロリドン6.3g)とした。そこへタルク(日本タルク社製、「タルクMS-K」)8.6gを加え、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対する水不溶性無機化合物の割合が69.9重量%、分散液の全体量に対する不揮発成分の割合が66.1重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液は、流動性がほとんどなかったため塗布ができず、フィルムを作製することができなかった。
(ポリアミド酸ワニスの合成)
撹拌機及び温度計を備えた500mL容の反応容器に3,3’,4,4’-ビフェニルテトラカルボン酸二無水物29.4g(0.10モル)、及び、N,N-ジメチルアセトアミド80.8gを仕込み、室温で溶解させた。次いで、0℃に冷却し、4,4-ジアミノジシクロヘキシルメタン21.0g(0.10モル)、及び、N,N-ジメチルアセトアミド37.0gを混合したものを0~25℃で2時間かけて添加した。その後、室温で1週間撹拌し、4.2重量%の無水フタル酸のN,N-ジメチルアセトアミド溶液0.7g(0.0002モル)を加えて反応を停止させ、濃度29.8%、粘度10Pa・sのポリアミド酸ワニス168.9gを得た。
タルク(日本タルク社製、「タルクMS-K」)2.0g、及び、合成したポリアミド酸ワニス20.0g(ポリアミド酸6.0g、N,N-ジメチルアセトアミド14.0g)をプラスチック製密閉容器にとり、自転公転ミキサー(シンキー社製、「ARE-310」)で混合モード(2000rpm)を10分間、脱泡モード(2200rpm)を10分間行って撹拌し、全不揮発成分に対するタルクの割合が25.0重量%、分散液の全体量に対する不揮発成分の割合が36.4重量%である均一な不燃フィルム用分散液を得た。
得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリエチレンテレフタレート製シートに、ドクターブレードを用いて厚みが500μmとなるように塗布した。ポリエチレンテレフタレート製シートを水平に保った状態で、強制送風式オーブンで80℃の温度条件で2時間乾燥して、ポリエチレンテレフタレート製シート上にフィルムを形成した。このフィルムをポリエチレンテレフタレート製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で1時間熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が25.0重量%である厚さ80μmのフィルムを得た。
実施例1~13で得られた不燃フィルムについて以下の評価を行った。結果を表4~6に示した。
なお、フィルムの作製ができなかった比較例1及び比較例5については以下の評価は行わず、比較例6で得られたフィルムについては耐屈曲性の評価を行い、比較例3で得られたフィルムについては熱収縮率及び線膨張係数の評価を行い、比較例4、比較例6で得られたフィルムについてはVTM試験による燃焼性分類及びV試験による燃焼性分類の評価を行った。
得られた不燃フィルムについて、UL94規格による薄手材料垂直燃焼試験(VTM試験)を行った。
表1に示した各判定基準において、各試験片(長さ約200mm、幅50mm)を5枚使用した。炎の大きさは20mmとした。
なお、接炎時間は3秒間とし、接炎後の残炎時間をそれぞれ測定した。また、火が消えると同時に2回目の接炎を3秒間行って、1回目と同様にして、接炎後の残炎時間をそれぞれ測定した。更に、落下する火種により試験片の下に置いた綿が発火するか否かについても同時に評価した。また、標線は試験片の下端から125mmの位置にあり、標識用綿は試験片の下端から300mm下方に配置した。
VTM試験において、燃焼性分類としては、VTM-0が最高のものであり、VTM-1、VTM-2となるに従って難燃性が低下することを示す。ただし、VTM-0~VTM-2のランクのいずれにも該当しないものは不合格とした。
なお、比較例4、比較例6で得られた不燃フィルムについて、同様にしてVTM試験を実施した結果、不合格であった。
得られた不燃フィルムについて、UL94規格による垂直燃焼試験(V試験)を行った。
表2に示した各判定基準において、各試験片(長さ127mm、幅13mm)を5枚使用した。炎の大きさは20mmとした。
なお、接炎時間は10秒間とし、接炎後の残炎時間をそれぞれ測定した。
また、火が消えると同時に2回目の接炎を10秒間行って、1回目と同様にして、接炎後の残炎時間をそれぞれ測定した。更に、落下する火種により試験片の下に置いた綿が発火するか否かについても同時に評価した。
1回目と2回目の燃焼時間、及び綿の発火の有無等から、UL-94V規格に従って燃焼性分類を判定した。V試験において、燃焼性分類としてはV-0が最高のものであり、V-1、V-2となるに従って難燃性が低下することを示す。ただし、V-0~V-2のランクのいずれにも該当しないものは不合格とした。
なお、比較例4、比較例6で得られた不燃フィルムについて、同様にしてV試験を実施した結果、不合格であった。
得られた不燃フィルムについて、UL94規格による125mm垂直燃焼試験(5V試験)を行った。
表3に示した各判定基準において、試験片(長さ127mm、幅13mm)を使用した。炎の大きさは125mmとした。
なお、接炎時間は5秒間とし、接炎後の残炎時間をそれぞれ測定した。
また、火が消えると同時に2回目の接炎を5秒間行って、1回目と同様にして、接炎後の残炎時間をそれぞれ測定した。これを5回繰り返した。更に、落下する火種により試験片の下に置いた綿が発火するか否かについても同時に評価した。
1回目から5回目の燃焼時間、及び、綿の発火の有無等から、UL-94、5V規格に従って燃焼性分類を判定した。これらを合格するものについて、更に、平板燃焼試験を行った。
平板燃焼試験の評価において、平板試験片(長さ150mm、幅150mm)を使用した。炎の大きさは125mmとした。
なお、接炎時間は5秒間とし、火が消えると同時に2回目の接炎を5秒間行って、これを5回繰り返した。接炎後に平板試験片の穴あきの有無を確認した。穴あきの無いものについて5V-A、穴あきの確認されたものについては5V-Bとして評価した。
国土交通省令第151号「鉄道に関する技術上の基準を定める法令」に基づく鉄道車両用材料燃焼試験に準拠して、得られた不燃フィルムから作製した試験片(長さ257mm、幅182mm)の短辺が上下にくるようにして45°傾斜に保持し、燃料容器(鉄製、厚さ0.8mm、直径17.5mm、高さ7.1mm)の底の中心が、試験片の下面の中心の垂直下方25.4mmの位置となるように、台に載せ、純エチルアルコール0.5mLを入れて着火し、燃料が燃えつきるまで放置し、燃焼性をアルコールの燃焼中と燃焼後とに分け、燃焼中はサンプルへの着火、着炎、煙及び火勢を観察し、燃焼後は残炎、残じん、炭化及び変形状態を調べた。
試験片に着火がなく、発煙が少なく、又、エチルアルコールの燃焼後、変色が試験片の縁に達していない場合は「極難燃性」とし、変色の大きさが100mm以内の場合は「不燃性」として判定した。
(総発熱量、最大発熱速度、及び、着火開始時間の評価)
得られた不燃フィルムについて、ISO5660-1に準拠したコーンカロリーメーター試験機(東洋精機製作所社製、「コーンカロリーメーターIII」)を用いて、加熱開始後20分間の総発熱量(MJ/m2)、加熱開始後20分間の最大発熱速度(kW/m2)、加熱開始後から着火するまでの時間(秒)を測定した。
得られた不燃フィルムから、幅5mm、長さ10mmの試験片を作製し、TMA装置(島津製作所社製、「TMA-60」)を用い、引っ張りモ-ド、荷重1.0gの条件で、室温から10℃/分で昇温し、350℃で30分間保持した後、10℃/分で冷却した。冷却後、60℃における昇温前後の伸縮率の変化から熱収縮率を測定した。
なお、比較例3で得られたポリイミド樹脂フィルムについて、同様にして熱収縮率を測定した結果、1.6%であった。
得られた不燃フィルムから、幅5mm、長さ10mmの試験片を作製し、TMA装置(島津製作所社製、「TMA-60」)を用い、引っ張りモ-ド、荷重1.0g、10℃/分の条件で、50~250℃における線膨張係数を測定した。
なお、比較例3で得られたポリイミド樹脂フィルムについて、同様にして線膨張係数を測定した結果、3.5×10-5K-1であった。
得られた不燃フィルムについて、JIS-K5600-5-1に準拠した方法で耐屈曲性(円筒形マンドレル法)試験を実施した。試験方法は、1~5mm径マンドレルを使用し、一つの試験片に対して大きい直径のマンドレルから小さいマンドレルへと順に試験し、フィルム割れやひび割れの初めて起こるマンドレル直径を示した。1mmのマンドレルでも割れの生じなかったフィルムについては1mm以下とした。
なお、比較例2で得られた不燃フィルムについて、同様にして耐屈曲性試験を実施した結果、25mmであった。
得られた不燃フィルムについて、JIS K7128-1に準拠した測定法で引裂強度を測定した。サンプルサイズ150mm×50mmに不燃フィルムを切断し、更に切断した不燃フィルムの中心部分から長手方向に75mm切断し、スリットを作製した。卓上形精密万能試験機(島津製作所社製、「AGS-J」)を用いて、引裂速度200mm/分の引裂速度で引裂伝播抵抗値を測定した。引裂伝播抵抗値は、引裂開始の20mmと引裂終了前の5mmを除外し、残り50mmの引裂強さの平均値を算出することにより求めた。測定本数は、1実施例あたり5本とし、それぞれの値(a1~a5)の平均値を算出し、求める引裂強度とした。
得られた不燃フィルムから、幅40mmの試験片を作製し、卓上形精密万能試験機(島津製作所社製、「AGS-J」)を用い、つかみ間隔40mm、引っ張り速度200mm/分の条件で引っ張り試験を行い、破断強度を測定した。
JIS C2110に準拠した方法で絶縁破壊電圧を測定した。陽極として厚み100μm、10cm角のアルミ箔電極、陰極として真鍮性25mmφの電極を用い、この間に不燃フィルムをはさみ、直流高圧安定化電源(春日電気社製)を用いて、100V/秒の速度で昇圧しながら電圧を印加し、電流が10mA以上流れた場合を絶縁破壊したものとした。その時の電圧を測定点のフィルム厚みで割った値を絶縁破壊強度とし、5点測定した時の中央値で示した。
JIS K 7126 A法(差圧法)に準じた差圧式のガスクロ法により、ガスや蒸気等の透過率や透湿度の測定が可能なガス・蒸気透過率測定装置(GTRテック社製)を用いて、40℃、90%RHの条件で不燃フィルムの水蒸気透過度の測定を行った。
得られた不燃フィルムを約0.2g採取し、質量を0.1mg単位まで正確に秤量した(この時の質量をW0とする)。次いで、40℃の水浴中に24時間静置し、その後の質量を測定し、これをW1として、以下の式を用いて吸水率を求めた。
吸水率(重量%)=((W1-W0)/W0)×100
得られた不燃フィルムを約0.2g採取し、質量を0.1mg単位まで正確に秤量した(この時の質量をW0とする)。次いで、40℃で90RH%の雰囲気下に24時間静置し、その後の質量を測定し、これをW2として、以下の式を用いて吸湿率を求めた。
得られた不燃フィルムを85℃、85%RHに維持された恒温恒湿槽に入れて静置し、表1に示した時間が経過した後、取り出して外観等を確認した。その結果、表面や断面に変色や剥離が見られなかった場合を「〇」、表面や断面に変色や剥離が見られた場合を「×」として耐候性を評価した。
実施例1で得られた不燃フィルム用分散液を、底面が平坦であり、底面の形状が長方形であるポリプロピレン製シートに、ドクターブレードを用いて厚みが300μmとなるように塗布した。ポリプロピレン製シートを水平に保った状態で、強制送風式オーブンで50℃の温度条件で10時間乾燥して、ポリプロピレン製シート上にフィルムを形成した。このポリプロピレン製シート上に成形したフィルム上に、再度、実施例1で得られた不燃フィルム用分散液を、ドクターブレードを用いて厚みが300μmとなるように塗布した。ポリプロピレン製シートを水平に保った状態で、強制送風式オーブンで50℃の温度条件で10時間乾燥して、ポリプロピレン製シート上にフィルムを形成した。このフィルムをポリプロピレン製シートから剥離し、順に、120℃で30分、150℃で5分、200℃で5分、350℃で30分熱処理して、タルクとポリイミド樹脂とからなり、全重量に対するタルクの割合が61.9重量%である厚さ120μmの不燃フィルムを得た。
(部分放電試験)
実施例3及び実施例14で得られた不燃フィルムについて、IEC61730-2:2004 11.1項に準じて部分放電試験をそれぞれ10試料について実施した。具体的には、測定装置としてDAC-PD-7(総研電気社製)を用い、以下の測定手順で部分放電電圧を求めた。
その結果、実施例3で得られた不燃フィルムの部分放電電圧は、2531Vであり、実施例12で得られた不燃フィルムの部分放電電圧は、測定限界の3000V以上であった。
1.試料を電極間に設置した。
2.電圧を印加し、部分放電が開始する電圧Uinc(vrms)を測定した。その際の部分放電量は3pCを基準とした。
3.Uincの1.1倍の電圧を10秒間印加し、ついで速やかに部分放電が消失するまで電圧を降下させた。その際の部分放電量は1pC以下を基準とした。部分放電が消失した電圧で60秒間継続させ、部分放電が発生しない場合、その電圧をUext(vrms)として記録し、試験を終了した。
4.以上の操作を10試料に対して行った。試験結果より以下の式に基づき部分放電電圧Usys(VDC)を求めた。
Usys=(Uextの平均-標準偏差)×√2/(1.2×1.25)
6mm幅のタブ線をはんだ付けすることで、156mm角のc-Si2直ストリングス2枚を繋ぎ、太陽電池セルとした。ガラス板(旭硝子社製、40cm角)の上に封止材EVA(サンビック社製、「サンビックFC」、40cm角)を載せ、その上に太陽電池セルを載せた。取付け端子を通すスリットが入った封止材EVAをセルの上に載せ、最後にバックシートとして実施例14で作製したフィルムを載せ、ラミネーターにより130℃で熱圧着した。この熱圧着した板の端部からはみ出したEVAを電気カッターで剥ぎ取り、シール材(東レ・ダウコーニング社製、「SH780シーラント」)を溝に流し込んだアルミフレームを、板の4隅にはめ込み、ビスで取り付けて室温で自然乾燥させ端面をシールした。シール材の乾燥後、バックシート上に端子ボックス(オーナンバ社製)を、取付け端子部を覆うようにして取り付け、室温で自然乾燥させ、その後取り付け端子を端子ボックスにはんだ付けした。その後、ポッティング剤(東レ・ダウコーニング社製、PV-7321)を30g(ベース剤と硬化剤を10:1の割合で混ぜ合せたもの)端子ボックスに流し込み自然乾燥させた。一週間程度静置させた後に端子ボックスのカバーを取り付け、太陽電池モジュールの完成品とした。作製した太陽電池モジュールの(a)表面及び(b)裏面の写真を図2に示した。
得られた太陽電池モジュールの性能評価を行ったところ、I-V特性評価において、モジュールの曲線因子(FF)の値が約0.7となり、太陽電池として問題無い性能であることを確認した。
更に、本発明の不燃フィルムは、充分な機械的強度と優れた柔軟性、不燃性を持つフィルムであり、様々な電気材料、機械材料等の部材、例えば、コンデンサー誘電体、各種センサー用基板、電池用絶縁フィルム、コンデンサー用絶縁フィルム、各種積層板、離形フィルム、不燃性布地、不燃性建材、産業用パッキン等として使用可能である。これら分野に新素材を提供し、新技術への発展に貢献できる。
2 太陽電池素子
3 封止剤
4 光透過性基板
5 太陽電池バックシート
Claims (25)
- 水不溶性無機化合物と耐熱性合成樹脂とを含有する不燃フィルムであって、
前記水不溶性無機化合物の含有量が不燃フィルムの全重量に対して30重量%以上90重量%以下であり、
UL94規格VTM試験において、燃焼性分類がVTM-0である
ことを特徴とする不燃フィルム。 - 水不溶性無機化合物は、シリカ化合物、シリカアルミナ化合物、アルミニウム化合物、カルシウム化合物、及び、窒化物からなる群から選択される少なくとも一種であることを特徴とする請求項1記載の不燃フィルム。
- 水不溶性無機化合物として層状ケイ酸塩鉱物を含有することを特徴とする請求項2記載の不燃フィルム。
- 層状ケイ酸塩鉱物は、非膨潤性粘土鉱物であることを特徴とする請求項3記載の不燃フィルム。
- 非膨潤性粘土鉱物は、タルク、カオリン、パイロフィライト、及び、非膨潤性雲母からなる群から選択される少なくとも一種であることを特徴とする請求項4記載の不燃フィルム。
- 耐熱性合成樹脂は、ポリイミド樹脂、ポリアミドイミド樹脂、及び、ポリベンゾオキサゾール樹脂からなる群より選択される少なくとも1種であることを特徴とする請求項1、2、3、4又は5記載の不燃フィルム。
- 耐熱性合成樹脂は、芳香族ポリイミド樹脂、芳香族ポリアミドイミド樹脂、及び、芳香族ポリベンゾオキサゾール樹脂からなる群より選択される少なくとも1種であることを特徴とする請求項1、2、3、4、5又は6記載の不燃フィルム。
- フィルムを2層以上積層させ一体化した積層体からなることを特徴とする請求項1、2、3、4、5、6又は7記載の不燃フィルム。
- 厚みが10μm以上であることを特徴とする請求項1、2、3、4、5、6、7又は8記載の不燃フィルム。
- 40℃、90%RHの環境下での水蒸気透過度が20g/m2・day以下であることを特徴とする請求項1、2、3、4、5、6、7、8又は9記載の不燃フィルム。
- JIS-K5600-5-1(1999)に準拠した円筒形マンドレル法による耐屈曲性試験において、フィルムの割れの起こるマンドレル直径が10mm以下であることを特徴とする請求項1、2、3、4、5、6、7、8、9又は10記載の不燃フィルム。
- 50~250℃における線膨張係数が5.0×10-5/℃以下であることを特徴とする請求項1、2、3、4、5、6、7、8、9、10又は11記載の不燃フィルム。
- 国土交通省令第151号「鉄道に関する技術上の基準を定める法令」に基づく鉄道車両用材料燃焼試験の不燃性に該当することを特徴とする請求項1、2、3、4、5、6、7、8、9、10、11又は12記載の不燃フィルム。
- ISO5660-1に準拠したコーンカロリーメーターによる発熱性試験において、
加熱開始後20分間の総発熱量がサンプル面積に対して8MJ/m2以下であり、
加熱開始後20分間の最大発熱速度が、サンプル面積に対して300kW/m2以下であり、かつ、
試験開始から着火するまでの時間が60秒以上であることを特徴とする請求項1、2、3、4、5、6、7、8、9、10、11、12又は13記載の不燃フィルム。 - UL94規格VTM試験において、燃焼性分類がVTM-0となるときのフィルム厚みが100μm以下であることを特徴とする請求項1、2、3、4、5、6、7、8、9、10、11、12、13又は14記載の不燃フィルム。
- 絶縁破壊電圧が20kV/mm以上であることを特徴とする請求項1、2、3、4、5、6、7、8、9、10、11、12、13、14又は15記載の不燃フィルム。
- 請求項1、2、3、4、5、6、7、8、9、10、11、12、13、14、15又は16記載の不燃フィルムの製造に用いる不燃フィルム用分散液であって、
分散媒と、不揮発成分である水不溶性無機化合物並びに耐熱性合成樹脂及び/又は耐熱性合成樹脂の前駆体とを含有し、
前記水不溶性無機化合物の含有量が不揮発成分の全重量に対して30重量%以上90重量%以下であり、かつ、
不揮発成分の含有量が不燃フィルム用分散液の全重量に対して18重量%を超え65重量%以下である
ことを特徴とする不燃フィルム用分散液。 - 分散媒は、N-メチル-2-ピロリドン、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、ジメチルスルホキシド、テトラヒドロフラン、及び、スルホランからなる群から選択される少なくとも一種であることを特徴とする請求項17記載の不燃フィルム用分散液。
- 請求項17又は18記載の不燃フィルム用分散液を調製する工程1と、
調製した不燃フィルム用分散液を基板上に展開して静置する工程2と、
該基板上に展開した不燃フィルム用分散液から分散媒を除去してフィルム状に成形し、該基板上からフィルムを分離する工程3とを有することを特徴とする不燃フィルムの製造方法。 - 工程2において、基板上に展開する分散液の厚みが50μm以上であることを特徴とする請求項19記載の不燃フィルムの製造方法。
- 工程3において、分散媒を除去する際の温度が150℃以下であることを特徴とする請求項19又は20記載の不燃フィルムの製造方法。
- 基板は、ガラス、ポリエチレンテレフタレート、ポリイミド、ポリエチレン、又は、ポリプロピレンからなることを特徴とする請求項19、20又は21記載の不燃フィルムの製造方法。
- 請求項1、2、3、4、5、6、7、8、9、10、11、12、13、14、15又は16記載の不燃フィルムを用いてなることを特徴とする太陽電池バックシート。
- 請求項23記載の太陽電池バックシートを用いてなることを特徴とする太陽電池。
- 請求項1、2、3、4、5、6、7、8、9、10、11、12、13、14、15又は16記載の不燃フィルムを用いてなることを特徴とするフレキシブル基板。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013519529A JP5930549B2 (ja) | 2011-06-09 | 2012-06-07 | 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 |
KR1020147000338A KR20140039034A (ko) | 2011-06-09 | 2012-06-07 | 불연 필름, 불연 필름용 분산액, 불연 필름의 제조 방법, 태양 전지 백 시트, 플렉시블 기판, 및 태양 전지 |
AU2012267970A AU2012267970B2 (en) | 2011-06-09 | 2012-06-07 | Non-combustible film, dispersion liquid for non-combustible films, method for producing non-combustible film, solar cell back sheet, flexible board, and solar cell |
CA2838112A CA2838112A1 (en) | 2011-06-09 | 2012-06-07 | Non-combustible film, dispersion liquid for non-combustible films, method for producing non-combustible film, solar cell back sheet, flexible board, and solar cell |
CN201280026466.8A CN103582677B (zh) | 2011-06-09 | 2012-06-07 | 不燃膜、不燃膜用分散液、不燃膜的制造方法、太阳能电池背板、柔性基板和太阳能电池 |
EP12797135.6A EP2719716A4 (en) | 2011-06-09 | 2012-06-07 | INCOMBUSTIBLE FILM, DISPERSION LIQUID FOR INCOMBUSTIBLE FILMS, METHOD FOR PRODUCING INCOMBUSTIBLE FILM, BACKGROUND SHEET FOR PHOTOVOLTAIC CELL; FLEXIBLE CARD AND PHOTOVOLTAIC CELL |
US14/124,539 US20140154490A1 (en) | 2011-06-09 | 2012-06-07 | Non-combustible film, dispersion liquid for non-combustible films, method for producing non-combustible film, solar cell back sheet, flexible board, and solar cell |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-129417 | 2011-06-09 | ||
JP2011129417 | 2011-06-09 | ||
JP2011-186505 | 2011-08-29 | ||
JP2011186505 | 2011-08-29 | ||
JP2012-104814 | 2012-05-01 | ||
JP2012104814 | 2012-05-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012169591A1 true WO2012169591A1 (ja) | 2012-12-13 |
Family
ID=47296146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/064699 WO2012169591A1 (ja) | 2011-06-09 | 2012-06-07 | 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20140154490A1 (ja) |
EP (1) | EP2719716A4 (ja) |
JP (1) | JP5930549B2 (ja) |
KR (1) | KR20140039034A (ja) |
CN (1) | CN103582677B (ja) |
AU (1) | AU2012267970B2 (ja) |
CA (1) | CA2838112A1 (ja) |
TW (1) | TWI588187B (ja) |
WO (1) | WO2012169591A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013047310A (ja) * | 2011-08-29 | 2013-03-07 | Sumitomo Seika Chem Co Ltd | 不燃水蒸気バリアフィルム、不燃水蒸気バリアフィルムの製造方法、太陽電池バックシート、及び、太陽電池 |
CN103146196A (zh) * | 2013-03-18 | 2013-06-12 | 宜兴市高拓高分子材料有限公司 | 一种阻燃聚砜薄膜及其制备方法与应用 |
JP2013183098A (ja) * | 2012-03-02 | 2013-09-12 | Lintec Corp | 太陽電池用保護シートおよびその製造方法、ならびに太陽電池モジュール |
JPWO2017150552A1 (ja) * | 2016-03-01 | 2019-01-10 | 住友精化株式会社 | スピーカー振動板、スピーカーユニット、及びスピーカー振動板用樹脂フィルム |
JP2019110265A (ja) * | 2017-12-20 | 2019-07-04 | 京セラ株式会社 | 太陽電池モジュールおよび太陽電池モジュールの製造方法 |
WO2024204490A1 (ja) * | 2023-03-28 | 2024-10-03 | 積水化学工業株式会社 | フレキシブル太陽電池 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102939199B (zh) | 2010-06-03 | 2015-03-25 | 独立行政法人产业技术综合研究所 | 水蒸气阻隔性膜及其制造方法 |
CN112697947A (zh) * | 2021-01-07 | 2021-04-23 | 科凯(南通)生命科学有限公司 | 一种测定tpu膜中四氢呋喃和n,n-二甲基甲酰胺残留量的方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05275882A (ja) * | 1992-03-28 | 1993-10-22 | Kanegafuchi Chem Ind Co Ltd | 電波吸収体及びその製造方法 |
JP2000087001A (ja) * | 1998-09-17 | 2000-03-28 | Sumitomo Bakelite Co Ltd | 難燃性樹脂接着剤およびそれを用いたフレキシブルプリント回路用基板 |
JP2007297564A (ja) * | 2006-05-08 | 2007-11-15 | Du Pont Toray Co Ltd | 難燃剤組成物及び難燃性樹脂組成物、並びに該樹脂組成物からなる成形品、繊維 |
JP2009203414A (ja) * | 2008-02-29 | 2009-09-10 | Toray Ind Inc | 熱硬化性樹脂組成物 |
JP2010155895A (ja) * | 2008-12-26 | 2010-07-15 | Asahi Kasei E-Materials Corp | 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器 |
JP2012011555A (ja) * | 2010-06-29 | 2012-01-19 | Toray Ind Inc | 難燃性フィルム |
JP2012082392A (ja) * | 2010-09-15 | 2012-04-26 | Toray Ind Inc | 全芳香族ポリアミドフィルム、その製造方法および積層体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6706409B2 (en) * | 2000-10-13 | 2004-03-16 | Hitachi Chemical Co., Ltd. | Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board |
CN100360597C (zh) * | 2000-12-08 | 2008-01-09 | 积水化学工业株式会社 | 绝缘基材的原料及由其生产的制品 |
DE10394373B4 (de) * | 2002-12-16 | 2016-06-02 | Dai Nippon Printing Co., Ltd. | Zwischenfolie für ein Solarzellenmodul und Solarzellenmodul, bei dem die Zwischenfolie eingesetzt wird |
US7259201B2 (en) * | 2003-08-28 | 2007-08-21 | General Electric Company | Flame retardant thermoplastic films and methods of making the same |
JP2006089643A (ja) * | 2004-09-24 | 2006-04-06 | Mitsubishi Plastics Ind Ltd | 樹脂組成物およびその成形体 |
US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
JP5099412B2 (ja) * | 2006-03-11 | 2012-12-19 | 独立行政法人産業技術総合研究所 | 変性粘土を用いた膜 |
US7736727B2 (en) * | 2007-02-23 | 2010-06-15 | Sabic Innovative Plastics Ip B.V. | Electrically insulating film and method |
JP2008214413A (ja) * | 2007-03-01 | 2008-09-18 | Toray Ind Inc | 熱硬化性樹脂組成物 |
US8969490B2 (en) * | 2008-03-25 | 2015-03-03 | Sumitomo Bakelite Company, Ltd. | Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device |
CN102668108A (zh) * | 2009-11-20 | 2012-09-12 | E.I.内穆尔杜邦公司 | 包含聚酰亚胺膜和电极的组合件以及与它们相关的方法 |
CN101955678B (zh) * | 2010-10-21 | 2012-05-30 | 苏州生益科技有限公司 | 阻燃型热固性树脂组合物及覆铜板 |
-
2012
- 2012-06-07 EP EP12797135.6A patent/EP2719716A4/en not_active Withdrawn
- 2012-06-07 JP JP2013519529A patent/JP5930549B2/ja active Active
- 2012-06-07 KR KR1020147000338A patent/KR20140039034A/ko not_active Application Discontinuation
- 2012-06-07 CA CA2838112A patent/CA2838112A1/en not_active Abandoned
- 2012-06-07 WO PCT/JP2012/064699 patent/WO2012169591A1/ja active Application Filing
- 2012-06-07 AU AU2012267970A patent/AU2012267970B2/en not_active Ceased
- 2012-06-07 CN CN201280026466.8A patent/CN103582677B/zh not_active Expired - Fee Related
- 2012-06-07 US US14/124,539 patent/US20140154490A1/en not_active Abandoned
- 2012-06-08 TW TW101120623A patent/TWI588187B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05275882A (ja) * | 1992-03-28 | 1993-10-22 | Kanegafuchi Chem Ind Co Ltd | 電波吸収体及びその製造方法 |
JP2000087001A (ja) * | 1998-09-17 | 2000-03-28 | Sumitomo Bakelite Co Ltd | 難燃性樹脂接着剤およびそれを用いたフレキシブルプリント回路用基板 |
JP2007297564A (ja) * | 2006-05-08 | 2007-11-15 | Du Pont Toray Co Ltd | 難燃剤組成物及び難燃性樹脂組成物、並びに該樹脂組成物からなる成形品、繊維 |
JP2009203414A (ja) * | 2008-02-29 | 2009-09-10 | Toray Ind Inc | 熱硬化性樹脂組成物 |
JP2010155895A (ja) * | 2008-12-26 | 2010-07-15 | Asahi Kasei E-Materials Corp | 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器 |
JP2012011555A (ja) * | 2010-06-29 | 2012-01-19 | Toray Ind Inc | 難燃性フィルム |
JP2012082392A (ja) * | 2010-09-15 | 2012-04-26 | Toray Ind Inc | 全芳香族ポリアミドフィルム、その製造方法および積層体 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2719716A4 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013047310A (ja) * | 2011-08-29 | 2013-03-07 | Sumitomo Seika Chem Co Ltd | 不燃水蒸気バリアフィルム、不燃水蒸気バリアフィルムの製造方法、太陽電池バックシート、及び、太陽電池 |
JP2013183098A (ja) * | 2012-03-02 | 2013-09-12 | Lintec Corp | 太陽電池用保護シートおよびその製造方法、ならびに太陽電池モジュール |
CN103146196A (zh) * | 2013-03-18 | 2013-06-12 | 宜兴市高拓高分子材料有限公司 | 一种阻燃聚砜薄膜及其制备方法与应用 |
JPWO2017150552A1 (ja) * | 2016-03-01 | 2019-01-10 | 住友精化株式会社 | スピーカー振動板、スピーカーユニット、及びスピーカー振動板用樹脂フィルム |
JP2022000981A (ja) * | 2016-03-01 | 2022-01-04 | 住友精化株式会社 | スピーカー振動板用樹脂フィルム、及びスピーカー振動板用積層体 |
JP7097496B2 (ja) | 2016-03-01 | 2022-07-07 | 住友精化株式会社 | スピーカー振動板用樹脂フィルム、及びスピーカー振動板用積層体 |
JP2019110265A (ja) * | 2017-12-20 | 2019-07-04 | 京セラ株式会社 | 太陽電池モジュールおよび太陽電池モジュールの製造方法 |
WO2024204490A1 (ja) * | 2023-03-28 | 2024-10-03 | 積水化学工業株式会社 | フレキシブル太陽電池 |
Also Published As
Publication number | Publication date |
---|---|
EP2719716A4 (en) | 2015-04-08 |
TWI588187B (zh) | 2017-06-21 |
CA2838112A1 (en) | 2012-12-13 |
CN103582677A (zh) | 2014-02-12 |
JPWO2012169591A1 (ja) | 2015-02-23 |
KR20140039034A (ko) | 2014-03-31 |
US20140154490A1 (en) | 2014-06-05 |
TW201302880A (zh) | 2013-01-16 |
EP2719716A1 (en) | 2014-04-16 |
AU2012267970A1 (en) | 2014-01-16 |
CN103582677B (zh) | 2017-11-28 |
AU2012267970B2 (en) | 2016-01-14 |
JP5930549B2 (ja) | 2016-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5930549B2 (ja) | 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池 | |
JP6019518B2 (ja) | 水蒸気バリアフィルム、水蒸気バリアフィルム用分散液、水蒸気バリアフィルムの製造方法、太陽電池バックシート、及び、太陽電池 | |
WO2015159387A1 (ja) | 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池 | |
US7754803B2 (en) | Resin composition | |
EP2001942A1 (en) | Process for preparing polyimide based compositions useful in high frequency circuitry applications | |
JP2005194527A (ja) | フレキシブル回路の用途に有用なポリイミド系接着剤組成物、並びに関連する構成物および方法 | |
WO2007126533A1 (en) | Capacitive polyimide laminate | |
JP5920693B2 (ja) | 不燃水蒸気バリアフィルム、不燃水蒸気バリアフィルムの製造方法、太陽電池バックシート、及び、太陽電池 | |
EP1621583A1 (en) | Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto | |
JP6292549B2 (ja) | 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池 | |
TW201307438A (zh) | 難燃化之脂環式聚醯亞胺樹脂組成物及其薄壁成型體 | |
TWI569970B (zh) | 聚醯亞胺疊層體之製造方法及聚醯亞胺疊層體 | |
JP2022058252A (ja) | 樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板 | |
TWI627267B (zh) | Heat dissipation film, dispersion for heat radiation layer, method for manufacturing heat dissipation film, and solar cell | |
JP2004352730A (ja) | ポリイミド樹脂組成物及び樹脂シート | |
JP2013252651A (ja) | 難燃性フィルム | |
JP2007050559A (ja) | 難燃性ポリエステルフィルムおよびその製造方法 | |
JP2013071278A (ja) | 難燃性フィルムおよびフレキシブルディスプレイ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12797135 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013519529 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2838112 Country of ref document: CA |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20147000338 Country of ref document: KR Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2012267970 Country of ref document: AU Date of ref document: 20120607 Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14124539 Country of ref document: US |