DE60100652D1 - Unbrennbare Harzzusammensetzung, Prepreg, mehrschichtige Platte, metallbedeckte mehrschichtige Platte, Leiterplatte und mehrschichtige Leiterplatte - Google Patents

Unbrennbare Harzzusammensetzung, Prepreg, mehrschichtige Platte, metallbedeckte mehrschichtige Platte, Leiterplatte und mehrschichtige Leiterplatte

Info

Publication number
DE60100652D1
DE60100652D1 DE60100652T DE60100652T DE60100652D1 DE 60100652 D1 DE60100652 D1 DE 60100652D1 DE 60100652 T DE60100652 T DE 60100652T DE 60100652 T DE60100652 T DE 60100652T DE 60100652 D1 DE60100652 D1 DE 60100652D1
Authority
DE
Germany
Prior art keywords
multilayer
board
printed circuit
circuit board
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60100652T
Other languages
English (en)
Other versions
DE60100652T2 (de
Inventor
Nozomu Takano
Tomio Fukuda
Masato Miyatake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of DE60100652D1 publication Critical patent/DE60100652D1/de
Application granted granted Critical
Publication of DE60100652T2 publication Critical patent/DE60100652T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31862—Melamine-aldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60100652T 2000-10-13 2001-10-12 Unbrennbare Harzzusammensetzung, Prepreg, mehrschichtige Platte, metallbedeckte mehrschichtige Platte, Leiterplatte und mehrschichtige Leiterplatte Expired - Lifetime DE60100652T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000313720 2000-10-13
JP2000313720 2000-10-13

Publications (2)

Publication Number Publication Date
DE60100652D1 true DE60100652D1 (de) 2003-10-02
DE60100652T2 DE60100652T2 (de) 2004-06-24

Family

ID=18793092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60100652T Expired - Lifetime DE60100652T2 (de) 2000-10-13 2001-10-12 Unbrennbare Harzzusammensetzung, Prepreg, mehrschichtige Platte, metallbedeckte mehrschichtige Platte, Leiterplatte und mehrschichtige Leiterplatte

Country Status (9)

Country Link
US (1) US6706409B2 (de)
EP (1) EP1197514B1 (de)
JP (3) JP5186221B2 (de)
KR (2) KR100572532B1 (de)
CN (1) CN1212354C (de)
AT (1) ATE248203T1 (de)
DE (1) DE60100652T2 (de)
SG (1) SG108282A1 (de)
TW (2) TW200423831A (de)

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JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP2003003076A (ja) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、金属箔張積層板及びプリント配線板
US7332229B2 (en) 2002-04-15 2008-02-19 Zeon Corporation Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish
CN101044204A (zh) * 2004-11-26 2007-09-26 株式会社Lg化学 非卤素阻燃剂环氧树脂组合物，和使用其的预浸料坯和包铜的层压制品
US7851536B2 (en) * 2005-09-15 2010-12-14 Rutgers, The State University Flame-retardant coating
WO2008044618A1 (fr) * 2006-09-29 2008-04-17 Nippon Shokubai Co., Ltd. Composition de résine durcissable, matériau optique et procédé de régulation d'un matériau optique
CA2670273C (en) * 2006-11-20 2016-04-05 Grassroots Biotechnology, Inc. Plant growth and imaging devices and related methods and computer program products
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5539706B2 (ja) * 2009-12-16 2014-07-02 旭化成ケミカルズ株式会社 プリプレグ、金属箔張積層板、及びプリント配線板
KR20140039034A (ko) * 2011-06-09 2014-03-31 스미또모 세이까 가부시키가이샤 불연 필름, 불연 필름용 분산액, 불연 필름의 제조 방법, 태양 전지 백 시트, 플렉시블 기판, 및 태양 전지
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
CN106364067B (zh) * 2016-08-29 2021-10-12 上海国纪电子材料有限公司 一种p10覆铜板
CN114026102A (zh) * 2019-07-18 2022-02-08 巴斯夫欧洲公司 孪生单体组合物及其介电膜
KR102601266B1 (ko) * 2021-04-19 2023-11-13 주식회사 액시드 난연성 필름 및 난연성 필름을 위한 코팅 조성물

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JP4399061B2 (ja) 1999-10-13 2010-01-13 東レ・ダウコーニング株式会社 難燃性ポリオレフィン系樹脂組成物、その製造方法および難燃性ケーブル
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JP4872160B2 (ja) * 2000-03-21 2012-02-08 日立化成工業株式会社 誘電特性に優れる樹脂組成物並びにこれを用いて作製されるワニス、ワニスの製造方法、プリプレグ及び金属張積層板
JP4365987B2 (ja) * 2000-05-15 2009-11-18 協和化学工業株式会社 積層板用材料および電機および電子機器用樹脂組成物およびその成型品
JP3664124B2 (ja) * 2000-10-13 2005-06-22 日立化成工業株式会社 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Also Published As

Publication number Publication date
SG108282A1 (en) 2005-01-28
KR20040111217A (ko) 2004-12-31
US6706409B2 (en) 2004-03-16
KR20020029639A (ko) 2002-04-19
TW200423831A (en) 2004-11-01
EP1197514B1 (de) 2003-08-27
EP1197514A1 (de) 2002-04-17
TWI293320B (de) 2008-02-11
JP2012122081A (ja) 2012-06-28
ATE248203T1 (de) 2003-09-15
CN1212354C (zh) 2005-07-27
KR100572532B1 (ko) 2006-04-24
KR100570924B1 (ko) 2006-04-13
JP2011099113A (ja) 2011-05-19
TWI293544B (de) 2008-02-11
DE60100652T2 (de) 2004-06-24
CN1350031A (zh) 2002-05-22
JP2008179819A (ja) 2008-08-07
US20020068173A1 (en) 2002-06-06
JP5186221B2 (ja) 2013-04-17

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