DE69934379D1 - Verbundmaterial zur Verwendung in der Herstellung von gedruckten Leiterplatten - Google Patents

Verbundmaterial zur Verwendung in der Herstellung von gedruckten Leiterplatten

Info

Publication number
DE69934379D1
DE69934379D1 DE69934379T DE69934379T DE69934379D1 DE 69934379 D1 DE69934379 D1 DE 69934379D1 DE 69934379 T DE69934379 T DE 69934379T DE 69934379 T DE69934379 T DE 69934379T DE 69934379 D1 DE69934379 D1 DE 69934379D1
Authority
DE
Germany
Prior art keywords
manufacture
printed circuit
composite material
circuit boards
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69934379T
Other languages
English (en)
Other versions
DE69934379T2 (de
Inventor
Takashi Kataoka
Yutaka Hirasawa
Takuya Yamamoto
Kenichiro Iwakiri
Tsutomu Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE69934379D1 publication Critical patent/DE69934379D1/de
Publication of DE69934379T2 publication Critical patent/DE69934379T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69934379T 1998-10-19 1999-10-19 Verbundmaterial zur Verwendung in der Herstellung von gedruckten Leiterplatten Expired - Fee Related DE69934379T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29739998 1998-10-19
JP29739998 1998-10-19

Publications (2)

Publication Number Publication Date
DE69934379D1 true DE69934379D1 (de) 2007-01-25
DE69934379T2 DE69934379T2 (de) 2007-09-27

Family

ID=17846001

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934379T Expired - Fee Related DE69934379T2 (de) 1998-10-19 1999-10-19 Verbundmaterial zur Verwendung in der Herstellung von gedruckten Leiterplatten

Country Status (8)

Country Link
US (1) US6548153B2 (de)
EP (1) EP0996319B1 (de)
KR (1) KR100633515B1 (de)
CN (1) CN1190115C (de)
DE (1) DE69934379T2 (de)
MY (1) MY120367A (de)
SG (1) SG101924A1 (de)
TW (1) TW462210B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3676152B2 (ja) * 1999-11-11 2005-07-27 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
JP2002026475A (ja) * 2000-07-07 2002-01-25 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板
KR20030053466A (ko) * 2001-01-24 2003-06-28 코닌클리케 필립스 일렉트로닉스 엔.브이. 기판 위에 트랙을 제조하는 방법
JP4562110B2 (ja) * 2001-02-16 2010-10-13 大日本印刷株式会社 ウエットエッチングが適用される用途に限定される積層体、それを用いた電子回路部品、及びその製造方法
JP4683769B2 (ja) * 2001-05-31 2011-05-18 三井金属鉱業株式会社 銅メッキ回路層付銅張積層板及びその銅メッキ回路層付銅張積層板を用いたプリント配線板の製造方法
JPWO2003084297A1 (ja) * 2002-03-28 2005-08-11 新光電気工業株式会社 配線構造体及びその製造方法
KR101065758B1 (ko) * 2003-02-27 2011-09-19 후루카와 덴키 고교 가부시키가이샤 전자파 실드용 동박, 그 제조방법 및 전자파 실드체
JP4736703B2 (ja) * 2005-10-14 2011-07-27 宇部興産株式会社 銅配線ポリイミドフィルムの製造方法
JPWO2008093757A1 (ja) * 2007-01-31 2010-05-20 京セラ株式会社 プリプレグシートの製造方法および製造装置ならびにプリプレグシート
CN101682995A (zh) * 2007-05-24 2010-03-24 巴斯夫欧洲公司 生产被金属涂覆的基底层压材料的方法
CA2686000A1 (en) * 2007-05-24 2008-11-27 Basf Se Method for producing polymer-coated metal foils and use thereof
US8809237B2 (en) * 2008-02-19 2014-08-19 Superpower, Inc. Method of forming an HTS article
KR101015770B1 (ko) * 2008-11-11 2011-02-22 삼성전기주식회사 세미 애디티브 공법에 의하여 제조되는 인쇄회로기판에 대한 절연층 형성방법과 이를 이용한 인쇄회로기판 제조방법 및 이에 의하여 제조되는 인쇄회로기판
TWI392412B (zh) * 2009-05-08 2013-04-01 Unimicron Technology Corp Circuit board and its manufacturing method
TWI393491B (zh) * 2009-08-21 2013-04-11 Unimicron Technology Corp 線路板及其製造方法
KR101022943B1 (ko) * 2009-10-12 2011-03-16 삼성전기주식회사 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법
CN102233699B (zh) * 2010-04-29 2013-10-16 南亚塑胶工业股份有限公司 以超低棱线铜箔为载体的极薄铜箔及其制造方法
JP5826322B2 (ja) * 2014-03-25 2015-12-02 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
TWI616120B (zh) * 2014-06-09 2018-02-21 結合載板的可撓性電路板結構及其製造方法
JP2019075456A (ja) * 2017-10-16 2019-05-16 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
CN108330517B (zh) * 2018-01-25 2019-12-24 胡旭日 一种载体铜箔剥离层的镀液及剥离层的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB859848A (en) * 1956-04-30 1961-01-25 Emi Ltd Improvements in or relating to the formation of conductors on insulating supports
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
CA1044636A (en) * 1974-01-07 1978-12-19 Betty L. Berdan Method of nodularizing a metal surface
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US4088544A (en) * 1976-04-19 1978-05-09 Hutkin Irving J Composite and method for making thin copper foil
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
DE3322382A1 (de) * 1983-06-22 1985-01-10 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur herstellung von gedruckten schaltungen
CA1298740C (en) * 1987-06-30 1992-04-14 William John Parr Conductive metallization of substrates without developing agents
US4889573A (en) * 1988-05-23 1989-12-26 Tektronix, Inc. Method of forming a pattern of conductor runs on a sheet of dielectric material
JPH0818401B2 (ja) * 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
US5322975A (en) * 1992-09-18 1994-06-21 Gould Electronics Inc. Universal carrier supported thin copper line

Also Published As

Publication number Publication date
CN1255038A (zh) 2000-05-31
KR20000028606A (ko) 2000-05-25
US20020090497A1 (en) 2002-07-11
DE69934379T2 (de) 2007-09-27
US6548153B2 (en) 2003-04-15
SG101924A1 (en) 2004-02-27
EP0996319B1 (de) 2006-12-13
EP0996319A2 (de) 2000-04-26
EP0996319A3 (de) 2002-02-20
KR100633515B1 (ko) 2006-10-13
CN1190115C (zh) 2005-02-16
TW462210B (en) 2001-11-01
MY120367A (en) 2005-10-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee