DE69031159D1 - Lichtempfindliche Harzzusammensetzung zur Herstellung von Leitermustern und mehrschichtige gedruckte Leiterplatten unter Verwendung dieser Zusammensetzung - Google Patents

Lichtempfindliche Harzzusammensetzung zur Herstellung von Leitermustern und mehrschichtige gedruckte Leiterplatten unter Verwendung dieser Zusammensetzung

Info

Publication number
DE69031159D1
DE69031159D1 DE69031159T DE69031159T DE69031159D1 DE 69031159 D1 DE69031159 D1 DE 69031159D1 DE 69031159 T DE69031159 T DE 69031159T DE 69031159 T DE69031159 T DE 69031159T DE 69031159 D1 DE69031159 D1 DE 69031159D1
Authority
DE
Germany
Prior art keywords
composition
printed circuit
photosensitive resin
circuit boards
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69031159T
Other languages
English (en)
Other versions
DE69031159T2 (de
Inventor
Shinichiro Imabayashi
Hitoshi Oka
Isamu Tanaka
Hiroshi Kikuchi
Makio Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69031159D1 publication Critical patent/DE69031159D1/de
Application granted granted Critical
Publication of DE69031159T2 publication Critical patent/DE69031159T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
DE69031159T 1989-10-25 1990-10-18 Lichtempfindliche Harzzusammensetzung zur Herstellung von Leitermustern und mehrschichtige gedruckte Leiterplatten unter Verwendung dieser Zusammensetzung Expired - Fee Related DE69031159T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1275993A JP2825558B2 (ja) 1989-10-25 1989-10-25 組成物及びこの樹脂組成物を使用した多層プリント回路板の製造方法

Publications (2)

Publication Number Publication Date
DE69031159D1 true DE69031159D1 (de) 1997-09-04
DE69031159T2 DE69031159T2 (de) 1998-01-08

Family

ID=17563277

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69031159T Expired - Fee Related DE69031159T2 (de) 1989-10-25 1990-10-18 Lichtempfindliche Harzzusammensetzung zur Herstellung von Leitermustern und mehrschichtige gedruckte Leiterplatten unter Verwendung dieser Zusammensetzung

Country Status (5)

Country Link
US (1) US5387493A (de)
EP (1) EP0428870B1 (de)
JP (1) JP2825558B2 (de)
KR (1) KR930004136B1 (de)
DE (1) DE69031159T2 (de)

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US5616256A (en) * 1993-11-22 1997-04-01 Ibiden Co., Inc. Printed wiring board and process for producing thereof
JP3616657B2 (ja) * 1993-11-22 2005-02-02 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP3815574B2 (ja) * 1993-12-15 2006-08-30 ソニー株式会社 多層プリント配線板の製造方法
JP3758197B2 (ja) * 1994-06-16 2006-03-22 ソニー株式会社 多層プリント配線板の製造方法
JP2638569B2 (ja) * 1995-05-24 1997-08-06 日本電気株式会社 多層プリント基板及び多層プリント基板の形成方法
US5732743A (en) * 1996-06-14 1998-03-31 Ls Technology Inc. Method of sealing pipes
US6201194B1 (en) 1998-12-02 2001-03-13 International Business Machines Corporation Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
US6355357B1 (en) * 1998-12-21 2002-03-12 Sony Chemicals Corp. Flexible printed board, polyamic acid and polyamic acid varnish containing same
US6429238B1 (en) * 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
DE10015214C1 (de) * 2000-03-27 2002-03-21 Infineon Technologies Ag Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums
US6340608B1 (en) * 2000-07-07 2002-01-22 Chartered Semiconductor Manufacturing Ltd. Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
JP2002111225A (ja) * 2000-09-18 2002-04-12 Internatl Business Mach Corp <Ibm> プリント配線板、プリント配線板の製造方法および該製造方法に用いられるフォトマスク
KR100697511B1 (ko) * 2003-10-21 2007-03-20 삼성전자주식회사 광경화성 반도체 나노결정, 반도체 나노결정 패턴형성용 조성물 및 이들을 이용한 반도체 나노결정의 패턴 형성 방법
EP1951012B1 (de) * 2004-07-23 2011-07-20 Shinko Electric Industries Co., Ltd. Verfahren zur Herstellung einer Leiterplatte unter Verwendung von Galvanisation
US20060030149A1 (en) * 2004-08-06 2006-02-09 Steven Leith Depositing material on photosensitive material
WO2007119966A1 (en) * 2006-04-13 2007-10-25 Lg Chem, Ltd. Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods
JP2009076727A (ja) * 2007-09-21 2009-04-09 Mitsubishi Electric Corp プリント配線板、それを用いた電子機器、及びその製造方法
FR2933686B1 (fr) * 2008-07-09 2010-11-19 Saint Gobain Emballage Composition de renforcement du verre creux et de protection de celui-ci contre la rayure, procedes de traitement correspondants et verre creux traite obtenu
JP5471987B2 (ja) * 2010-09-07 2014-04-16 株式会社大真空 電子部品パッケージ用封止部材、電子部品パッケージ、及び電子部品パッケージ用封止部材の製造方法
JP5693339B2 (ja) * 2011-04-06 2015-04-01 日本メクトロン株式会社 多層プリント配線板およびその製造方法
WO2012141096A1 (ja) * 2011-04-13 2012-10-18 株式会社村田製作所 フレキシブル多層基板
JP2013065824A (ja) * 2011-08-29 2013-04-11 Sony Corp トランジスタおよびその製造方法、並びに表示装置
US9398703B2 (en) * 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
CN107490936A (zh) * 2016-06-09 2017-12-19 株式会社田村制作所 固化涂膜的形成方法
CN107831610A (zh) * 2017-10-26 2018-03-23 惠科股份有限公司 信号传输装置及显示装置
AT521217B1 (de) 2018-05-11 2021-02-15 Thixotropic Piston Injection Tech Gmbh Modul für eine Druckgussvorrichtung
JP7363105B2 (ja) * 2019-05-31 2023-10-18 株式会社レゾナック 感光性樹脂組成物、感光性樹脂フィルム、プリント配線板及び半導体パッケージ、並びにプリント配線板の製造方法

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US3615446A (en) * 1968-01-15 1971-10-26 Itek Corp Photographic copy medium comprising a semiconductor layer with a photopolymerizable layer thereover
NL7001820A (de) * 1970-02-10 1971-08-12
JPS5651343B2 (de) * 1972-04-28 1981-12-04
DE2406400B2 (de) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
GB1478341A (en) * 1973-06-07 1977-06-29 Hitachi Chemical Co Ltd Printed circuit board and method of making the same
JPS5738436A (en) * 1980-08-21 1982-03-03 Fuji Xerox Co Ltd Electrophotographic receptor
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法

Also Published As

Publication number Publication date
KR930004136B1 (ko) 1993-05-20
US5387493A (en) 1995-02-07
DE69031159T2 (de) 1998-01-08
JP2825558B2 (ja) 1998-11-18
KR910009129A (ko) 1991-05-31
EP0428870A3 (en) 1992-03-11
EP0428870A2 (de) 1991-05-29
EP0428870B1 (de) 1997-07-30
JPH03138653A (ja) 1991-06-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee