KR910009129A - 도체패턴형성용 감광성수지조성물과 다층프린트회로기판 및 그의 제조방법 - Google Patents

도체패턴형성용 감광성수지조성물과 다층프린트회로기판 및 그의 제조방법

Info

Publication number
KR910009129A
KR910009129A KR1019900017024A KR900017024A KR910009129A KR 910009129 A KR910009129 A KR 910009129A KR 1019900017024 A KR1019900017024 A KR 1019900017024A KR 900017024 A KR900017024 A KR 900017024A KR 910009129 A KR910009129 A KR 910009129A
Authority
KR
South Korea
Prior art keywords
manufacturing
circuit board
resin composition
printed circuit
photosensitive resin
Prior art date
Application number
KR1019900017024A
Other languages
English (en)
Other versions
KR930004136B1 (ko
Inventor
신이찌로 이마바야시
오까히또시
이사무 다나까
히로시 기꾸찌
마끼오 와따나베
Original Assignee
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 가부시끼가이샤 히다찌세이사꾸쇼
Publication of KR910009129A publication Critical patent/KR910009129A/ko
Application granted granted Critical
Publication of KR930004136B1 publication Critical patent/KR930004136B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
KR1019900017024A 1989-10-25 1990-10-24 도체패턴형성용 감광성수지조성물과 다층프린트회로기판 및 그의 제조방법 KR930004136B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1275993A JP2825558B2 (ja) 1989-10-25 1989-10-25 組成物及びこの樹脂組成物を使用した多層プリント回路板の製造方法
JP89-275993 1989-10-25

Publications (2)

Publication Number Publication Date
KR910009129A true KR910009129A (ko) 1991-05-31
KR930004136B1 KR930004136B1 (ko) 1993-05-20

Family

ID=17563277

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900017024A KR930004136B1 (ko) 1989-10-25 1990-10-24 도체패턴형성용 감광성수지조성물과 다층프린트회로기판 및 그의 제조방법

Country Status (5)

Country Link
US (1) US5387493A (ko)
EP (1) EP0428870B1 (ko)
JP (1) JP2825558B2 (ko)
KR (1) KR930004136B1 (ko)
DE (1) DE69031159T2 (ko)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616256A (en) * 1993-11-22 1997-04-01 Ibiden Co., Inc. Printed wiring board and process for producing thereof
JP3616657B2 (ja) * 1993-11-22 2005-02-02 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP3815574B2 (ja) * 1993-12-15 2006-08-30 ソニー株式会社 多層プリント配線板の製造方法
JP3758197B2 (ja) * 1994-06-16 2006-03-22 ソニー株式会社 多層プリント配線板の製造方法
JP2638569B2 (ja) * 1995-05-24 1997-08-06 日本電気株式会社 多層プリント基板及び多層プリント基板の形成方法
US5732743A (en) * 1996-06-14 1998-03-31 Ls Technology Inc. Method of sealing pipes
US6201194B1 (en) 1998-12-02 2001-03-13 International Business Machines Corporation Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
US6355357B1 (en) * 1998-12-21 2002-03-12 Sony Chemicals Corp. Flexible printed board, polyamic acid and polyamic acid varnish containing same
US6429238B1 (en) * 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
DE10015214C1 (de) * 2000-03-27 2002-03-21 Infineon Technologies Ag Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums
US6340608B1 (en) * 2000-07-07 2002-01-22 Chartered Semiconductor Manufacturing Ltd. Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
JP2002111225A (ja) * 2000-09-18 2002-04-12 Internatl Business Mach Corp <Ibm> プリント配線板、プリント配線板の製造方法および該製造方法に用いられるフォトマスク
KR100697511B1 (ko) * 2003-10-21 2007-03-20 삼성전자주식회사 광경화성 반도체 나노결정, 반도체 나노결정 패턴형성용 조성물 및 이들을 이용한 반도체 나노결정의 패턴 형성 방법
EP1951012B1 (en) * 2004-07-23 2011-07-20 Shinko Electric Industries Co., Ltd. Method of manufacturing a wiring board including electroplating
US20060030149A1 (en) * 2004-08-06 2006-02-09 Steven Leith Depositing material on photosensitive material
WO2007119966A1 (en) * 2006-04-13 2007-10-25 Lg Chem, Ltd. Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods
JP2009076727A (ja) * 2007-09-21 2009-04-09 Mitsubishi Electric Corp プリント配線板、それを用いた電子機器、及びその製造方法
FR2933686B1 (fr) * 2008-07-09 2010-11-19 Saint Gobain Emballage Composition de renforcement du verre creux et de protection de celui-ci contre la rayure, procedes de traitement correspondants et verre creux traite obtenu
JP5471987B2 (ja) * 2010-09-07 2014-04-16 株式会社大真空 電子部品パッケージ用封止部材、電子部品パッケージ、及び電子部品パッケージ用封止部材の製造方法
JP5693339B2 (ja) * 2011-04-06 2015-04-01 日本メクトロン株式会社 多層プリント配線板およびその製造方法
WO2012141096A1 (ja) * 2011-04-13 2012-10-18 株式会社村田製作所 フレキシブル多層基板
JP2013065824A (ja) * 2011-08-29 2013-04-11 Sony Corp トランジスタおよびその製造方法、並びに表示装置
US9398703B2 (en) * 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
CN107490936A (zh) * 2016-06-09 2017-12-19 株式会社田村制作所 固化涂膜的形成方法
CN107831610A (zh) * 2017-10-26 2018-03-23 惠科股份有限公司 信号传输装置及显示装置
AT521217B1 (de) 2018-05-11 2021-02-15 Thixotropic Piston Injection Tech Gmbh Modul für eine Druckgussvorrichtung
JP7363105B2 (ja) * 2019-05-31 2023-10-18 株式会社レゾナック 感光性樹脂組成物、感光性樹脂フィルム、プリント配線板及び半導体パッケージ、並びにプリント配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615446A (en) * 1968-01-15 1971-10-26 Itek Corp Photographic copy medium comprising a semiconductor layer with a photopolymerizable layer thereover
NL7001820A (ko) * 1970-02-10 1971-08-12
JPS5651343B2 (ko) * 1972-04-28 1981-12-04
DE2406400B2 (de) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
GB1478341A (en) * 1973-06-07 1977-06-29 Hitachi Chemical Co Ltd Printed circuit board and method of making the same
JPS5738436A (en) * 1980-08-21 1982-03-03 Fuji Xerox Co Ltd Electrophotographic receptor
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法

Also Published As

Publication number Publication date
DE69031159D1 (de) 1997-09-04
KR930004136B1 (ko) 1993-05-20
US5387493A (en) 1995-02-07
DE69031159T2 (de) 1998-01-08
JP2825558B2 (ja) 1998-11-18
EP0428870A3 (en) 1992-03-11
EP0428870A2 (en) 1991-05-29
EP0428870B1 (en) 1997-07-30
JPH03138653A (ja) 1991-06-13

Similar Documents

Publication Publication Date Title
KR910009129A (ko) 도체패턴형성용 감광성수지조성물과 다층프린트회로기판 및 그의 제조방법
KR890016886A (ko) 인쇄 회로판의 제조방법
HK152496A (en) Multilayer printed circuit board formation
EP0545328A3 (en) Printed circuit board manufacturing process
DE68926055T2 (de) Herstellungsverfahren einer mehrschichtigen Leiterplatte
EP0478313A3 (en) A multilayer printed circuit board and manufacturing method therefor
DE69120198D1 (de) Mehrschichtige, gedruckte Leiterplatte und Verfahren zu ihrer Herstellung
FI982568A0 (fi) Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi
DE69204516T2 (de) Leiterplatte mit Lötüberzug und Verfahren zu ihrer Herstellung.
DE69033784D1 (de) Gedruckte Schaltungsplatte
DE68908687T2 (de) Gedruckte Schaltungsplatte.
EP0478320A3 (en) Method for manufacturing printed circuit board
DE69020204T2 (de) Mehrschichtige gedruckte Leiterplatte.
HK1042555A1 (zh) 光敏樹脂組合物，使用光敏樹脂組合物的感光性元件，蝕刻圖形的製法及印刷線路板的製法
GB2246480B (en) A method of manufacturing a printed circuit board
DE68906160T2 (de) Gedruckte Schaltungsplatte.
DE3373775D1 (en) Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards
FR2632805B1 (fr) Plaque de masquage de carte de circuits imprimes equipee et son procede de fabrication
GB9202602D0 (en) Selective process for printed circuit board manufacturing
GB9027821D0 (en) A method of forming an insulating layer on a printed circuit board
FR2646583B1 (fr) Procede pour fabriquer des plaquettes a circuits imprimes
GB2247570B (en) A method of manufacturing a printed circuit board
KR970048507U (ko) 고밀도 인쇄회로 기판
DE396954T1 (de) Gedruckte schaltungsplatte.
GB2247359B (en) Method of manufacturing printed circuit boards

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20050502

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee