GB9202602D0 - Selective process for printed circuit board manufacturing - Google Patents

Selective process for printed circuit board manufacturing

Info

Publication number
GB9202602D0
GB9202602D0 GB929202602A GB9202602A GB9202602D0 GB 9202602 D0 GB9202602 D0 GB 9202602D0 GB 929202602 A GB929202602 A GB 929202602A GB 9202602 A GB9202602 A GB 9202602A GB 9202602 D0 GB9202602 D0 GB 9202602D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
board manufacturing
selective process
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB929202602A
Other versions
GB2253415A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eid Empresa De Investigacao E
Original Assignee
Eid Empresa De Investigacao E
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/653,342 external-priority patent/US5250105A/en
Application filed by Eid Empresa De Investigacao E filed Critical Eid Empresa De Investigacao E
Publication of GB9202602D0 publication Critical patent/GB9202602D0/en
Publication of GB2253415A publication Critical patent/GB2253415A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
GB9202602A 1991-02-08 1992-02-07 Selective process for printed circuit board manufacturing employing noble metal oxide catalyst. Withdrawn GB2253415A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/653,342 US5250105A (en) 1991-02-08 1991-02-08 Selective process for printing circuit board manufacturing
US71466091A 1991-06-13 1991-06-13

Publications (2)

Publication Number Publication Date
GB9202602D0 true GB9202602D0 (en) 1992-03-25
GB2253415A GB2253415A (en) 1992-09-09

Family

ID=27096494

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9202602A Withdrawn GB2253415A (en) 1991-02-08 1992-02-07 Selective process for printed circuit board manufacturing employing noble metal oxide catalyst.

Country Status (4)

Country Link
DE (1) DE4203577A1 (en)
FR (1) FR2672766A1 (en)
GB (1) GB2253415A (en)
IT (1) IT1254428B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4412463C3 (en) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh Process for the preparation of a palladium colloid solution and its use
DE19834348A1 (en) * 1998-07-30 2000-02-03 Grundig Ag Electronic control unit and individual components of the unit
DE19807823A1 (en) * 1998-02-26 1999-09-09 Fraunhofer Ges Forschung Process for the production of a corrosion-protective coating and layer system for substrates made of light metal
AU2001268035A1 (en) * 2000-03-21 2001-10-03 Bbj Environmental Solutions Inc. Aqueous cleaning composition with controlled ph
JP5715748B2 (en) * 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Conditioner for electroless plating

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB860917A (en) * 1956-05-14 1961-02-15 Nat Res Dev Improvements in and relating to electrical measuring instruments
DE1298826B (en) * 1963-02-05 1969-07-03 Siemens Ag Acid bath solution containing palladium (ó�) ions for the germination of surfaces of metallic or non-metallic bodies preactivated with tin (ó�) chloride
US3310432A (en) * 1963-07-11 1967-03-21 Corning Glass Works Method for applying electrical conductors on a smooth vitreous surface and article
GB1148532A (en) * 1965-08-06 1969-04-16 Giichi Okuno Baths for activating the surface of plastics to be chemically metal-plated
US3486928A (en) * 1965-10-21 1969-12-30 Int Nickel Co Bath and process for platinum and platinum alloys
DE2207511A1 (en) * 1972-02-17 1973-09-06 Plated Plastic Developments Lt Metal plating of non-conductors - by depositing catalyst on certain parts, followed by non-electrolytic plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4100037A (en) * 1976-03-08 1978-07-11 Western Electric Company, Inc. Method of depositing a metal on a surface
US4021314A (en) * 1976-03-25 1977-05-03 Western Electric Company, Inc. Method of depositing a metal on a surface
DE2659680C2 (en) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Procedure for activating surfaces
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
DE3574270D1 (en) * 1984-06-29 1989-12-21 Hitachi Chemical Co Ltd Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US5076841A (en) * 1990-05-31 1991-12-31 Shipley Company Inc. Coating composition

Also Published As

Publication number Publication date
FR2672766A1 (en) 1992-08-14
GB2253415A (en) 1992-09-09
ITMI920259A0 (en) 1992-02-10
DE4203577A1 (en) 1992-08-20
ITMI920259A1 (en) 1993-08-10
IT1254428B (en) 1995-09-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)