ITMI920259A1 - SELECTIVE PROCESS FOR THE PRODUCTION OF PLATES IN PRINTED CIRCUITS - Google Patents
SELECTIVE PROCESS FOR THE PRODUCTION OF PLATES IN PRINTED CIRCUITSInfo
- Publication number
- ITMI920259A1 ITMI920259A1 IT000259A ITMI920259A ITMI920259A1 IT MI920259 A1 ITMI920259 A1 IT MI920259A1 IT 000259 A IT000259 A IT 000259A IT MI920259 A ITMI920259 A IT MI920259A IT MI920259 A1 ITMI920259 A1 IT MI920259A1
- Authority
- IT
- Italy
- Prior art keywords
- plates
- production
- printed circuits
- selective process
- selective
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/653,342 US5250105A (en) | 1991-02-08 | 1991-02-08 | Selective process for printing circuit board manufacturing |
US71466091A | 1991-06-13 | 1991-06-13 |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI920259A0 ITMI920259A0 (en) | 1992-02-10 |
ITMI920259A1 true ITMI920259A1 (en) | 1993-08-10 |
IT1254428B IT1254428B (en) | 1995-09-25 |
Family
ID=27096494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI920259A IT1254428B (en) | 1991-02-08 | 1992-02-10 | SELECTIVE PROCESS FOR THE PRODUCTION OF PLATES IN PRINTED CIRCUITS |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE4203577A1 (en) |
FR (1) | FR2672766A1 (en) |
GB (1) | GB2253415A (en) |
IT (1) | IT1254428B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4412463C3 (en) * | 1994-04-08 | 2000-02-10 | Atotech Deutschland Gmbh | Process for the preparation of a palladium colloid solution and its use |
DE19834348A1 (en) * | 1998-07-30 | 2000-02-03 | Grundig Ag | Electronic control unit and individual components of the unit |
DE19807823A1 (en) | 1998-02-26 | 1999-09-09 | Fraunhofer Ges Forschung | Process for the production of a corrosion-protective coating and layer system for substrates made of light metal |
WO2001070922A1 (en) * | 2000-03-21 | 2001-09-27 | Bbj Environmental Solutions Inc. | Aqueous cleaning composition with controlled ph |
JP5715748B2 (en) * | 2008-10-31 | 2015-05-13 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | Conditioner for electroless plating |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB860917A (en) * | 1956-05-14 | 1961-02-15 | Nat Res Dev | Improvements in and relating to electrical measuring instruments |
DE1298826B (en) * | 1963-02-05 | 1969-07-03 | Siemens Ag | Acid bath solution containing palladium (ó�) ions for the germination of surfaces of metallic or non-metallic bodies preactivated with tin (ó�) chloride |
US3310432A (en) * | 1963-07-11 | 1967-03-21 | Corning Glass Works | Method for applying electrical conductors on a smooth vitreous surface and article |
GB1148532A (en) * | 1965-08-06 | 1969-04-16 | Giichi Okuno | Baths for activating the surface of plastics to be chemically metal-plated |
US3486928A (en) * | 1965-10-21 | 1969-12-30 | Int Nickel Co | Bath and process for platinum and platinum alloys |
DE2207511A1 (en) * | 1972-02-17 | 1973-09-06 | Plated Plastic Developments Lt | Metal plating of non-conductors - by depositing catalyst on certain parts, followed by non-electrolytic plating |
US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
US4100037A (en) * | 1976-03-08 | 1978-07-11 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
US4021314A (en) * | 1976-03-25 | 1977-05-03 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
DE2659680C2 (en) * | 1976-12-30 | 1985-01-31 | Ibm Deutschland Gmbh, 7000 Stuttgart | Procedure for activating surfaces |
US4073981A (en) * | 1977-03-11 | 1978-02-14 | Western Electric Company, Inc. | Method of selectively depositing metal on a surface |
DE3574270D1 (en) * | 1984-06-29 | 1989-12-21 | Hitachi Chemical Co Ltd | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent |
US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
US5076841A (en) * | 1990-05-31 | 1991-12-31 | Shipley Company Inc. | Coating composition |
-
1992
- 1992-02-07 DE DE4203577A patent/DE4203577A1/en not_active Ceased
- 1992-02-07 FR FR9201389A patent/FR2672766A1/en not_active Withdrawn
- 1992-02-07 GB GB9202602A patent/GB2253415A/en not_active Withdrawn
- 1992-02-10 IT ITMI920259A patent/IT1254428B/en active
Also Published As
Publication number | Publication date |
---|---|
GB9202602D0 (en) | 1992-03-25 |
IT1254428B (en) | 1995-09-25 |
DE4203577A1 (en) | 1992-08-20 |
GB2253415A (en) | 1992-09-09 |
ITMI920259A0 (en) | 1992-02-10 |
FR2672766A1 (en) | 1992-08-14 |
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