FI982568A0 - Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi - Google Patents
Menetelmä monikerroksisen painetun piirilevyn valmistamiseksiInfo
- Publication number
- FI982568A0 FI982568A0 FI982568A FI982568A FI982568A0 FI 982568 A0 FI982568 A0 FI 982568A0 FI 982568 A FI982568 A FI 982568A FI 982568 A FI982568 A FI 982568A FI 982568 A0 FI982568 A0 FI 982568A0
- Authority
- FI
- Finland
- Prior art keywords
- manufacturing
- circuit board
- printed circuit
- multilayer printed
- multilayer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19970065362 | 1997-12-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
FI982568A0 true FI982568A0 (fi) | 1998-11-27 |
FI982568A FI982568A (fi) | 1999-06-03 |
Family
ID=19526261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI982568A FI982568A (fi) | 1997-12-02 | 1998-11-27 | Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi |
Country Status (5)
Country | Link |
---|---|
US (1) | US6119335A (fi) |
JP (1) | JP3032753B2 (fi) |
KR (1) | KR100276270B1 (fi) |
FI (1) | FI982568A (fi) |
SE (1) | SE9804150L (fi) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6405431B1 (en) * | 1996-06-27 | 2002-06-18 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing build-up multi-layer printed circuit board by using yag laser |
JP3629375B2 (ja) * | 1998-11-27 | 2005-03-16 | 新光電気工業株式会社 | 多層回路基板の製造方法 |
US6711813B1 (en) | 1999-11-05 | 2004-03-30 | Interuniversitair Microelektronica Centrum | Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base |
DE60040408D1 (de) * | 1999-11-05 | 2008-11-13 | Imec Inter Uni Micro Electr | Verfahren zur herstellung einer laminierten leiterplatte |
US6803528B1 (en) * | 1999-11-05 | 2004-10-12 | 3M Innovative Properties Company | Multi-layer double-sided wiring board and method of fabricating the same |
US6467160B1 (en) * | 2000-03-28 | 2002-10-22 | International Business Machines Corporation | Fine pitch circuitization with unfilled plated through holes |
US20030039106A1 (en) * | 2000-04-14 | 2003-02-27 | Tatsunori Koyanagi | Double-sided wiring board and its manufacture method |
JP4854834B2 (ja) * | 2000-04-25 | 2012-01-18 | 三菱瓦斯化学株式会社 | 炭酸ガスレーザーによる銅張板への孔形成方法 |
JP3261119B2 (ja) * | 2000-05-16 | 2002-02-25 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
KR100370314B1 (ko) * | 2000-06-02 | 2003-01-30 | 주식회사 비아텍 | 빌드업 다층 인쇄회로판 제조방법 |
KR20020009794A (ko) * | 2000-07-27 | 2002-02-02 | 이형도 | Blind via hole을 갖는 다층인쇄회로기판의제조방법 |
KR20020017254A (ko) * | 2000-08-29 | 2002-03-07 | 이형도 | 기판의 홀 형성방법 |
JP2002232135A (ja) * | 2001-01-30 | 2002-08-16 | Matsushita Electric Ind Co Ltd | 積層用両面回路基板とその製造方法及びそれを用いた多層プリント配線板 |
US6864459B2 (en) * | 2001-02-08 | 2005-03-08 | The Regents Of The University Of California | High precision, rapid laser hole drilling |
US6879492B2 (en) * | 2001-03-28 | 2005-04-12 | International Business Machines Corporation | Hyperbga buildup laminate |
JP4791648B2 (ja) * | 2001-04-26 | 2011-10-12 | 日本シイエムケイ株式会社 | プリント配線板の非貫通孔加工方法 |
JP4034046B2 (ja) * | 2001-06-07 | 2008-01-16 | 日本碍子株式会社 | 高精度な貫通孔を有する多層板、及び、回路基板 |
JP2003007922A (ja) * | 2001-06-19 | 2003-01-10 | Sanyo Electric Co Ltd | 回路装置の製造方法 |
KR100433828B1 (ko) * | 2001-12-28 | 2004-05-31 | 삼성전기주식회사 | 빌드업 방식에 의한 pcb 제조용 필름형태의 절연재 |
KR100452153B1 (ko) * | 2002-10-15 | 2004-10-12 | 타이코에이엠피 주식회사 | 인쇄회로기판의 관통홀 측면도금방법 |
JP4373115B2 (ja) * | 2003-04-04 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
DE10319979A1 (de) * | 2003-05-05 | 2004-11-25 | Siemens Ag | Verfahren zum Herstellen einer Leiterplatte |
US7091124B2 (en) | 2003-11-13 | 2006-08-15 | Micron Technology, Inc. | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
US8084866B2 (en) | 2003-12-10 | 2011-12-27 | Micron Technology, Inc. | Microelectronic devices and methods for filling vias in microelectronic devices |
DE102004005300A1 (de) * | 2004-01-29 | 2005-09-08 | Atotech Deutschland Gmbh | Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens |
US7405143B2 (en) * | 2004-03-25 | 2008-07-29 | Asm International N.V. | Method for fabricating a seed layer |
US20050247894A1 (en) | 2004-05-05 | 2005-11-10 | Watkins Charles M | Systems and methods for forming apertures in microfeature workpieces |
KR100607626B1 (ko) * | 2004-05-25 | 2006-08-01 | 대덕전자 주식회사 | 인쇄 회로 기판에 있어서 레진 도포된 동박을 이용한 평탄코팅 공법 |
US7232754B2 (en) * | 2004-06-29 | 2007-06-19 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
DE102004040068B4 (de) * | 2004-08-18 | 2018-01-04 | Via Mechanics, Ltd. | Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks |
US7083425B2 (en) * | 2004-08-27 | 2006-08-01 | Micron Technology, Inc. | Slanted vias for electrical circuits on circuit boards and other substrates |
KR100776022B1 (ko) * | 2004-08-30 | 2007-11-16 | 엘지전자 주식회사 | 인쇄회로기판의 제조방법 |
US7300857B2 (en) | 2004-09-02 | 2007-11-27 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US7294791B2 (en) * | 2004-09-29 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same |
US7795134B2 (en) | 2005-06-28 | 2010-09-14 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US7262134B2 (en) | 2005-09-01 | 2007-08-28 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US7863187B2 (en) | 2005-09-01 | 2011-01-04 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US7622377B2 (en) * | 2005-09-01 | 2009-11-24 | Micron Technology, Inc. | Microfeature workpiece substrates having through-substrate vias, and associated methods of formation |
US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
KR100728764B1 (ko) * | 2005-11-10 | 2007-06-19 | 주식회사 토픽 | 다층인쇄회로기판 및 그 제조방법 |
KR100730782B1 (ko) * | 2006-04-13 | 2007-06-20 | (주)인터플렉스 | Uv-co2레이저를 이용한 연성회로기판 제조방법 |
JP2006205261A (ja) * | 2006-04-14 | 2006-08-10 | Hitachi Via Mechanics Ltd | プリント基板の穴あけ加工装置 |
US7749899B2 (en) | 2006-06-01 | 2010-07-06 | Micron Technology, Inc. | Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces |
JP4917361B2 (ja) * | 2006-06-13 | 2012-04-18 | 株式会社ディスコ | ビアホールの加工方法 |
US7629249B2 (en) | 2006-08-28 | 2009-12-08 | Micron Technology, Inc. | Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods |
US7902643B2 (en) | 2006-08-31 | 2011-03-08 | Micron Technology, Inc. | Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods |
KR100815323B1 (ko) | 2007-01-03 | 2008-03-19 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
TWI321970B (en) * | 2007-01-31 | 2010-03-11 | Advanced Semiconductor Eng | Package stucture with embedded capacitor and applications thereof |
US8440916B2 (en) | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
SG150410A1 (en) | 2007-08-31 | 2009-03-30 | Micron Technology Inc | Partitioned through-layer via and associated systems and methods |
PL2220332T3 (pl) * | 2007-11-05 | 2017-04-28 | Baker Hughes Incorporated | Sposoby i urządzenia do formowania elementów skrawania posiadających ukosowaną krawędź dla narzędzi do wiercenia w ziemi |
US10016876B2 (en) | 2007-11-05 | 2018-07-10 | Baker Hughes, A Ge Company, Llc | Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts |
US7884015B2 (en) | 2007-12-06 | 2011-02-08 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
KR100951449B1 (ko) | 2008-01-03 | 2010-04-07 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
CN102204418B (zh) * | 2008-10-30 | 2016-05-18 | At&S奥地利科技及系统技术股份公司 | 用于将电子部件集成到印制电路板中的方法 |
US8643181B2 (en) * | 2010-03-24 | 2014-02-04 | Stats Chippac Ltd. | Integrated circuit packaging system with encapsulation and method of manufacture thereof |
CN102548247B (zh) * | 2012-01-16 | 2014-07-23 | 惠州市蓝微电子有限公司 | 一种软硬结合板制造方法 |
US9059157B2 (en) | 2012-06-04 | 2015-06-16 | Stats Chippac Ltd. | Integrated circuit packaging system with substrate and method of manufacture thereof |
US9178009B2 (en) | 2012-10-10 | 2015-11-03 | Globalfoundries Inc. | Methods of forming a capacitor and contact structures |
CN103917049A (zh) * | 2013-11-22 | 2014-07-09 | 大连太平洋电子有限公司 | 一种采用次外层芯材减铜的激光钻孔板加工方法 |
CN103997862B (zh) * | 2014-06-05 | 2017-02-15 | 中国科学院微电子研究所 | 一种制作低应力低翘曲度超薄奇数层无芯板的方法 |
US9931714B2 (en) | 2015-09-11 | 2018-04-03 | Baker Hughes, A Ge Company, Llc | Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams |
JP2017123376A (ja) * | 2016-01-05 | 2017-07-13 | イビデン株式会社 | プリント配線板 |
EP3796116A3 (en) * | 2016-09-15 | 2021-06-23 | IO Tech Group, Ltd. | Method and system for additive-ablative fabrication |
CN112118688A (zh) * | 2019-06-21 | 2020-12-22 | 李家铭 | 背胶铜箔增层制程 |
US11877404B2 (en) * | 2020-02-13 | 2024-01-16 | Averatek Corporation | Catalyzed metal foil and uses thereof |
WO2021163440A1 (en) * | 2020-02-13 | 2021-08-19 | Averatek Corporation | Catalyzed metal foil and uses thereof |
DE102020131954A1 (de) * | 2020-12-02 | 2022-06-02 | Auto-Kabel Management Gmbh | Verfahren zur Folienbeschichtung mittels Laser |
CN114449765A (zh) * | 2022-01-18 | 2022-05-06 | 深圳恒宝士线路板有限公司 | 一种替代激光制作盲孔的hdi板制作方法 |
CN116390363B (zh) * | 2023-06-02 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | 基于镭射光圈直径及强度调整的hdi印刷电路板开窗方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4933045A (en) * | 1989-06-02 | 1990-06-12 | International Business Machines Corporation | Thin film multilayer laminate interconnection board assembly method |
JP2658661B2 (ja) * | 1991-09-18 | 1997-09-30 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
US5232548A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Discrete fabrication of multi-layer thin film, wiring structures |
JP2707903B2 (ja) * | 1992-01-28 | 1998-02-04 | 日本電気株式会社 | 多層プリント配線板の製造方法 |
JP3482657B2 (ja) * | 1993-07-16 | 2003-12-22 | 松下電器産業株式会社 | 回路基板及びその製造方法 |
JPH08279678A (ja) * | 1995-04-04 | 1996-10-22 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
KR100222752B1 (ko) * | 1996-06-27 | 1999-10-01 | 이형도 | 레이저를 이용한 다층 인쇄회로기판의 제조방법 |
-
1998
- 1998-11-27 FI FI982568A patent/FI982568A/fi unknown
- 1998-11-30 KR KR1019980051736A patent/KR100276270B1/ko not_active IP Right Cessation
- 1998-12-01 SE SE9804150A patent/SE9804150L/xx not_active Application Discontinuation
- 1998-12-02 US US09/203,489 patent/US6119335A/en not_active Expired - Lifetime
- 1998-12-02 JP JP10357019A patent/JP3032753B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH11266084A (ja) | 1999-09-28 |
SE9804150D0 (sv) | 1998-12-01 |
FI982568A (fi) | 1999-06-03 |
US6119335A (en) | 2000-09-19 |
SE9804150L (sv) | 1999-06-03 |
KR19990062638A (ko) | 1999-07-26 |
JP3032753B2 (ja) | 2000-04-17 |
KR100276270B1 (ko) | 2001-04-02 |
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