DE69215338T2 - Mehrschichtige Leiterplatte, Zwischenverbindungsteil und Verfahren zur Herstellung - Google Patents

Mehrschichtige Leiterplatte, Zwischenverbindungsteil und Verfahren zur Herstellung

Info

Publication number
DE69215338T2
DE69215338T2 DE69215338T DE69215338T DE69215338T2 DE 69215338 T2 DE69215338 T2 DE 69215338T2 DE 69215338 T DE69215338 T DE 69215338T DE 69215338 T DE69215338 T DE 69215338T DE 69215338 T2 DE69215338 T2 DE 69215338T2
Authority
DE
Germany
Prior art keywords
production
circuit board
printed circuit
connecting part
intermediate connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69215338T
Other languages
English (en)
Other versions
DE69215338D1 (de
Inventor
Stanley J Wallce
Joseph A Swift
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE69215338D1 publication Critical patent/DE69215338D1/de
Publication of DE69215338T2 publication Critical patent/DE69215338T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE69215338T 1991-12-18 1992-12-14 Mehrschichtige Leiterplatte, Zwischenverbindungsteil und Verfahren zur Herstellung Expired - Lifetime DE69215338T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80912691A 1991-12-18 1991-12-18

Publications (2)

Publication Number Publication Date
DE69215338D1 DE69215338D1 (de) 1997-01-02
DE69215338T2 true DE69215338T2 (de) 1997-03-27

Family

ID=25200601

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69215338T Expired - Lifetime DE69215338T2 (de) 1991-12-18 1992-12-14 Mehrschichtige Leiterplatte, Zwischenverbindungsteil und Verfahren zur Herstellung

Country Status (4)

Country Link
US (1) US5281771A (de)
EP (1) EP0547852B1 (de)
JP (1) JPH05251121A (de)
DE (1) DE69215338T2 (de)

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JP3057924B2 (ja) * 1992-09-22 2000-07-04 松下電器産業株式会社 両面プリント基板およびその製造方法
US5414216A (en) * 1993-10-12 1995-05-09 Xerox Corporation Electrostatographic reproducing machine resistive carbon fiber wire
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
JPH0997643A (ja) * 1995-09-29 1997-04-08 Shin Etsu Polymer Co Ltd 低抵抗コネクタと、その製造方法
US5599615A (en) * 1995-11-09 1997-02-04 Xerox Corporation High performance electric contacts
US6000126A (en) * 1996-03-29 1999-12-14 General Dynamics Information Systems, Inc. Method and apparatus for connecting area grid arrays to printed wire board
US5858452A (en) * 1996-05-16 1999-01-12 Sendx Medical, Inc. Method for fabricating wiring substrate with subminiature thru-holes
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
JP3420435B2 (ja) * 1996-07-09 2003-06-23 松下電器産業株式会社 基板の製造方法、半導体装置及び半導体装置の製造方法
US6246012B1 (en) 1999-03-24 2001-06-12 Xerox Corporation Electroplated conductive carbon fibers with adhesive
JP2000331538A (ja) 1999-05-17 2000-11-30 Nitto Denko Corp 異方導電性フィルムおよびその製造方法
US6469256B1 (en) * 2000-02-01 2002-10-22 International Business Machines Corporation Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
US6570102B2 (en) 2000-02-01 2003-05-27 International Business Machines Corporation Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
JP2005032769A (ja) * 2003-07-07 2005-02-03 Seiko Epson Corp 多層配線の形成方法、配線基板の製造方法、デバイスの製造方法
US20050031840A1 (en) * 2003-08-05 2005-02-10 Xerox Corporation RF connector
US7052763B2 (en) * 2003-08-05 2006-05-30 Xerox Corporation Multi-element connector
DE102006037185A1 (de) * 2005-09-27 2007-03-29 Electrovac Ag Verfahren zur Behandlung von Nanofasermaterial sowie Zusammensetzung aus Nanofasermaterial
US7220131B1 (en) * 2005-12-20 2007-05-22 Xerox Corporation Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces
WO2007142273A1 (ja) * 2006-06-08 2007-12-13 International Business Machines Corporation 高熱伝導で柔軟なシート
US7847191B2 (en) 2007-11-06 2010-12-07 Xerox Corporation Electrical component, manufacturing system and method
CN101918170B (zh) * 2008-01-03 2015-09-02 怡德乐纳斯公司 焊料线缆结构
JP5164878B2 (ja) * 2009-02-17 2013-03-21 富士フイルム株式会社 異方導電性部材およびその製造方法
US8207446B2 (en) * 2009-03-12 2012-06-26 Xerox Corporation Non-metallic, integrated sensor-interconnect device, manufacturing process, and related applications
US8721850B2 (en) * 2010-02-02 2014-05-13 Roche Diagnostics Operations, Inc. Biosensor and methods for manufacturing
US9173282B2 (en) 2010-03-31 2015-10-27 Georgia Tech Research Corporation Interconnect structures and methods of making the same
US20150195897A1 (en) 2014-01-08 2015-07-09 Joseph A. Swift Apparatus having management of electrical power capacity regions and management of thermal capacity regions
JP6596551B1 (ja) * 2018-09-06 2019-10-23 株式会社フジクラ 電子部品ユニット
KR20210121445A (ko) * 2020-03-30 2021-10-08 (주)포인트엔지니어링 양극산화막 구조체

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265892A (en) * 1975-11-26 1977-05-31 Shinetsu Polymer Co Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof
US4209481A (en) * 1976-04-19 1980-06-24 Toray Industries, Inc. Process for producing an anisotropically electroconductive sheet
US4170677A (en) * 1977-11-16 1979-10-09 The United States Of America As Represented By The Secretary Of The Army Anisotropic resistance bonding technique
JPS5555985U (de) * 1978-10-12 1980-04-16
US4358699A (en) * 1980-06-05 1982-11-09 The University Of Virginia Alumni Patents Foundation Versatile electrical fiber brush and method of making
JPS5740874A (en) * 1980-08-22 1982-03-06 Shinetsu Polymer Co Pressure contact holding type connector
US4449774A (en) * 1981-02-05 1984-05-22 Shin-Etsu Polymer Co., Ltd. Electroconductive rubbery member and elastic connector therewith
NL193609C (nl) * 1981-12-30 2000-04-04 Bekaert Sa Nv Samengestelde streng voor verwerking als granulaat in kunststofproducten en werkwijze voor het vervaardigen van een kunststofmenggranulaat.
EP0105639B1 (de) * 1982-09-08 1988-01-07 Kabushiki Kaisha Toshiba Produktion eines Widerstandes ausgehend von isolierendem Material durch lokale Heizung
JPS60167491A (ja) * 1984-02-10 1985-08-30 株式会社東芝 導体路形成方法
GB8405598D0 (en) * 1984-03-02 1984-04-04 Plessey Co Plc Electrical connectors
US4642889A (en) * 1985-04-29 1987-02-17 Amp Incorporated Compliant interconnection and method therefor
US4641949A (en) * 1985-08-26 1987-02-10 Xerox Corporation Conductive brush paper position sensor
ATE83883T1 (de) * 1985-09-04 1993-01-15 Ufe Inc Herstellung von gedruckten schaltungen.
US4988306A (en) * 1989-05-16 1991-01-29 Labinal Components And Systems, Inc. Low-loss electrical interconnects
US4967314A (en) * 1988-03-28 1990-10-30 Prime Computer Inc. Circuit board construction
US4841099A (en) * 1988-05-02 1989-06-20 Xerox Corporation Electrically insulating polymer matrix with conductive path formed in situ
US4970553A (en) * 1989-12-04 1990-11-13 Xerox Corporation Electrical component with conductive path
CA2037801C (en) * 1990-04-16 2001-04-24 Thomas E. Orlowski Fibrillated pultruded electrical component

Also Published As

Publication number Publication date
EP0547852A3 (de) 1994-02-16
EP0547852A2 (de) 1993-06-23
EP0547852B1 (de) 1996-11-20
DE69215338D1 (de) 1997-01-02
JPH05251121A (ja) 1993-09-28
US5281771A (en) 1994-01-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition