DE3774079D1 - Harzzusammensetzung fuer leiterplatten fuer gedruckte schaltungen und ihre verwendung zur herstellung von leiterplatten. - Google Patents

Harzzusammensetzung fuer leiterplatten fuer gedruckte schaltungen und ihre verwendung zur herstellung von leiterplatten.

Info

Publication number
DE3774079D1
DE3774079D1 DE8787117158T DE3774079T DE3774079D1 DE 3774079 D1 DE3774079 D1 DE 3774079D1 DE 8787117158 T DE8787117158 T DE 8787117158T DE 3774079 T DE3774079 T DE 3774079T DE 3774079 D1 DE3774079 D1 DE 3774079D1
Authority
DE
Germany
Prior art keywords
pcbs
resin composition
producing
printed circuits
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787117158T
Other languages
English (en)
Inventor
Katuo Sugawara
Akio Takahashi
Masahiro Ono
Toshikazu Narahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3774079D1 publication Critical patent/DE3774079D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3472—Woven fabric including an additional woven fabric layer
    • Y10T442/3528—Three or more fabric layers
    • Y10T442/3594—Woven fabric layers impregnated with a thermoplastic resin [e.g., vinyl polymer, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
DE8787117158T 1986-11-21 1987-11-20 Harzzusammensetzung fuer leiterplatten fuer gedruckte schaltungen und ihre verwendung zur herstellung von leiterplatten. Expired - Lifetime DE3774079D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27659186 1986-11-21

Publications (1)

Publication Number Publication Date
DE3774079D1 true DE3774079D1 (de) 1991-11-28

Family

ID=17571583

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787117158T Expired - Lifetime DE3774079D1 (de) 1986-11-21 1987-11-20 Harzzusammensetzung fuer leiterplatten fuer gedruckte schaltungen und ihre verwendung zur herstellung von leiterplatten.

Country Status (3)

Country Link
US (2) US4946734A (de)
EP (1) EP0269021B1 (de)
DE (1) DE3774079D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874828A (en) * 1987-10-01 1989-10-17 Hercules Incorporated Heat resistant thermosetting phosphazene-imide copolymers
US4925772A (en) * 1987-11-26 1990-05-15 Siemens Aktiengesellschaft Anti-radiation covering for electronic components
MY104468A (en) * 1988-09-12 1994-04-30 Mitsui Toatsu Chemicals Incorporated Resin compositions for sealing semiconductors
US5071701A (en) * 1989-11-22 1991-12-10 B. F. Goodrich Corporation Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
JPH10135634A (ja) * 1990-03-19 1998-05-22 Hitachi Ltd 多層配線基板及びその製造方法
US5374469A (en) * 1991-09-19 1994-12-20 Nitto Denko Corporation Flexible printed substrate
WO1995000576A1 (en) * 1993-06-22 1995-01-05 Akzo Nobel N.V. Novel phthalimides and reversibly crosslinked imide polymers
JP3821870B2 (ja) * 1994-10-07 2006-09-13 スリーエム カンパニー 難燃性熱硬化性樹脂組成物
JP3362217B2 (ja) * 1998-07-14 2003-01-07 大塚化学株式会社 難燃性樹脂組成物
KR100538176B1 (ko) * 2000-07-18 2005-12-21 교세라 케미카르 가부시키가이샤 할로겐 프리 난연성 에폭시수지조성물, 할로겐 프리빌드업 다층판용 난연성 에폭시수지조성물, 프리프레그,동장 적층판, 프린트배선판, 동박부착 수지필름,캐리어부착 수지필름, 빌드업형 적층판 및 빌드업형 다층판
US6727591B2 (en) * 2001-03-26 2004-04-27 Ibiden Co., Ltd. Multi-piece substrate and method of manufacturing the substrate
US20080166390A1 (en) * 2006-04-11 2008-07-10 Andrianov Alexander K Biodegradable polyphosphazenes containing pyrrolidone side groups
CN112079868A (zh) * 2020-08-18 2020-12-15 艾蒙特成都新材料科技有限公司 一种无卤阻燃环三膦腈型马来酰亚胺树脂、层压板及其制备方法
CN115819766B (zh) * 2022-12-27 2024-06-07 苏州生益科技有限公司 改性马来酰亚胺预聚物、树脂组合物及树脂组合物的应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4191715A (en) * 1978-07-03 1980-03-04 Monsanto Company Flame retarding compound
US4276344A (en) * 1980-08-05 1981-06-30 Varma Indra K Phosphorus-containing bisimide resins
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
US4634759A (en) * 1984-04-11 1987-01-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Fire and heat resistant laminating resins based on maleimido substituted aromatic cyclotriphosphazene polymer
US4550177A (en) * 1984-04-11 1985-10-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Maleimido substituted aromatic cyclotriphosphazenes

Also Published As

Publication number Publication date
EP0269021A1 (de) 1988-06-01
US5041478A (en) 1991-08-20
EP0269021B1 (de) 1991-10-23
US4946734A (en) 1990-08-07

Similar Documents

Publication Publication Date Title
DE68909853D1 (de) Verfahren und Film zur Herstellung von gedruckten Schaltungsplatten.
DE69402448D1 (de) Gedruckte Schaltungsplatte oder Schaltungskarte zur direkten Befestigung von Chips und ihre Herstellung
DE58907030D1 (de) Verfahren zur Herstellung von Leiterplatten.
DE3785487D1 (de) Verfahren zur herstellung von traegern fuer gedruckte schaltungen.
DE3586666D1 (de) Karte mit ic-baustein und verfahren zur herstellung derselben.
DE68921732D1 (de) Verfahren zur Herstellung von gedruckten Mehrschicht-Leiterplatten.
DE3782972D1 (de) Ic-karte und verfahren zur herstellung derselben.
DE3673359D1 (de) Verfahren zur herstellung von gedruckten schaltungsplatten.
DE69125233D1 (de) Verfahren zur Herstellung von gedruckten Schaltungen
DE3853456D1 (de) Harzzusammensetzung für gedruckte Schaltungen.
DE69331511D1 (de) Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung
DE69631573D1 (de) Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung
DE69418698D1 (de) Verfahren zur Herstellung von Leiterplatten
DE3784751D1 (de) Verfahren zur herstellung von verbindungsloechern auf integrierten schaltungen.
DE69325936D1 (de) Verfahren zur Herstellung von Platten für gedruckte Schaltungen
DE69123120D1 (de) Verfahren zur Herstellung von gedruckten Leiterplatten
DE68923417D1 (de) Verfahren zur herstellung von keramischen elektronischen schichtbauelementen.
DE69431828D1 (de) Verfahren zur Herstellung von gedruckten Schaltungskarten
DE3774079D1 (de) Harzzusammensetzung fuer leiterplatten fuer gedruckte schaltungen und ihre verwendung zur herstellung von leiterplatten.
DE68920646D1 (de) Härtbare Polyphenylenether/Polyepoxid-Zusammensetzung, verwendbar zur Herstellung von Leiterplatten für gedruckte Schaltungen.
DE3587780D1 (de) Elektronisches Bauelement und Verfahren zur Herstellung.
DE68920540D1 (de) Schaltungsteil unter Verwendung von mehrschichtigen gedruckten Leiterplatten und Verfahren zu dessen Herstellung.
DE3786785D1 (de) Verfahren zur herstellung von mos-bauelementen fuer integrierte schaltungen.
DE69934379D1 (de) Verbundmaterial zur Verwendung in der Herstellung von gedruckten Leiterplatten
DE3769484D1 (de) Verfahren zur herstellung von gedruckten leiterplatten.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee