GB2257711B - Aqueous photosensitive resin composition, preparation thereof and preparation of printed circuit board using the composition - Google Patents

Aqueous photosensitive resin composition, preparation thereof and preparation of printed circuit board using the composition

Info

Publication number
GB2257711B
GB2257711B GB9214858A GB9214858A GB2257711B GB 2257711 B GB2257711 B GB 2257711B GB 9214858 A GB9214858 A GB 9214858A GB 9214858 A GB9214858 A GB 9214858A GB 2257711 B GB2257711 B GB 2257711B
Authority
GB
United Kingdom
Prior art keywords
preparation
composition
circuit board
printed circuit
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9214858A
Other versions
GB2257711A (en
GB9214858D0 (en
Inventor
Yoshichi Hagiwara
Hiroshi Samukawa
Katsue Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WR Grace and Co Conn
WR Grace and Co
P T Sub Inc
Original Assignee
WR Grace and Co Conn
WR Grace and Co
P T Sub Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15938352&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GB2257711(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by WR Grace and Co Conn, WR Grace and Co, P T Sub Inc filed Critical WR Grace and Co Conn
Publication of GB9214858D0 publication Critical patent/GB9214858D0/en
Publication of GB2257711A publication Critical patent/GB2257711A/en
Application granted granted Critical
Publication of GB2257711B publication Critical patent/GB2257711B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
GB9214858A 1991-07-12 1992-07-13 Aqueous photosensitive resin composition, preparation thereof and preparation of printed circuit board using the composition Expired - Fee Related GB2257711B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3172247A JP3040202B2 (en) 1991-07-12 1991-07-12 Aqueous photosensitive resin composition and method for producing printed circuit board using the same

Publications (3)

Publication Number Publication Date
GB9214858D0 GB9214858D0 (en) 1992-08-26
GB2257711A GB2257711A (en) 1993-01-20
GB2257711B true GB2257711B (en) 1995-09-20

Family

ID=15938352

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9214858A Expired - Fee Related GB2257711B (en) 1991-07-12 1992-07-13 Aqueous photosensitive resin composition, preparation thereof and preparation of printed circuit board using the composition

Country Status (6)

Country Link
JP (1) JP3040202B2 (en)
CA (1) CA2072702A1 (en)
GB (1) GB2257711B (en)
HK (1) HK22696A (en)
TW (1) TW236071B (en)
ZA (1) ZA924998B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258832A (en) * 1992-11-17 1994-09-16 W R Grace & Co Photosensitive resin composition
US5445919A (en) * 1993-06-14 1995-08-29 Fuji Photo Film Co., Ltd. Photopolymerizable composition
AU660882B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having non-ionic fluorocarbon surfactants
US5364737A (en) * 1994-01-25 1994-11-15 Morton International, Inc. Waterbone photoresists having associate thickeners
AU661438B1 (en) * 1994-01-25 1995-07-20 Morton International, Inc. Waterborne photoresists having polysiloxanes
AU660881B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having binders neutralized with amino acrylates
JPH08289942A (en) * 1995-04-25 1996-11-05 Yukio Tsunoda Golf club
US5512607A (en) * 1995-06-06 1996-04-30 W. R. Grace & Co.-Conn. Unsaturated epoxy ester with quaternary ammonium and phosphate groups
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
JPH0915857A (en) * 1995-06-29 1997-01-17 Hitachi Chem Co Ltd Colored image forming material, photosensitive solution using it, photosensitive element, and manufacture of color filter
EP1451640A1 (en) * 2001-12-03 2004-09-01 Showa Denko K.K. Photosensitive composition and production processes for photosensitive film and printed wiring board
ATE376036T1 (en) * 2002-05-06 2007-11-15 Sun Chemical Corp SINGLE-PHASE WATER-BASED ENERGY CURRENT COMPOSITIONS AND METHOD FOR PRODUCING COATINGS AND PRINTING INKS
US7226959B2 (en) 2003-11-06 2007-06-05 Sun Chemical Corporation Water soluble energy curable stereo-crosslinkable ionomer compositions
JP5624288B2 (en) * 2009-06-30 2014-11-12 互応化学工業株式会社 Manufacturing method of printed wiring board with through hole
WO2011122473A1 (en) 2010-03-29 2011-10-06 三菱製紙株式会社 Photosensitive composition and photosensitive lithographic printing plate material
JP7181775B2 (en) * 2017-12-12 2022-12-01 三洋化成工業株式会社 Aqueous (co)polymer composition
CN115197381B (en) * 2022-09-16 2022-11-25 广州鹿山新材料股份有限公司 Unsaturated SMA resin modified polypropylene and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0261910A2 (en) * 1986-09-22 1988-03-30 Nippon Paint Co., Ltd. Water-developable photosensitive plate and its production
GB2198741A (en) * 1984-04-03 1988-06-22 Wolfen Filmfab Veb Photopolymerisable materials
EP0287019A2 (en) * 1987-04-16 1988-10-19 W.R. Grace & Co.-Conn. Aqueous developable, radiation curable composition
EP0295944A2 (en) * 1987-06-18 1988-12-21 Napp Systems (Usa) Inc. Photosensitive resin composition and printing plate prepared therefrom
EP0481709A1 (en) * 1990-10-16 1992-04-22 Hitachi Chemical Company, Ltd. Negative type photosensitive electrodepositing resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2198741A (en) * 1984-04-03 1988-06-22 Wolfen Filmfab Veb Photopolymerisable materials
EP0261910A2 (en) * 1986-09-22 1988-03-30 Nippon Paint Co., Ltd. Water-developable photosensitive plate and its production
EP0287019A2 (en) * 1987-04-16 1988-10-19 W.R. Grace & Co.-Conn. Aqueous developable, radiation curable composition
EP0295944A2 (en) * 1987-06-18 1988-12-21 Napp Systems (Usa) Inc. Photosensitive resin composition and printing plate prepared therefrom
EP0481709A1 (en) * 1990-10-16 1992-04-22 Hitachi Chemical Company, Ltd. Negative type photosensitive electrodepositing resin composition

Also Published As

Publication number Publication date
GB2257711A (en) 1993-01-20
ZA924998B (en) 1994-09-26
JPH0527437A (en) 1993-02-05
GB9214858D0 (en) 1992-08-26
TW236071B (en) 1994-12-11
CA2072702A1 (en) 1993-01-13
JP3040202B2 (en) 2000-05-15
HK22696A (en) 1996-02-16

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980713