ZA924998B - Aqueous photosensitive resin compsition and print obtained by using the same - Google Patents

Aqueous photosensitive resin compsition and print obtained by using the same

Info

Publication number
ZA924998B
ZA924998B ZA924998A ZA924998A ZA924998B ZA 924998 B ZA924998 B ZA 924998B ZA 924998 A ZA924998 A ZA 924998A ZA 924998 A ZA924998 A ZA 924998A ZA 924998 B ZA924998 B ZA 924998B
Authority
ZA
South Africa
Prior art keywords
same
photosensitive resin
print obtained
aqueous photosensitive
compsition
Prior art date
Application number
ZA924998A
Inventor
Katsue Nishikawa
Yoshichi Hagiwara
Hiroshi Samukawa
Original Assignee
W R Grace & Co-Conn Us
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15938352&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA924998(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by W R Grace & Co-Conn Us filed Critical W R Grace & Co-Conn Us
Publication of ZA924998B publication Critical patent/ZA924998B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
ZA924998A 1991-07-12 1992-07-06 Aqueous photosensitive resin compsition and print obtained by using the same ZA924998B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3172247A JP3040202B2 (en) 1991-07-12 1991-07-12 Aqueous photosensitive resin composition and method for producing printed circuit board using the same

Publications (1)

Publication Number Publication Date
ZA924998B true ZA924998B (en) 1994-09-26

Family

ID=15938352

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA924998A ZA924998B (en) 1991-07-12 1992-07-06 Aqueous photosensitive resin compsition and print obtained by using the same

Country Status (6)

Country Link
JP (1) JP3040202B2 (en)
CA (1) CA2072702A1 (en)
GB (1) GB2257711B (en)
HK (1) HK22696A (en)
TW (1) TW236071B (en)
ZA (1) ZA924998B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258832A (en) * 1992-11-17 1994-09-16 W R Grace & Co Photosensitive resin composition
US5445919A (en) * 1993-06-14 1995-08-29 Fuji Photo Film Co., Ltd. Photopolymerizable composition
AU660882B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having non-ionic fluorocarbon surfactants
US5364737A (en) * 1994-01-25 1994-11-15 Morton International, Inc. Waterbone photoresists having associate thickeners
AU661438B1 (en) * 1994-01-25 1995-07-20 Morton International, Inc. Waterborne photoresists having polysiloxanes
AU660881B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having binders neutralized with amino acrylates
JPH08289942A (en) * 1995-04-25 1996-11-05 Yukio Tsunoda Golf club
US5512607A (en) * 1995-06-06 1996-04-30 W. R. Grace & Co.-Conn. Unsaturated epoxy ester with quaternary ammonium and phosphate groups
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
JPH0915857A (en) * 1995-06-29 1997-01-17 Hitachi Chem Co Ltd Colored image forming material, photosensitive solution using it, photosensitive element, and manufacture of color filter
EP1451640A1 (en) * 2001-12-03 2004-09-01 Showa Denko K.K. Photosensitive composition and production processes for photosensitive film and printed wiring board
ATE376036T1 (en) * 2002-05-06 2007-11-15 Sun Chemical Corp SINGLE-PHASE WATER-BASED ENERGY CURRENT COMPOSITIONS AND METHOD FOR PRODUCING COATINGS AND PRINTING INKS
US7226959B2 (en) 2003-11-06 2007-06-05 Sun Chemical Corporation Water soluble energy curable stereo-crosslinkable ionomer compositions
JP5624288B2 (en) * 2009-06-30 2014-11-12 互応化学工業株式会社 Manufacturing method of printed wiring board with through hole
WO2011122473A1 (en) 2010-03-29 2011-10-06 三菱製紙株式会社 Photosensitive composition and photosensitive lithographic printing plate material
JP7181775B2 (en) * 2017-12-12 2022-12-01 三洋化成工業株式会社 Aqueous (co)polymer composition
CN115197381B (en) * 2022-09-16 2022-11-25 广州鹿山新材料股份有限公司 Unsaturated SMA resin modified polypropylene and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD250593A1 (en) * 1984-04-03 1987-10-14 Wolfen Filmfab Veb PHOTOPOLYMERIZABLE MATERIAL
PT85756A (en) * 1986-09-22 1988-10-14 Napp Systems Inc PROCESS FOR THE PREPARATION OF PHOTOSENSIVE AND REVEALED SHEETS WITH WATER
EP0287019A3 (en) * 1987-04-16 1990-07-11 W.R. Grace & Co.-Conn. Aqueous developable, radiation curable composition
EP0295944A3 (en) * 1987-06-18 1989-09-06 Napp Systems (Usa) Inc. Photosensitive resin composition and printing plate prepared therefrom
US5403698A (en) * 1990-10-16 1995-04-04 Hitachi Chemical Company, Ltd. Negative type photosensitive electrodepositing resin composition

Also Published As

Publication number Publication date
GB2257711A (en) 1993-01-20
GB2257711B (en) 1995-09-20
JPH0527437A (en) 1993-02-05
GB9214858D0 (en) 1992-08-26
TW236071B (en) 1994-12-11
CA2072702A1 (en) 1993-01-13
JP3040202B2 (en) 2000-05-15
HK22696A (en) 1996-02-16

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