GB9125173D0 - Printed circuit combination and process - Google Patents
Printed circuit combination and processInfo
- Publication number
- GB9125173D0 GB9125173D0 GB919125173A GB9125173A GB9125173D0 GB 9125173 D0 GB9125173 D0 GB 9125173D0 GB 919125173 A GB919125173 A GB 919125173A GB 9125173 A GB9125173 A GB 9125173A GB 9125173 D0 GB9125173 D0 GB 9125173D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit combination
- combination
- printed
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919125173A GB9125173D0 (en) | 1991-11-27 | 1991-11-27 | Printed circuit combination and process |
PCT/GB1992/002171 WO1993011652A1 (en) | 1991-11-27 | 1992-11-25 | Printed circuit combination and process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919125173A GB9125173D0 (en) | 1991-11-27 | 1991-11-27 | Printed circuit combination and process |
Publications (1)
Publication Number | Publication Date |
---|---|
GB9125173D0 true GB9125173D0 (en) | 1992-01-29 |
Family
ID=10705299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB919125173A Pending GB9125173D0 (en) | 1991-11-27 | 1991-11-27 | Printed circuit combination and process |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB9125173D0 (en) |
WO (1) | WO1993011652A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
WO1995024821A1 (en) * | 1994-03-08 | 1995-09-14 | Teledyne Industries, Inc. | Fabrication multilayer combined rigid/flex printed circuit board |
US5784782A (en) * | 1996-09-06 | 1998-07-28 | International Business Machines Corporation | Method for fabricating printed circuit boards with cavities |
US8071883B2 (en) | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
EP2278866B1 (en) * | 2006-10-24 | 2012-05-09 | Ibiden Co., Ltd. | Flex-rigid wiring board |
US7982135B2 (en) | 2006-10-30 | 2011-07-19 | Ibiden Co., Ltd. | Flex-rigid wiring board and method of manufacturing the same |
EP1951016B1 (en) * | 2006-10-30 | 2013-05-29 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
WO2009113202A1 (en) | 2008-03-10 | 2009-09-17 | イビデン株式会社 | Flexible wiring board, and its manufacturing method |
EP2547183A1 (en) | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
EP2547182A1 (en) * | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof |
CN103327738B (en) * | 2012-03-22 | 2016-03-09 | 富葵精密组件(深圳)有限公司 | Rigid-flexible circuit board and preparation method thereof |
US9764532B2 (en) * | 2014-07-01 | 2017-09-19 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
WO2017017127A1 (en) * | 2015-07-28 | 2017-02-02 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Stretchable electronic component carrier |
DE102015223551A1 (en) * | 2015-11-27 | 2017-06-01 | Robert Bosch Gmbh | Circuit carrier for an electrical circuit and associated manufacturing method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
DE3624718A1 (en) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | MULTI-LAYER, RIGID AND FLEXIBLE AREAS HAVING PCB |
DE3624719A1 (en) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | PRELAMINATE FOR RIGID-FLEXIBLE PCB |
US4800461A (en) * | 1987-11-02 | 1989-01-24 | Teledyne Industries, Inc. | Multilayer combined rigid and flex printed circuits |
-
1991
- 1991-11-27 GB GB919125173A patent/GB9125173D0/en active Pending
-
1992
- 1992-11-25 WO PCT/GB1992/002171 patent/WO1993011652A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO1993011652A1 (en) | 1993-06-10 |
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