DE69905846D1 - Flexible Leiterplatte, Polyamidsäure und diese enthaltende Polyamidsäure-Lack - Google Patents

Flexible Leiterplatte, Polyamidsäure und diese enthaltende Polyamidsäure-Lack

Info

Publication number
DE69905846D1
DE69905846D1 DE69905846T DE69905846T DE69905846D1 DE 69905846 D1 DE69905846 D1 DE 69905846D1 DE 69905846 T DE69905846 T DE 69905846T DE 69905846 T DE69905846 T DE 69905846T DE 69905846 D1 DE69905846 D1 DE 69905846D1
Authority
DE
Germany
Prior art keywords
polyamic acid
circuit board
printed circuit
flexible printed
lacquer containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69905846T
Other languages
English (en)
Other versions
DE69905846T2 (de
Inventor
Satoshi Takahashi
Hidetsugu Namiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP36334598A external-priority patent/JP3389870B2/ja
Priority claimed from JP01365499A external-priority patent/JP3379459B2/ja
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Application granted granted Critical
Publication of DE69905846D1 publication Critical patent/DE69905846D1/de
Publication of DE69905846T2 publication Critical patent/DE69905846T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
DE69905846T 1998-12-21 1999-12-20 Flexible Leiterplatte, Polyamidsäure und diese enthaltende Polyamidsäure-Lack Expired - Lifetime DE69905846T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36334598A JP3389870B2 (ja) 1998-12-21 1998-12-21 ポリアミック酸及びそれを含有するポリアミック酸ワニス
JP01365499A JP3379459B2 (ja) 1999-01-21 1999-01-21 フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
DE69905846D1 true DE69905846D1 (de) 2003-04-17
DE69905846T2 DE69905846T2 (de) 2003-11-06

Family

ID=26349482

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69905846T Expired - Lifetime DE69905846T2 (de) 1998-12-21 1999-12-20 Flexible Leiterplatte, Polyamidsäure und diese enthaltende Polyamidsäure-Lack

Country Status (4)

Country Link
US (1) US6355357B1 (de)
EP (1) EP1014765B1 (de)
CN (1) CN1230047C (de)
DE (1) DE69905846T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW526223B (en) * 1999-10-18 2003-04-01 Nippon Mektron Kk Novel polyimide copolymer and metal laminate using the same
JP3287348B2 (ja) * 1999-12-17 2002-06-04 ソニーケミカル株式会社 ポリアミック酸ワニス組成物及びフレキシブルプリント基板
JP3494098B2 (ja) * 1999-12-20 2004-02-03 ソニーケミカル株式会社 フレキシブルプリント基板
JP3765970B2 (ja) 2000-07-12 2006-04-12 ソニーケミカル株式会社 エッチング液及びフレキシブル配線板の製造方法
JP3768104B2 (ja) * 2001-01-22 2006-04-19 ソニーケミカル株式会社 フレキシブルプリント基板
WO2002102883A1 (fr) * 2001-06-18 2002-12-27 Kaneka Corporation Pellicule polyimide possedant une excellente aptitude au traitement par attaque a l'alcali et au perçage
KR100543093B1 (ko) * 2003-04-09 2006-01-20 제일모직주식회사 트리아진기를 포함한 디아민 화합물, 그로부터 제조된폴리아믹산 및 액정 배향막
US7071282B2 (en) * 2003-06-03 2006-07-04 General Electric Company Benzimidazole diamine-based polyetherimide compositions and methods for making them
KR100679369B1 (ko) * 2005-02-21 2007-02-05 엘에스전선 주식회사 에나멜 전선 피복도료 조성물 및 이를 이용한 에나멜 전선
US8012541B2 (en) 2007-01-24 2011-09-06 International Business Machines Corporation Thermally reversible cross-linked poly (aryl ether ketone) media and method for high density data storage
KR100963376B1 (ko) * 2007-02-09 2010-06-14 주식회사 엘지화학 폴리이미드 제조방법 및 이에 의하여 제조된 폴리이미드
CN104118167A (zh) * 2010-02-10 2014-10-29 宇部兴产株式会社 聚酰亚胺膜、含它的聚酰亚胺层压体和含它的聚酰亚胺金属层压体
JP5788096B2 (ja) * 2012-05-03 2015-09-30 エルジー・ケム・リミテッド 新規なポリアミック酸、感光性樹脂組成物、ドライフィルムおよび回路基板
WO2017074751A1 (en) 2015-10-30 2017-05-04 Blueshift International Materials, Inc. Highly branched non-crosslinked aerogel, methods of making, and uses thereof
CA3016132A1 (en) 2016-06-08 2017-12-14 Blueshift Materials, Inc. Polymer aerogel with improved mechanical and thermal properties
CA3079886A1 (en) 2017-12-05 2019-06-13 Blueshift Materials, Inc. Thermally treated polyamic amide aerogel
DE102019206559A1 (de) * 2019-05-07 2020-11-26 Aktiebolaget Skf Imidzusammensetzung und Schutzmittelzusammensetzung mit der Imidzusammensetzung
EP4223536A1 (de) 2022-02-04 2023-08-09 Felix Böttcher GmbH & Co. KG Sensorwalze

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157286A (ja) 1984-01-27 1985-08-17 株式会社日立製作所 フレキシブルプリント基板の製造方法
DE3506524A1 (de) * 1985-02-25 1986-08-28 Akzo Gmbh, 5600 Wuppertal Flexible polyimid-mehrschichtlaminate
JP2825558B2 (ja) * 1989-10-25 1998-11-18 株式会社日立製作所 組成物及びこの樹脂組成物を使用した多層プリント回路板の製造方法
US5397847A (en) * 1992-10-20 1995-03-14 The University Of Akron Heat-resistant laminate materials and preparation thereof
US5290909A (en) * 1993-05-28 1994-03-01 Industrial Technology Research Institute Polyimide composition for polyimide/copper foil laminate
EP0659553A1 (de) 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Koextrudierter Mehrschichtfilm aus aromatischen Polyimiden und seine Herstellung
US6133408A (en) * 1999-01-15 2000-10-17 Wirex Corporation Polyimide resin for cast on copper laminate and laminate produced therefrom

Also Published As

Publication number Publication date
EP1014765B1 (de) 2003-03-12
EP1014765A3 (de) 2000-07-12
DE69905846T2 (de) 2003-11-06
EP1014765A2 (de) 2000-06-28
CN1258187A (zh) 2000-06-28
CN1230047C (zh) 2005-11-30
US6355357B1 (en) 2002-03-12

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