DE69929483D1 - Epoxidharzzusammensetzung für gedruckte Leiterplatte und diese enthaltende gedruckte Leiterplatte - Google Patents
Epoxidharzzusammensetzung für gedruckte Leiterplatte und diese enthaltende gedruckte LeiterplatteInfo
- Publication number
- DE69929483D1 DE69929483D1 DE69929483T DE69929483T DE69929483D1 DE 69929483 D1 DE69929483 D1 DE 69929483D1 DE 69929483 T DE69929483 T DE 69929483T DE 69929483 T DE69929483 T DE 69929483T DE 69929483 D1 DE69929483 D1 DE 69929483D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- resin composition
- epoxy resin
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8114698 | 1998-03-27 | ||
JP10081146A JPH11279376A (ja) | 1998-03-27 | 1998-03-27 | 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69929483D1 true DE69929483D1 (de) | 2006-04-06 |
DE69929483T2 DE69929483T2 (de) | 2006-09-21 |
Family
ID=13738295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69929483T Expired - Fee Related DE69929483T2 (de) | 1998-03-27 | 1999-03-05 | Epoxidharzzusammensetzung für gedruckte Leiterplatte und diese enthaltende gedruckte Leiterplatte |
Country Status (4)
Country | Link |
---|---|
US (1) | US6462147B1 (de) |
EP (1) | EP0947532B1 (de) |
JP (1) | JPH11279376A (de) |
DE (1) | DE69929483T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000239640A (ja) * | 1998-12-22 | 2000-09-05 | Hitachi Chem Co Ltd | 接着剤付き銅箔並びにそれを用いた銅張り積層板及び印刷配線板 |
DE60140576D1 (de) * | 2000-03-31 | 2009-12-31 | Hitachi Chemical Co Ltd | Hitzehärtbare Silikonzusammensetzung, Harzfilm, Metallfolie, Isolationsfilm, Metall-Leiterplatte-Laminat, Multischicht-Leiterplatte, die Zusammensetzung enthaltend und Verwendung der Zusammensetzung |
JP5157045B2 (ja) * | 2005-01-17 | 2013-03-06 | 日立化成株式会社 | プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板 |
KR100649633B1 (ko) * | 2005-02-15 | 2006-11-27 | 삼성전기주식회사 | 접착력, 내열성 및 난연성이 우수한 임베디드 커패시터용수지 조성물 |
DE102006012839B4 (de) | 2006-03-21 | 2008-05-29 | Vacuumschmelze Gmbh & Co. Kg | Lackzusammensetzung und deren Verwendung |
KR101051865B1 (ko) * | 2006-09-14 | 2011-07-25 | 파나소닉 전공 주식회사 | 프린트 배선판용 에폭시 수지 조성물, 수지 조성물 바니시,프리프레그, 금속 피복 적층체, 프린트 배선판 및 다층 프린트 배선판 |
US9394196B2 (en) | 2006-12-14 | 2016-07-19 | Ppg Industries Ohio, Inc. | Low density and high strength fiber glass for reinforcement applications |
US9056786B2 (en) * | 2006-12-14 | 2015-06-16 | Ppg Industries Ohio, Inc. | Low density and high strength fiber glass for ballistic applications |
US8697591B2 (en) | 2006-12-14 | 2014-04-15 | Ppg Industries Ohio, Inc. | Low dielectric glass and fiber glass |
US9156728B2 (en) | 2006-12-14 | 2015-10-13 | Ppg Industries Ohio, Inc. | Low density and high strength fiber glass for ballistic applications |
DE102007025668B4 (de) | 2007-06-01 | 2011-05-05 | Vacuumschmelze Gmbh & Co. Kg | Verfahren zum Verbinden zweier Fügepartner |
KR101195674B1 (ko) * | 2009-01-29 | 2012-10-30 | 야마하 가부시키가이샤 | 열교환 유닛 |
US10214655B2 (en) | 2016-04-13 | 2019-02-26 | Xerox Corporation | Metal nanoparticle ink dispersion |
US9828520B2 (en) | 2016-04-15 | 2017-11-28 | Xerox Corporation | Interlayer composition and devices made therefrom |
US10199586B2 (en) | 2016-07-28 | 2019-02-05 | Xerox Corporation | Device comprising dielectric interlayer |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5448879A (en) | 1977-09-27 | 1979-04-17 | Toshiba Corp | Production of copper foil laminate |
JPS5573750A (en) * | 1978-11-27 | 1980-06-03 | Mitsubishi Gas Chem Co Inc | Phenolic resin composition |
US4393181A (en) * | 1982-06-30 | 1983-07-12 | Shell Oil Company | Polyfunctional phenolic-melamine epoxy resin curing agents |
CA1276358C (en) * | 1984-01-31 | 1990-11-13 | Dieter H. Klein | Epoxy resin for preparing electric laminates |
EP0200678B1 (de) * | 1985-04-02 | 1990-09-12 | Ciba-Geigy Ag | Verfahren zum Verkleben von Oberflächen mit einem härtbaren Epoxidharzgemisch |
GB8519290D0 (en) * | 1985-07-31 | 1985-09-04 | Dow Chemical Rheinwerk Gmbh | Resin composition |
JPH0379621A (ja) * | 1989-05-12 | 1991-04-04 | Mitsubishi Electric Corp | 積層板用樹脂組成物 |
TW215927B (de) * | 1992-02-28 | 1993-11-11 | Ciba Geigy | |
JPH0722718A (ja) * | 1993-07-06 | 1995-01-24 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物、印刷配線板用プリプレグの製造方法及びコンポジット積層板の製造方法 |
EP0728789B1 (de) * | 1995-02-27 | 2001-04-18 | Matsushita Electric Works, Ltd. | Verfahren zur Herstelllung von Prepregs und Schichtstoffen auf Epoxydharzbasis |
JPH08253558A (ja) * | 1995-03-16 | 1996-10-01 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
JPH10193516A (ja) * | 1997-01-06 | 1998-07-28 | Toshiba Chem Corp | ガラスエポキシ銅張積層板の製造方法 |
JP3785749B2 (ja) * | 1997-04-17 | 2006-06-14 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法 |
-
1998
- 1998-03-27 JP JP10081146A patent/JPH11279376A/ja active Pending
-
1999
- 1999-03-05 DE DE69929483T patent/DE69929483T2/de not_active Expired - Fee Related
- 1999-03-05 EP EP99104476A patent/EP0947532B1/de not_active Expired - Lifetime
- 1999-03-23 US US09/274,100 patent/US6462147B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0947532B1 (de) | 2006-01-18 |
EP0947532A1 (de) | 1999-10-06 |
JPH11279376A (ja) | 1999-10-12 |
DE69929483T2 (de) | 2006-09-21 |
US6462147B1 (en) | 2002-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |