JPS5573750A - Phenolic resin composition - Google Patents

Phenolic resin composition

Info

Publication number
JPS5573750A
JPS5573750A JP14637378A JP14637378A JPS5573750A JP S5573750 A JPS5573750 A JP S5573750A JP 14637378 A JP14637378 A JP 14637378A JP 14637378 A JP14637378 A JP 14637378A JP S5573750 A JPS5573750 A JP S5573750A
Authority
JP
Japan
Prior art keywords
phenolic resin
retardant
flame
resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14637378A
Other languages
Japanese (ja)
Other versions
JPS5639815B2 (en
Inventor
Hiromitsu Takanohashi
Akira Kenta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP14637378A priority Critical patent/JPS5573750A/en
Publication of JPS5573750A publication Critical patent/JPS5573750A/en
Publication of JPS5639815B2 publication Critical patent/JPS5639815B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: To prepare the title composition having excellent tracking resistance, soldering temperature resistance, and peeling strength of laminated copper foil, by compounding a flame-retardant resol-type phenolic resin with a specific melamine resin and an epoxy resin.
CONSTITUTION: A composition composed of (A) a flame-retardant resol-type phenolic resin, (B) an alkyl-modified melamine resin, (C) a hydrogenated bisphenol-type epoxy resin (e.g. hydrogenated bisphenol A glycidyl ether) or a mixture of the epoxy resin and hexahydrophthalic anhydride, and (D) a curing agent such as triethylamine. The component (A) is a phenolic resin containing a flame-retardant such as halogenated diphenyl ether, etc., and the component (B) is methylol melamines wherein 30W70% of the methylol groups are etherified. The preferable weight ratios of (B)+(C)/(A), and (B)/(B)+(C) are 15W50wt%, and 10W 90wt%, respectively.
COPYRIGHT: (C)1980,JPO&Japio
JP14637378A 1978-11-27 1978-11-27 Phenolic resin composition Granted JPS5573750A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14637378A JPS5573750A (en) 1978-11-27 1978-11-27 Phenolic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14637378A JPS5573750A (en) 1978-11-27 1978-11-27 Phenolic resin composition

Publications (2)

Publication Number Publication Date
JPS5573750A true JPS5573750A (en) 1980-06-03
JPS5639815B2 JPS5639815B2 (en) 1981-09-16

Family

ID=15406242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14637378A Granted JPS5573750A (en) 1978-11-27 1978-11-27 Phenolic resin composition

Country Status (1)

Country Link
JP (1) JPS5573750A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279376A (en) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd Epoxy resin composition for printed wiring board and printed wiring board using the same
JP2000239640A (en) * 1998-12-22 2000-09-05 Hitachi Chem Co Ltd Adhesive-adhering copper leaf and copper-spreading laminating plate and wiring plate for plinting by use thereof
JP2007170711A (en) * 2005-12-20 2007-07-05 Matsushita Electric Ind Co Ltd Wind direction changing device
JP2008096006A (en) * 2006-10-10 2008-04-24 Matsushita Electric Ind Co Ltd Wind direction changing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196422A (en) * 1987-10-07 1989-04-14 Hino Motors Ltd Combustion chamber for diesel engine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279376A (en) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd Epoxy resin composition for printed wiring board and printed wiring board using the same
JP2000239640A (en) * 1998-12-22 2000-09-05 Hitachi Chem Co Ltd Adhesive-adhering copper leaf and copper-spreading laminating plate and wiring plate for plinting by use thereof
JP2007170711A (en) * 2005-12-20 2007-07-05 Matsushita Electric Ind Co Ltd Wind direction changing device
JP2008096006A (en) * 2006-10-10 2008-04-24 Matsushita Electric Ind Co Ltd Wind direction changing device

Also Published As

Publication number Publication date
JPS5639815B2 (en) 1981-09-16

Similar Documents

Publication Publication Date Title
JPS5483097A (en) Epoxy resin composition
JPS5573750A (en) Phenolic resin composition
JPS5584371A (en) Epoxy resin composition for powdered paint
JPS52144099A (en) Epoxy resin compositions
JPS5659837A (en) Epoxy resin composition
JPS5569616A (en) Epoxy resin composition for carbon fiber-reinforcement
JPS5679170A (en) Adhesive composition
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS5552341A (en) Polyethylene terephthalate resin composition
JPS646070A (en) Electrical insulating powder coating composition
JPS5565215A (en) Thermosetting resin composition
JPS5429338A (en) Coating composition
JPS5548216A (en) Epoxy resin composition
JPS53128664A (en) Production of prepreg
JPS5792019A (en) Preparation of imidazole mixture assuming liquidity at room temperature
JPS56122826A (en) Epoxy resin composition for laminate
JPS57195773A (en) Powdered resin composition for electrical insulating coating
JPS5569630A (en) Synthetic resin composition
JPS5626967A (en) Production of one-pack type epoxy conductive adhesive
JPS56122825A (en) Epoxy resin composition for laminate
JPS5712037A (en) Epoxy-modified butadiene resin composition
JPS57168963A (en) Corrosion-resistant coating composition
JPS5598223A (en) Liquid epoxy resin hardener
JPS54116097A (en) Thermosetting resin composition
JPS55161817A (en) Preparation of epoxy resin