JPS56122826A - Epoxy resin composition for laminate - Google Patents

Epoxy resin composition for laminate

Info

Publication number
JPS56122826A
JPS56122826A JP2692880A JP2692880A JPS56122826A JP S56122826 A JPS56122826 A JP S56122826A JP 2692880 A JP2692880 A JP 2692880A JP 2692880 A JP2692880 A JP 2692880A JP S56122826 A JPS56122826 A JP S56122826A
Authority
JP
Japan
Prior art keywords
epoxy resin
bisphenol
composition
tetraglycidylbis
aminophenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2692880A
Other languages
Japanese (ja)
Inventor
Yuji Shimamoto
Yoshikazu Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2692880A priority Critical patent/JPS56122826A/en
Publication of JPS56122826A publication Critical patent/JPS56122826A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide the titled composition with a high glass transition temp., heat resistance and adhesive strength with copper foil at a high temp., comprising using an epoxy resin having a bisphenol S in a skeleton thereof and N,N,N',N'-tetraglycidylbis(aminophenyl)methane together.
CONSTITUTION: 100pts.wt. glycidyl ether type epoxy resin (A) containing bisphenol S in a skeleton thereof, dicyandiamide (B), imidazole (C) and 10W40pts.wt. N,N,N',N'-tetraglycidylbis(aminophenyl)methane are mixed to obtain the titled composition. The resulting composition is used in forming a copper clad laminate by a method wherein glass cloth or the like is impregnated with a varnish obtained by dissolving said composition in a solvent to form a prepreg and the obtained prepreg is laminated with the copper foil. The resin (A) is obtained by reacting a bisphenol A type liquid epoxy resin and bisphenol S.
COPYRIGHT: (C)1981,JPO&Japio
JP2692880A 1980-03-03 1980-03-03 Epoxy resin composition for laminate Pending JPS56122826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2692880A JPS56122826A (en) 1980-03-03 1980-03-03 Epoxy resin composition for laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2692880A JPS56122826A (en) 1980-03-03 1980-03-03 Epoxy resin composition for laminate

Publications (1)

Publication Number Publication Date
JPS56122826A true JPS56122826A (en) 1981-09-26

Family

ID=12206825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2692880A Pending JPS56122826A (en) 1980-03-03 1980-03-03 Epoxy resin composition for laminate

Country Status (1)

Country Link
JP (1) JPS56122826A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525617A1 (en) * 1982-04-21 1983-10-28 Toho Beslon Co EPOXY RESIN COMPOSITION

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525617A1 (en) * 1982-04-21 1983-10-28 Toho Beslon Co EPOXY RESIN COMPOSITION

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