JPS6426690A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS6426690A JPS6426690A JP14802888A JP14802888A JPS6426690A JP S6426690 A JPS6426690 A JP S6426690A JP 14802888 A JP14802888 A JP 14802888A JP 14802888 A JP14802888 A JP 14802888A JP S6426690 A JPS6426690 A JP S6426690A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- printed board
- type epoxy
- bisphenol
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To obtain a printed board outstanding in adhesiveness, soldering heat resistance, flexibility and chemical resistance, by using an adhesive comprising bisphenol A epoxy resin, poly-N-glycidyl type epoxy resin, nitrile rubber and curing agent. CONSTITUTION:The objective printed board in which heat-resistant plastic film and metallic foil have been laminated can be obtained by using an adhesive comprising (A) a blend of (i) bisphenol A type epoxy resin with epoxy equivalent pref. of 170-4,000 and (ii) poly-N-glycidyl type epoxy resin in the weight ratio: (ii)/(i)=0.05-19 (B) a nitrile rubber containing pref. ca. 1-8wt.% of carboxyl group, and (C) a curing agent for the epoxy resins etc. This printed board is in particular useful as a flexible printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14802888A JPS6426690A (en) | 1988-06-17 | 1988-06-17 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14802888A JPS6426690A (en) | 1988-06-17 | 1988-06-17 | Printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6426690A true JPS6426690A (en) | 1989-01-27 |
JPH0446992B2 JPH0446992B2 (en) | 1992-07-31 |
Family
ID=15443498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14802888A Granted JPS6426690A (en) | 1988-06-17 | 1988-06-17 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6426690A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338328A (en) * | 1989-07-05 | 1991-02-19 | Toagosei Chem Ind Co Ltd | Honeycomb panel for construction |
US6586526B1 (en) * | 1994-05-13 | 2003-07-01 | Taiyo Ink Manufacturing Co., Ltd. | Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
-
1988
- 1988-06-17 JP JP14802888A patent/JPS6426690A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338328A (en) * | 1989-07-05 | 1991-02-19 | Toagosei Chem Ind Co Ltd | Honeycomb panel for construction |
US6586526B1 (en) * | 1994-05-13 | 2003-07-01 | Taiyo Ink Manufacturing Co., Ltd. | Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0446992B2 (en) | 1992-07-31 |
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