JPS6426690A - Printed board - Google Patents

Printed board

Info

Publication number
JPS6426690A
JPS6426690A JP14802888A JP14802888A JPS6426690A JP S6426690 A JPS6426690 A JP S6426690A JP 14802888 A JP14802888 A JP 14802888A JP 14802888 A JP14802888 A JP 14802888A JP S6426690 A JPS6426690 A JP S6426690A
Authority
JP
Japan
Prior art keywords
epoxy resin
printed board
type epoxy
bisphenol
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14802888A
Other languages
Japanese (ja)
Other versions
JPH0446992B2 (en
Inventor
Toshikazu Furuhata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP14802888A priority Critical patent/JPS6426690A/en
Publication of JPS6426690A publication Critical patent/JPS6426690A/en
Publication of JPH0446992B2 publication Critical patent/JPH0446992B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain a printed board outstanding in adhesiveness, soldering heat resistance, flexibility and chemical resistance, by using an adhesive comprising bisphenol A epoxy resin, poly-N-glycidyl type epoxy resin, nitrile rubber and curing agent. CONSTITUTION:The objective printed board in which heat-resistant plastic film and metallic foil have been laminated can be obtained by using an adhesive comprising (A) a blend of (i) bisphenol A type epoxy resin with epoxy equivalent pref. of 170-4,000 and (ii) poly-N-glycidyl type epoxy resin in the weight ratio: (ii)/(i)=0.05-19 (B) a nitrile rubber containing pref. ca. 1-8wt.% of carboxyl group, and (C) a curing agent for the epoxy resins etc. This printed board is in particular useful as a flexible printed circuit board.
JP14802888A 1988-06-17 1988-06-17 Printed board Granted JPS6426690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14802888A JPS6426690A (en) 1988-06-17 1988-06-17 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14802888A JPS6426690A (en) 1988-06-17 1988-06-17 Printed board

Publications (2)

Publication Number Publication Date
JPS6426690A true JPS6426690A (en) 1989-01-27
JPH0446992B2 JPH0446992B2 (en) 1992-07-31

Family

ID=15443498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14802888A Granted JPS6426690A (en) 1988-06-17 1988-06-17 Printed board

Country Status (1)

Country Link
JP (1) JPS6426690A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0338328A (en) * 1989-07-05 1991-02-19 Toagosei Chem Ind Co Ltd Honeycomb panel for construction
US6586526B1 (en) * 1994-05-13 2003-07-01 Taiyo Ink Manufacturing Co., Ltd. Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0338328A (en) * 1989-07-05 1991-02-19 Toagosei Chem Ind Co Ltd Honeycomb panel for construction
US6586526B1 (en) * 1994-05-13 2003-07-01 Taiyo Ink Manufacturing Co., Ltd. Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof

Also Published As

Publication number Publication date
JPH0446992B2 (en) 1992-07-31

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