JPS5738872A - Heat-resistant adhesive composition and heat-resistant laminate - Google Patents

Heat-resistant adhesive composition and heat-resistant laminate

Info

Publication number
JPS5738872A
JPS5738872A JP11409180A JP11409180A JPS5738872A JP S5738872 A JPS5738872 A JP S5738872A JP 11409180 A JP11409180 A JP 11409180A JP 11409180 A JP11409180 A JP 11409180A JP S5738872 A JPS5738872 A JP S5738872A
Authority
JP
Japan
Prior art keywords
heat
epoxy resin
base board
adhesive composition
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11409180A
Other languages
Japanese (ja)
Inventor
Tetsuzo Nakai
Kentaro Kobayashi
Itsuo Matsuda
Takara Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP11409180A priority Critical patent/JPS5738872A/en
Publication of JPS5738872A publication Critical patent/JPS5738872A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: An adhesive composition with excellent soldering heat resistance, antibacterial propeyty, adhesion and flexibility particularly suitable for bonding a heat- resistant insulation base board, which is prepd. by compounding a specified antibacterial agent, nitrile rubber, epoxy resin and amine-base curing agent for the epoxy resin.
CONSTITUTION: A nitrile rubber, an epoxy resin, an amine-base curing agent for the epoxy resin and at least one antibacterial agent selected from 10, 10'-oxybisphenoxaarsine, 2-(4-thiazolyl) benzimidazole, N-(trichloromethylthio)-4-cyclo- hexene-1,2-dicarbonimide and N-(fluorodichloro methylthio)phthalimide are mixed and, if necessary, dissolved in an org. solvent, to obtain the titled adhesive composition. After a heat-resistant insulation base board is coated with said composition and heated to 80W170°C, it is piled on another heat-resistant insulation base board or an electrically conductive base board and bonded to each other at 130W200°C at about 40kg/cm2, to form a laminate.
COPYRIGHT: (C)1982,JPO&Japio
JP11409180A 1980-08-21 1980-08-21 Heat-resistant adhesive composition and heat-resistant laminate Pending JPS5738872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11409180A JPS5738872A (en) 1980-08-21 1980-08-21 Heat-resistant adhesive composition and heat-resistant laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11409180A JPS5738872A (en) 1980-08-21 1980-08-21 Heat-resistant adhesive composition and heat-resistant laminate

Publications (1)

Publication Number Publication Date
JPS5738872A true JPS5738872A (en) 1982-03-03

Family

ID=14628870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11409180A Pending JPS5738872A (en) 1980-08-21 1980-08-21 Heat-resistant adhesive composition and heat-resistant laminate

Country Status (1)

Country Link
JP (1) JPS5738872A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020676U (en) * 1983-07-20 1985-02-13 セイレイ工業株式会社 Engine hour meter circuit
JP2000239629A (en) * 1999-02-23 2000-09-05 Toshiba Chem Corp Adhesive composition for flexible printed circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4898399A (en) * 1972-03-29 1973-12-13
JPS5175778A (en) * 1974-12-26 1976-06-30 Showa Denko Kk KIKASEITENKAZAIOFUKUMUMAKUO SEKISOSHITENARUSHIITO
JPS5230837A (en) * 1975-09-03 1977-03-08 Toshiba Chem Corp Thermostable compositions for use in adhesives and thermostable lamina ted boards
JPS5266553A (en) * 1975-11-28 1977-06-02 Ventron Corp Process for manufacturing pesticide preparations and components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4898399A (en) * 1972-03-29 1973-12-13
JPS5175778A (en) * 1974-12-26 1976-06-30 Showa Denko Kk KIKASEITENKAZAIOFUKUMUMAKUO SEKISOSHITENARUSHIITO
JPS5230837A (en) * 1975-09-03 1977-03-08 Toshiba Chem Corp Thermostable compositions for use in adhesives and thermostable lamina ted boards
JPS5266553A (en) * 1975-11-28 1977-06-02 Ventron Corp Process for manufacturing pesticide preparations and components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020676U (en) * 1983-07-20 1985-02-13 セイレイ工業株式会社 Engine hour meter circuit
JP2000239629A (en) * 1999-02-23 2000-09-05 Toshiba Chem Corp Adhesive composition for flexible printed circuit board

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