JPS5521454A - Bonding to wood by dielectric heating - Google Patents

Bonding to wood by dielectric heating

Info

Publication number
JPS5521454A
JPS5521454A JP9437078A JP9437078A JPS5521454A JP S5521454 A JPS5521454 A JP S5521454A JP 9437078 A JP9437078 A JP 9437078A JP 9437078 A JP9437078 A JP 9437078A JP S5521454 A JPS5521454 A JP S5521454A
Authority
JP
Japan
Prior art keywords
bonding
wood
adhesive
dielectric heating
lie
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9437078A
Other languages
Japanese (ja)
Other versions
JPS592720B2 (en
Inventor
Katsuaki Tanaka
Yasuo Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUGIYAMA SANGYO KAGAKU KENK
SUGIYAMA SANGYO KAGAKU KENKYUSHO
YUTAKA HORUMARIN KOGYO KK
Original Assignee
SUGIYAMA SANGYO KAGAKU KENK
SUGIYAMA SANGYO KAGAKU KENKYUSHO
YUTAKA HORUMARIN KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUGIYAMA SANGYO KAGAKU KENK, SUGIYAMA SANGYO KAGAKU KENKYUSHO, YUTAKA HORUMARIN KOGYO KK filed Critical SUGIYAMA SANGYO KAGAKU KENK
Priority to JP9437078A priority Critical patent/JPS592720B2/en
Publication of JPS5521454A publication Critical patent/JPS5521454A/en
Publication of JPS592720B2 publication Critical patent/JPS592720B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To effect firm bonding by making a specific nonpolar plastic film lie between a high-frequency application electrode and an adherent coated with an adhesive to prevent arcing which may occur in the adhesive layer during the application.
CONSTITUTION: An adhesive such as urea resin, etc. is coated on the laminating surface of a wood. Subsequently, a nonpolar plastic film (e.g. polypropylene film) resistant to temperatures above 100°C, having a dielectric dissipation factor (tan δ) of 0.0001 or less, is made to lie between the resulting adherent and a high-frequency application electrode to carry out hot press bonding by dielectric heating.
COPYRIGHT: (C)1980,JPO&Japio
JP9437078A 1978-08-02 1978-08-02 High-frequency heating bonding method for wood Expired JPS592720B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9437078A JPS592720B2 (en) 1978-08-02 1978-08-02 High-frequency heating bonding method for wood

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9437078A JPS592720B2 (en) 1978-08-02 1978-08-02 High-frequency heating bonding method for wood

Publications (2)

Publication Number Publication Date
JPS5521454A true JPS5521454A (en) 1980-02-15
JPS592720B2 JPS592720B2 (en) 1984-01-20

Family

ID=14108420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9437078A Expired JPS592720B2 (en) 1978-08-02 1978-08-02 High-frequency heating bonding method for wood

Country Status (1)

Country Link
JP (1) JPS592720B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60218221A (en) * 1984-04-10 1985-10-31 Anritsu Corp Automatic aligning device for bar work
JPS63190115U (en) * 1987-05-25 1988-12-07

Also Published As

Publication number Publication date
JPS592720B2 (en) 1984-01-20

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