MY123003A - Copper foil for copper-clad laminate - Google Patents

Copper foil for copper-clad laminate

Info

Publication number
MY123003A
MY123003A MYPI9500715A MY123003A MY 123003 A MY123003 A MY 123003A MY PI9500715 A MYPI9500715 A MY PI9500715A MY 123003 A MY123003 A MY 123003A
Authority
MY
Malaysia
Prior art keywords
copper
clad laminate
resin
room temperature
copper foil
Prior art date
Application number
Inventor
Teturoh Satoh
Yuji Kageyama
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY123003A publication Critical patent/MY123003A/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A COPPER FOIL HAVING AN ADHESIVE LAYER AND USABLE FOR THE PRODUCTION OF A COPPER-CLAD LAMINATE FOR A PRINTED WIRING BOARD, CHARACTERIZED IN THAT THE ADHESIVE FORMING THE ADHESIVE LAYER IS A RESIN COMPOSITION COMPRISING: (A) A THERMOPLASTIC RESIN, (B) A THERMOSETTING RESIN OTHER THAN THE FOLLOWING (C) AND (D), (C) A POLYFUNCTIONAL SOLID EPOXY RESIN WHICH HAS AT LEAST THREE EPOXY GROUPS PER MOLECULE AND A SOFTENING POINT OF 50 °C OR ABOVE AND IS IN SOLID STATE AT ROOM TEMPERATURE, AND (D) AN EPOXY RESIN WHICH IS IN LIQUID STATE AT ROOM TEMPERATURE.
MYPI9500715 1994-03-30 1995-03-22 Copper foil for copper-clad laminate MY123003A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08270494A JP3319650B2 (en) 1994-03-30 1994-03-30 Copper foil for copper clad laminates

Publications (1)

Publication Number Publication Date
MY123003A true MY123003A (en) 2006-05-31

Family

ID=13781796

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9500715 MY123003A (en) 1994-03-30 1995-03-22 Copper foil for copper-clad laminate

Country Status (3)

Country Link
JP (1) JP3319650B2 (en)
CN (1) CN1052375C (en)
MY (1) MY123003A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998044017A1 (en) * 1997-03-27 1998-10-08 Mitsubishi Rayon Co., Ltd. Epoxy resin composition for frp, prepreg, and tubular molding produced therefrom
CN1081128C (en) * 1999-08-18 2002-03-20 湖北省化学研究所 Manufacture of metal sheet coated with polymer film specially for soft printed circuit
JP2003096423A (en) * 2001-09-20 2003-04-03 Toyo Chem Co Ltd Thermosetting adhesive composition and pressure- sensitive adhesive sheet
CN102732197A (en) * 2011-04-12 2012-10-17 佛冈建滔实业有限公司 Preparation process of adhesive suitable for adhesive coated copper foil
JP5935339B2 (en) * 2012-01-17 2016-06-15 東レ株式会社 Adhesive composition for electronic equipment

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
CA2078955A1 (en) * 1991-10-01 1993-04-02 Jamie H. Chamberlain Protected conductive foil assemblage and procedure for preparing same using static electrical forces

Also Published As

Publication number Publication date
CN1113071A (en) 1995-12-06
JPH07266492A (en) 1995-10-17
JP3319650B2 (en) 2002-09-03
CN1052375C (en) 2000-05-10

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