JPS57187376A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPS57187376A JPS57187376A JP7299381A JP7299381A JPS57187376A JP S57187376 A JPS57187376 A JP S57187376A JP 7299381 A JP7299381 A JP 7299381A JP 7299381 A JP7299381 A JP 7299381A JP S57187376 A JPS57187376 A JP S57187376A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- epoxy resin
- adhesive
- adhesive composition
- acrylic rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: To obtain an adhesive composition that is excellent in the adhesive properties, heat resistace, flexibility, chemical resistance and electrical resistance, and is suitably used as an adhesive for flexible printed circuit board, which is based on an acrylic rubber and an epoxy resin.
CONSTITUTION: 10W95wt% acrylic rubber (A) (e.g. ethyl acrylate/2-chloroethyl vinyl ether copolymer), and 90W5wt% composition (B) consisting of an epoxy resin containing two or more epoxy groups (e.g. a bisphenol A type epoxy resin) and a curing agent therefor (e.g. an aliphatic polyamine) are mixed to prepare the adhesive composition. Said composition is usually used in a form of a solution in an organic solvent to form a coating of said composition in a thickness of 30±20μ on an adherend surface, another adherend is placed on it, and the both adherends are bonded under heat and pressure.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7299381A JPS57187376A (en) | 1981-05-15 | 1981-05-15 | Adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7299381A JPS57187376A (en) | 1981-05-15 | 1981-05-15 | Adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57187376A true JPS57187376A (en) | 1982-11-18 |
Family
ID=13505435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7299381A Pending JPS57187376A (en) | 1981-05-15 | 1981-05-15 | Adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57187376A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61221279A (en) * | 1985-03-28 | 1986-10-01 | Nippon Retsuku Kk | One-pack type insulating adhesive for metal and flexible film |
| JPS62246977A (en) * | 1986-04-18 | 1987-10-28 | Nippon Zeon Co Ltd | Adhesive for laminated sheet of electrical circuit |
| JPS62246920A (en) * | 1986-04-21 | 1987-10-28 | Nippon Zeon Co Ltd | Epoxy resin composition for semiconductor sealing |
| JPS6460679A (en) * | 1987-08-28 | 1989-03-07 | Shinko Chem | Adhesive composition for bonding electronic component |
| WO1994010241A1 (en) * | 1991-08-13 | 1994-05-11 | Nippon Shokubai Co., Ltd. | Epoxy resin composition and production thereof |
| US5691416A (en) * | 1992-11-05 | 1997-11-25 | Nippon Shokubai Co., Ltd. | (Meth)acrylate polymer particles dispersed in epoxy resin |
-
1981
- 1981-05-15 JP JP7299381A patent/JPS57187376A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61221279A (en) * | 1985-03-28 | 1986-10-01 | Nippon Retsuku Kk | One-pack type insulating adhesive for metal and flexible film |
| JPH0325468B2 (en) * | 1985-03-28 | 1991-04-08 | Nippon Retsuku Kk | |
| JPS62246977A (en) * | 1986-04-18 | 1987-10-28 | Nippon Zeon Co Ltd | Adhesive for laminated sheet of electrical circuit |
| JPS62246920A (en) * | 1986-04-21 | 1987-10-28 | Nippon Zeon Co Ltd | Epoxy resin composition for semiconductor sealing |
| JPS6460679A (en) * | 1987-08-28 | 1989-03-07 | Shinko Chem | Adhesive composition for bonding electronic component |
| WO1994010241A1 (en) * | 1991-08-13 | 1994-05-11 | Nippon Shokubai Co., Ltd. | Epoxy resin composition and production thereof |
| US5691416A (en) * | 1992-11-05 | 1997-11-25 | Nippon Shokubai Co., Ltd. | (Meth)acrylate polymer particles dispersed in epoxy resin |
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