JPS6422093A - Resin composition for printed wiring board - Google Patents
Resin composition for printed wiring boardInfo
- Publication number
- JPS6422093A JPS6422093A JP17871787A JP17871787A JPS6422093A JP S6422093 A JPS6422093 A JP S6422093A JP 17871787 A JP17871787 A JP 17871787A JP 17871787 A JP17871787 A JP 17871787A JP S6422093 A JPS6422093 A JP S6422093A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- polybutadiene
- resin composition
- epoxidized
- phenol resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To improve the adhesion of a metal foil, by making the resin composition for a printed wiring board contain epoxidized 1, 4 polybutadiene having hydroxyl group at the end and phenol resin, the printed wiring board being formed by laminating a prepreg impregnated with thermosetting resin composition, and a metal foil. CONSTITUTION:A printed wiring 1 is formed by the following process. First, for example, 1, 4 polybutadiene having hydroxyl group at the end is epoxidized to obtain epoxidized 1, 4 polybutadiene, which is dissolved in a solvent together with resin composition containing phenol resin. With this solution, a glass nonwoven fabric 3 or a glass woven fabric 4 is impregnated to prepare prepregs. There are laminated, and thereon copper foils 6, 6 are stacked and subjected to thermocompression bonding. For the epoxidized 1, 4 polybutadiene, the following are preferable; molecular weight is 1000-3000, 1, 4 bonding is more than or equal to 70%, and epoxy equivalent is 200-1500. For the phenol resin, the following are used; tetrabromobisphenol A, novolak type phenol resin, and the mixture of them. Considering flame retardancy, tetrabromobisphenol A is preferable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17871787A JPS6422093A (en) | 1987-07-17 | 1987-07-17 | Resin composition for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17871787A JPS6422093A (en) | 1987-07-17 | 1987-07-17 | Resin composition for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422093A true JPS6422093A (en) | 1989-01-25 |
Family
ID=16053331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17871787A Pending JPS6422093A (en) | 1987-07-17 | 1987-07-17 | Resin composition for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422093A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0467928U (en) * | 1990-10-22 | 1992-06-16 | ||
| US5124950A (en) * | 1989-09-20 | 1992-06-23 | Fujitsu Limited | Multi-port semiconductor memory |
| JP2008244301A (en) * | 2007-03-28 | 2008-10-09 | Mitsubishi Electric Corp | Electronic apparatus |
| JP2017115020A (en) * | 2015-12-24 | 2017-06-29 | 日立化成株式会社 | Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board |
-
1987
- 1987-07-17 JP JP17871787A patent/JPS6422093A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5124950A (en) * | 1989-09-20 | 1992-06-23 | Fujitsu Limited | Multi-port semiconductor memory |
| JPH0467928U (en) * | 1990-10-22 | 1992-06-16 | ||
| JP2008244301A (en) * | 2007-03-28 | 2008-10-09 | Mitsubishi Electric Corp | Electronic apparatus |
| JP2017115020A (en) * | 2015-12-24 | 2017-06-29 | 日立化成株式会社 | Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR840008609A (en) | Flame Retardant Board | |
| GB1496725A (en) | Resin composition and method for its use in forming laminates | |
| EP0374514A3 (en) | Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production | |
| JPS6422093A (en) | Resin composition for printed wiring board | |
| JP2692508B2 (en) | Manufacturing method of laminated board | |
| JP2612129B2 (en) | Laminated board | |
| IE850184L (en) | Circuit boards made of laminates | |
| JPS61179221A (en) | Epoxy glass/copper laminate | |
| EP0373363A2 (en) | Filling of vias in a metallic plane | |
| JPS6422094A (en) | Resin composition for printed wiring board | |
| JP2663596B2 (en) | Copper clad laminate | |
| JP2950969B2 (en) | Manufacturing method of laminated board | |
| JP2935329B2 (en) | Manufacturing method of metal foil clad laminate | |
| SE8902491D0 (en) | POLYEPOXIDE AND POLYPHENYLENE ETHER-POLYEPOXIDE COMPOSITIONS USEFUL IN PRINTED CIRCUIT BOARD PRODUCTION | |
| JPS6334104A (en) | Manufacture of epoxy resin laminated sheet | |
| JPS61138621A (en) | Production of epoxy resin laminated board | |
| JPS5659847A (en) | Production of laminated board | |
| ES8702105A1 (en) | Method for the production of printed circuit boards with more than four conductive layers. | |
| JPS641753A (en) | Epoxy resin composition for glass-epoxy laminate | |
| JPS61209234A (en) | Epoxy resin laminate | |
| JPH06112611A (en) | Laminated board for printed circuit | |
| JPH0244798A (en) | Manufacture of multilayer interconnection board | |
| JPH10219010A (en) | Production of prepreg for copper-clad laminate | |
| JPS641755A (en) | Epoxy resin composition for glass-epoxy laminate | |
| JPS56122826A (en) | Epoxy resin composition for laminate |