JPS6422094A - Resin composition for printed wiring board - Google Patents
Resin composition for printed wiring boardInfo
- Publication number
- JPS6422094A JPS6422094A JP17871887A JP17871887A JPS6422094A JP S6422094 A JPS6422094 A JP S6422094A JP 17871887 A JP17871887 A JP 17871887A JP 17871887 A JP17871887 A JP 17871887A JP S6422094 A JPS6422094 A JP S6422094A
- Authority
- JP
- Japan
- Prior art keywords
- prepregs
- base material
- wiring board
- printed wiring
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To improve the adhesion of a metal foil and the adhesion between layers constituting a laminated body, making the following components essential; epoxidized polybutadiene, bisphenol A type epoxy resin, and 5-(2,5-dioxotetrahydro furyl)-3methyl 3-cycrohexene-1,2-dicarboxylic acid anhydride. CONSTITUTION:A printed wiring board 1 is formed by the following process. First, thermosetting resin composition 2 containing epoxidized polybutadiene, bisphenol A type epoxy resin, and 5-(2,5-dioxotetrahydrofuryl)-3-methyl 3- cyclohexene-1,2-dicarboxylic acid anhydride is dissolved in solvent to prepare varnish, with which a glass nonwoven fabric 3 and a glass woven fabric 4 are impregnated. After drying, prepregs are made of each of the fabrics as base material. A laminated plate 5 is formed by stacking the above prepregs, in the manner in which the prepregs made of a glass nonwoven fabric 3 as base material are applied to middle layers, and the prepregs made of glass woven fabric 4 as base material are applied to an upper layer and a lower layer. Copper foils 6, 6 are stacked on the laminated plate 5, and subjected to thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17871887A JPS6422094A (en) | 1987-07-17 | 1987-07-17 | Resin composition for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17871887A JPS6422094A (en) | 1987-07-17 | 1987-07-17 | Resin composition for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422094A true JPS6422094A (en) | 1989-01-25 |
Family
ID=16053349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17871887A Pending JPS6422094A (en) | 1987-07-17 | 1987-07-17 | Resin composition for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422094A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5721318A (en) * | 1994-10-11 | 1998-02-24 | Shell Oil Company | Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
| US5753881A (en) * | 1995-03-10 | 1998-05-19 | Okamoto Machine Tool Works, Ltd. | Method and apparatus for rotating a machining portion of an electrodischarge machine |
| JP2007021763A (en) * | 2005-07-12 | 2007-02-01 | Hitachi Chem Co Ltd | Metal foil with adhesive layer and metal clad laminated sheet |
-
1987
- 1987-07-17 JP JP17871887A patent/JPS6422094A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5721318A (en) * | 1994-10-11 | 1998-02-24 | Shell Oil Company | Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
| US5880217A (en) * | 1994-10-11 | 1999-03-09 | Shell Oil Company | Telechelic and heterotelechelic polymers with dual curing agents |
| US5753881A (en) * | 1995-03-10 | 1998-05-19 | Okamoto Machine Tool Works, Ltd. | Method and apparatus for rotating a machining portion of an electrodischarge machine |
| JP2007021763A (en) * | 2005-07-12 | 2007-02-01 | Hitachi Chem Co Ltd | Metal foil with adhesive layer and metal clad laminated sheet |
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