JPS56122825A - Epoxy resin composition for laminate - Google Patents
Epoxy resin composition for laminateInfo
- Publication number
- JPS56122825A JPS56122825A JP2692980A JP2692980A JPS56122825A JP S56122825 A JPS56122825 A JP S56122825A JP 2692980 A JP2692980 A JP 2692980A JP 2692980 A JP2692980 A JP 2692980A JP S56122825 A JPS56122825 A JP S56122825A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- bisphenol
- composition
- tetraglycidylbis
- aminophenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: To provide the titled composition with a high glass transition temp., heat resistance and adhesive strength with copper foil at a high temp., comprising using an epoxy resin having a bisphenol S in a skeleton thereof and N,N,N',N'-tetraglycidylbis(aminophenyl)methane together.
CONSTITUTION: 100pts.wt. glycidyl ether type epoxy resin (A) containing bisphenol S in a skeleton thereof, dicyandiamide (B), imidazoline (C) and 10W 40pts.wt. N,N,N',N'-tetraglycidylbis(aminophenyl)methane (D) are mixed to obtain the titled composition. The resulting composition is used in forming a copper clad laminate, for example, by a method wherein glass cloth or the like is impregnated with a varnish obtained by dissolving said composition to form a pregreg and the obtained prepreg is laminated with the copper foil. The resin (A) is obtained by reacting a bisphenol A type liquid epoxy resin and bisphenol S.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2692980A JPS56122825A (en) | 1980-03-03 | 1980-03-03 | Epoxy resin composition for laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2692980A JPS56122825A (en) | 1980-03-03 | 1980-03-03 | Epoxy resin composition for laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56122825A true JPS56122825A (en) | 1981-09-26 |
Family
ID=12206848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2692980A Pending JPS56122825A (en) | 1980-03-03 | 1980-03-03 | Epoxy resin composition for laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56122825A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61235145A (en) * | 1985-04-12 | 1986-10-20 | 鐘淵化学工業株式会社 | Metallic-foil lined laminated board and manufacture thereof |
-
1980
- 1980-03-03 JP JP2692980A patent/JPS56122825A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61235145A (en) * | 1985-04-12 | 1986-10-20 | 鐘淵化学工業株式会社 | Metallic-foil lined laminated board and manufacture thereof |
JPH0582293B2 (en) * | 1985-04-12 | 1993-11-18 | Kanegafuchi Chemical Ind |
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