DE69906951T2 - Polyarylensulfid-harzzusammensetzung zur verkapselung elektronischer bauteile - Google Patents

Polyarylensulfid-harzzusammensetzung zur verkapselung elektronischer bauteile Download PDF

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Publication number
DE69906951T2
DE69906951T2 DE69906951T DE69906951T DE69906951T2 DE 69906951 T2 DE69906951 T2 DE 69906951T2 DE 69906951 T DE69906951 T DE 69906951T DE 69906951 T DE69906951 T DE 69906951T DE 69906951 T2 DE69906951 T2 DE 69906951T2
Authority
DE
Germany
Prior art keywords
resin composition
electronic components
sulfide resin
polyaryl sulfide
enclosure electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69906951T
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English (en)
Other versions
DE69906951D1 (de
Inventor
Tomoyoshi Murakami
Yutaka Tubokura
Shigemasa Suzuki
Satoru Kinouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Petrochemical Co Ltd filed Critical Idemitsu Petrochemical Co Ltd
Publication of DE69906951D1 publication Critical patent/DE69906951D1/de
Application granted granted Critical
Publication of DE69906951T2 publication Critical patent/DE69906951T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5435Silicon-containing compounds containing oxygen containing oxygen in a ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869Acids or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02Polythioethers; Polythioether-ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69906951T 1998-12-24 1999-12-22 Polyarylensulfid-harzzusammensetzung zur verkapselung elektronischer bauteile Expired - Lifetime DE69906951T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36620698A JP4295848B2 (ja) 1998-12-24 1998-12-24 電子部品封止用ポリアリーレンスルフィド樹脂組成物
PCT/JP1999/007200 WO2000039219A1 (en) 1998-12-24 1999-12-22 Polyarylene sulfide resin composition for electronic part encapsulation

Publications (2)

Publication Number Publication Date
DE69906951D1 DE69906951D1 (de) 2003-05-22
DE69906951T2 true DE69906951T2 (de) 2004-01-29

Family

ID=18486195

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69906951T Expired - Lifetime DE69906951T2 (de) 1998-12-24 1999-12-22 Polyarylensulfid-harzzusammensetzung zur verkapselung elektronischer bauteile

Country Status (8)

Country Link
US (1) US6476106B1 (de)
EP (1) EP1057871B1 (de)
JP (1) JP4295848B2 (de)
KR (1) KR20010041196A (de)
CN (1) CN1165584C (de)
DE (1) DE69906951T2 (de)
TW (1) TWI225082B (de)
WO (1) WO2000039219A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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EP1243618A4 (de) * 2000-06-29 2003-01-29 Idemitsu Petrochemical Co Polyarylensulfidharzzusammensetzung
EP1384756A4 (de) * 2001-04-13 2005-04-20 Idemitsu Kosan Co Polyarylsulfidharzzusammensetzung für teile für die optische nachrichtentechnik
KR100567401B1 (ko) * 2004-04-02 2006-04-04 제일모직주식회사 폴리페닐렌 설파이드계 열가소성 수지 조성물
JP4600745B2 (ja) * 2004-10-26 2010-12-15 Dic株式会社 ポリカーボネート樹脂成形品
JP4603409B2 (ja) * 2005-04-22 2010-12-22 出光興産株式会社 磁気浮上式鉄道用地上コイル装置及びその製造方法
JP4658735B2 (ja) * 2005-08-18 2011-03-23 信越化学工業株式会社 接着剤組成物及び接着フィルム
US20070106050A1 (en) * 2005-11-08 2007-05-10 Sokolowski Alex D Crosslinked poly(arylene ether) composition, method, and article
JP4813546B2 (ja) * 2006-02-21 2011-11-09 日本山村硝子株式会社 水性コーティング組成物及びガラス製品
JP5156772B2 (ja) * 2010-02-16 2013-03-06 東レ株式会社 溶着部を有する低膨潤樹脂成形体
JP2015504014A (ja) 2011-09-20 2015-02-05 ティコナ・エルエルシー 電子デバイス用のオーバーモールドコンポジット構造体
KR20140063835A (ko) 2011-09-20 2014-05-27 티코나 엘엘씨 휴대용 전자 장치의 하우징
WO2013043564A2 (en) 2011-09-20 2013-03-28 Ticona Llc Low chlorine filled melt processed polyarylene sulfide composition
JP6504817B2 (ja) 2011-09-20 2019-04-24 ティコナ・エルエルシー 低ハロゲン含量のジスルフィド洗浄ポリアリーレンスルフィド
JP5918855B2 (ja) 2011-09-20 2016-05-18 ティコナ・エルエルシー ポリアリーレンスルフィド/液晶ポリマーアロイ及び、それを含む組成物
US20130269977A1 (en) * 2012-04-13 2013-10-17 Ticona Llc Polyarylene Sulfide Composition Including a Functionalized Siloxane Polymer and a Non-Aromatic Impact Modifier
US9394430B2 (en) 2012-04-13 2016-07-19 Ticona Llc Continuous fiber reinforced polyarylene sulfide
KR102011539B1 (ko) 2012-04-27 2019-08-16 도레이 카부시키가이샤 폴리아릴렌 설파이드 수지 조성물, 상기 수지 조성물의 제조 방법, 및 상기 수지 조성물의 성형품
KR101944898B1 (ko) * 2012-06-11 2019-02-01 에스케이케미칼 주식회사 폴리아릴렌 설파이드 수지 조성물 및 이의 제조 방법
CN103849146A (zh) * 2012-12-04 2014-06-11 东丽先端材料研究开发(中国)有限公司 高熔接痕强度聚苯硫醚复合材料及其制备方法
JP6132669B2 (ja) * 2013-06-11 2017-05-24 ポリプラスチックス株式会社 金属樹脂複合成形体及びその製造方法
US9718225B2 (en) * 2013-08-27 2017-08-01 Ticona Llc Heat resistant toughened thermoplastic composition for injection molding
JP6315255B2 (ja) * 2014-05-08 2018-04-25 Dic株式会社 ポリアリーレンスルフィド樹脂組成物及びその成形体
KR102245611B1 (ko) * 2015-02-09 2021-04-28 에스케이케미칼 주식회사 금속과의 접착성이 우수한 폴리아릴렌 설파이드 조성물
WO2017100395A1 (en) 2015-12-11 2017-06-15 Ticona Llc Crosslinkable polyarylene sulfide composition
EP3387070A4 (de) 2015-12-11 2019-08-14 Ticona LLC Polyarylen-sulfid-zusammensetzung
JP2017132869A (ja) * 2016-01-27 2017-08-03 東ソー株式会社 ポリアリーレンスルフィド組成物
CN108883600B (zh) 2016-03-24 2021-08-06 提克纳有限责任公司 复合结构体
JP2017125215A (ja) * 2017-04-25 2017-07-20 Dic株式会社 ポリアリーレンスルフィド樹脂組成物及びその成形体
JP6943730B2 (ja) * 2017-11-14 2021-10-06 帝人株式会社 ポリアリーレンスルフィド樹脂組成物
CN109694575A (zh) * 2018-11-28 2019-04-30 江苏欧瑞达新材料科技有限公司 一种环氧树脂粘结性良好的pps
JP6901530B2 (ja) * 2019-08-07 2021-07-14 株式会社フジクラ 光通信部品用樹脂組成物及びこれを用いた光通信部品
CN111073528B (zh) * 2019-12-31 2021-09-17 宁波大榭开发区综研化学有限公司 一种热固性胶黏剂和胶带及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
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JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
US4337182A (en) * 1981-03-26 1982-06-29 Phillips Petroleum Company Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation
JPS61266461A (ja) * 1985-05-22 1986-11-26 Dainippon Ink & Chem Inc ポリフエニレンサルフアイド樹脂組成物
CA2028574A1 (en) * 1989-10-26 1991-04-27 Shinobu Yamao Polyarylene sulfide resin compositions
JP2736279B2 (ja) * 1990-04-25 1998-04-02 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物
US5214083A (en) * 1991-08-15 1993-05-25 General Electric Company Poly(phenylene sulfide) resin compositions
JPH0693180A (ja) * 1992-07-28 1994-04-05 Dainippon Ink & Chem Inc 熱可塑性樹脂組成物
DE69528877T2 (de) * 1994-03-17 2003-03-27 Idemitsu Petrochemical Co Polyarylensulfidharzzusammensetzung
JPH0881631A (ja) * 1994-09-13 1996-03-26 Idemitsu Petrochem Co Ltd ポリアリーレンスルフィド樹脂組成物
JP3578288B2 (ja) 1995-04-28 2004-10-20 出光石油化学株式会社 ポリアリーレンスルフィド樹脂組成物
KR20000064264A (ko) * 1996-07-22 2000-11-06 히라이 가쯔히꼬 폴리페닐렌 술피드 수지조성물
US6042910A (en) 1998-01-29 2000-03-28 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin composition
JPH11349813A (ja) * 1998-06-05 1999-12-21 Idemitsu Petrochem Co Ltd 電子部品封止用ポリアリーレンスルフィド樹脂組成物
JP4019508B2 (ja) * 1998-07-17 2007-12-12 松下電工株式会社 電子部品封止用樹脂組成物およびその製造方法、ならびにこの電子部品封止用樹脂組成物を用いた封止電子部品

Also Published As

Publication number Publication date
TWI225082B (en) 2004-12-11
KR20010041196A (ko) 2001-05-15
EP1057871B1 (de) 2003-04-16
WO2000039219A1 (en) 2000-07-06
CN1165584C (zh) 2004-09-08
DE69906951D1 (de) 2003-05-22
US6476106B1 (en) 2002-11-05
JP2000186209A (ja) 2000-07-04
CN1292019A (zh) 2001-04-18
EP1057871A1 (de) 2000-12-06
JP4295848B2 (ja) 2009-07-15
EP1057871A4 (de) 2002-01-16

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Owner name: IDEMITSU KOSAN CO., LTD., TOKIO/TOKYO, JP