KR100572532B1 - 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판 - Google Patents

난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판 Download PDF

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Publication number
KR100572532B1
KR100572532B1 KR1020010063082A KR20010063082A KR100572532B1 KR 100572532 B1 KR100572532 B1 KR 100572532B1 KR 1020010063082 A KR1020010063082 A KR 1020010063082A KR 20010063082 A KR20010063082 A KR 20010063082A KR 100572532 B1 KR100572532 B1 KR 100572532B1
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South Korea
Prior art keywords
prepreg
silicone oligomer
metal hydrate
delete delete
weight
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Expired - Fee Related
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KR1020010063082A
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English (en)
Korean (ko)
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KR20020029639A (ko
Inventor
다까노노조무
후꾸다토미오
미야다께마사토
Original Assignee
히다찌 가세이 고오교 가부시끼가이샤
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Publication of KR20020029639A publication Critical patent/KR20020029639A/ko
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Publication of KR100572532B1 publication Critical patent/KR100572532B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31862—Melamine-aldehyde

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020010063082A 2000-10-13 2001-10-12 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판 Expired - Fee Related KR100572532B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000313720 2000-10-13
JPJP-P-2000-00313720 2000-10-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020040086969A Division KR100570924B1 (ko) 2000-10-13 2004-10-29 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판

Publications (2)

Publication Number Publication Date
KR20020029639A KR20020029639A (ko) 2002-04-19
KR100572532B1 true KR100572532B1 (ko) 2006-04-24

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Application Number Title Priority Date Filing Date
KR1020010063082A Expired - Fee Related KR100572532B1 (ko) 2000-10-13 2001-10-12 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판
KR1020040086969A Expired - Fee Related KR100570924B1 (ko) 2000-10-13 2004-10-29 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판

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KR1020040086969A Expired - Fee Related KR100570924B1 (ko) 2000-10-13 2004-10-29 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판

Country Status (9)

Country Link
US (1) US6706409B2 (enExample)
EP (1) EP1197514B1 (enExample)
JP (3) JP5186221B2 (enExample)
KR (2) KR100572532B1 (enExample)
CN (1) CN1212354C (enExample)
AT (1) ATE248203T1 (enExample)
DE (1) DE60100652T2 (enExample)
SG (1) SG108282A1 (enExample)
TW (2) TWI293320B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP2003003076A (ja) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、金属箔張積層板及びプリント配線板
KR20040111516A (ko) 2002-04-15 2004-12-31 니폰 제온 가부시키가이샤 니스, 성형물, 전기 절연막, 적층체, 난연제 슬러리, 및난연제 입자 및 니스의 제조방법
DE602005017509D1 (de) * 2004-11-26 2009-12-17 Lg Chemical Ltd Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
US7851536B2 (en) * 2005-09-15 2010-12-14 Rutgers, The State University Flame-retardant coating
TW200831583A (en) * 2006-09-29 2008-08-01 Nippon Catalytic Chem Ind Curable resin composition, optical material, and method of regulating optical material
AU2007322017B2 (en) * 2006-11-20 2013-11-07 Monsanto Technology Llc Plant growth and imaging devices and related methods and computer program products
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5539706B2 (ja) * 2009-12-16 2014-07-02 旭化成ケミカルズ株式会社 プリプレグ、金属箔張積層板、及びプリント配線板
WO2012169591A1 (ja) * 2011-06-09 2012-12-13 住友精化株式会社 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
CN106364067B (zh) * 2016-08-29 2021-10-12 上海国纪电子材料有限公司 一种p10覆铜板
CN114026102A (zh) * 2019-07-18 2022-02-08 巴斯夫欧洲公司 孪生单体组合物及其介电膜
KR102601266B1 (ko) * 2021-04-19 2023-11-13 주식회사 액시드 난연성 필름 및 난연성 필름을 위한 코팅 조성물
KR102807057B1 (ko) * 2021-06-18 2025-05-15 (주)엠케이켐앤텍 폴리실록산 난연성 코팅제, 난연성 폴리실록산, 이의 제조방법 및 이로부터 제조된 난연물품
JP7594819B2 (ja) 2022-10-25 2024-12-05 共立エレックス株式会社 自己消火性を有する樹脂材料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731406A (en) * 1985-12-18 1988-03-15 Shin-Etsu Chemical Co., Ltd. Flame-retardant low-smoking rubber composition
EP0906933A1 (en) * 1997-10-01 1999-04-07 Kyowa Chemical Industry Co., Ltd. Flame retardant resin composition

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686135A (en) * 1985-01-29 1987-08-11 Hiraoka & Co., Ltd. Composite sheet material
US4666765A (en) * 1985-10-02 1987-05-19 Caldwell James M Silicone coated fabric
JPS6322853A (ja) * 1987-02-13 1988-01-30 Hitachi Ltd シリコ−ンフエノ−ル系化合物の組成物、及びその用途
JP2550808B2 (ja) * 1991-08-23 1996-11-06 日立電線株式会社 難燃性電気絶縁組成物および難燃性電線・ケーブル
EP0837090B1 (en) * 1995-06-27 2001-08-29 Hitachi Chemical Co., Ltd. Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
JP4164883B2 (ja) * 1997-08-19 2008-10-15 日立化成工業株式会社 印刷配線板用樹脂組成物及びそれを用いたプリプレグ、金属張り積層板
JP3297014B2 (ja) 1997-10-01 2002-07-02 協和化学工業株式会社 難燃性樹脂組成物
JP4245197B2 (ja) * 1997-10-08 2009-03-25 日立化成工業株式会社 印刷配線板用プリプレグの製造方法及びこれを用いた金属張積層板
JP3611435B2 (ja) 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JPH11181243A (ja) 1997-12-18 1999-07-06 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
JPH11181380A (ja) 1997-12-19 1999-07-06 Mitsui Chem Inc 難燃性接着剤組成物
JPH11199753A (ja) 1998-01-05 1999-07-27 Toshiba Chem Corp 積層用難燃性樹脂組成物
JPH11217467A (ja) 1998-02-03 1999-08-10 Yazaki Corp ノンハロゲン難燃性樹脂組成物
CA2272448A1 (en) 1998-05-29 1999-11-29 Martinswerk Gmbh Fur Chemische Und Metallurgische Produktion Non-hygroscopic thermally stable aluminium hydroxide
EP0960855A1 (en) 1998-05-29 1999-12-01 Martinswerk GmbH für chemische und metallurgische Produktion Non hygroscopic thermally stable aluminium hydroxide
JP4399061B2 (ja) 1999-10-13 2010-01-13 東レ・ダウコーニング株式会社 難燃性ポリオレフィン系樹脂組成物、その製造方法および難燃性ケーブル
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP2001226676A (ja) * 2000-02-14 2001-08-21 Kansai Research Institute 難燃剤、その製造方法及び難燃樹脂組成物
JP4872160B2 (ja) * 2000-03-21 2012-02-08 日立化成工業株式会社 誘電特性に優れる樹脂組成物並びにこれを用いて作製されるワニス、ワニスの製造方法、プリプレグ及び金属張積層板
JP4365987B2 (ja) * 2000-05-15 2009-11-18 協和化学工業株式会社 積層板用材料および電機および電子機器用樹脂組成物およびその成型品
JP3664124B2 (ja) * 2000-10-13 2005-06-22 日立化成工業株式会社 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731406A (en) * 1985-12-18 1988-03-15 Shin-Etsu Chemical Co., Ltd. Flame-retardant low-smoking rubber composition
EP0906933A1 (en) * 1997-10-01 1999-04-07 Kyowa Chemical Industry Co., Ltd. Flame retardant resin composition

Also Published As

Publication number Publication date
US20020068173A1 (en) 2002-06-06
KR100570924B1 (ko) 2006-04-13
DE60100652T2 (de) 2004-06-24
TWI293320B (enExample) 2008-02-11
JP5186221B2 (ja) 2013-04-17
US6706409B2 (en) 2004-03-16
DE60100652D1 (de) 2003-10-02
JP2011099113A (ja) 2011-05-19
JP2012122081A (ja) 2012-06-28
CN1212354C (zh) 2005-07-27
JP2008179819A (ja) 2008-08-07
KR20040111217A (ko) 2004-12-31
KR20020029639A (ko) 2002-04-19
TW200423831A (en) 2004-11-01
TWI293544B (enExample) 2008-02-11
CN1350031A (zh) 2002-05-22
EP1197514A1 (en) 2002-04-17
ATE248203T1 (de) 2003-09-15
SG108282A1 (en) 2005-01-28
EP1197514B1 (en) 2003-08-27

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