CN101305049B - 印刷电路板用阻燃预浸料坯和层压体 - Google Patents
印刷电路板用阻燃预浸料坯和层压体 Download PDFInfo
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- CN101305049B CN101305049B CN2006800422401A CN200680042240A CN101305049B CN 101305049 B CN101305049 B CN 101305049B CN 2006800422401 A CN2006800422401 A CN 2006800422401A CN 200680042240 A CN200680042240 A CN 200680042240A CN 101305049 B CN101305049 B CN 101305049B
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- epoxy
- layered product
- resin
- resins
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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Abstract
本发明涉及预浸料坯、层压体和印刷电路板,包含微细粒度蜜胺氰脲酸盐或微细粒度蜜胺氰脲酸盐与微细粒度蜜胺多磷酸盐的混合物作为阻燃剂。该预浸料坯、层压体和印刷电路板显示出用UL 94标准量度时优异的阻燃性、低介电常数、良好的电性能、热性能和机械性能以及良好的机加工性、低密度和均匀外观。该预浸料坯、层压体和印刷电路板也有利地含有某些次膦酸盐和/或双次膦酸盐阻燃剂。该组合物也有利地不含卤素化合物和锑化合物。
Description
本发明涉及用于形成有优异阻燃性能、良好热稳定性和热膨胀特征、均匀外表、低密度和良好可钻性的印刷电路板的预浸料坯和层压体组合物。
印刷电路板是通过用一种液体热固性环氧树脂浸渍一种织物例如电子学级纤维玻璃(E-玻璃)生产的。将该浸渍的织物加热,以使该树脂固化和形成一种干的可挠曲片材,其中该树脂处于一种中间固化状态,有时简称为“B”阶段或“预浸料坯”(prepreg)。然后,将预浸料坯堆叠在一起达到所希望的厚度,并进行能使该树脂完全固化的加热和加压。这形成一种层压复合材料,其中该树脂有时称其处于“C”阶段。
印刷电路板由约50wt%环氧树脂和50wt%电子学级纤维玻璃(E-玻璃)组成。必要的是该预浸料坯和层压体具有可接受阻燃性能。例如,电子组合物阻燃标准是UL-94V-0等级。
美国专利申请公报No.2004/0002559公开了阻燃涂料配方。
美国专利No.6,632,511公开了印刷电路板用预浸料坯和层压体。
美国专利No.6,255,371公开了有机次膦酸盐和蜜胺与磷酸的缩合产物的阻燃组合。
美国专利No.5,739,187公开了作为半导体封装剂的环氧树脂组合物,该组合物包括某一种含磷阻燃剂,以消除三氧化锑和溴代化合物的使用。
美国专利No.5,434,199公开了低应力环氧成形组合物,该组合物包括与一种三苯酚甲烷多官能苯酚类硬化剂组合的一种三苯酚甲烷多官能环氧树脂,以及硅橡胶粉和有机官能硅酮液。该有机官能硅酮液是为给该模塑料提供可流动性而提供的。
美国专利申请公报No.2004/0166241和No.2004/0166325公开了包含蜜胺氰脲酸酯作为阻燃剂的电子学环氧成形组合物。
理想的是提供符合UL-94V-0等级、无卤代阻燃剂且无锑化合物、用环氧树脂制备的阻燃预浸料坯和层压体。
本发明的主题是一种印刷电路板用预浸料坯或层压体,该预浸料坯或层压体包含
一种环氧树脂,和
一种阻燃剂,即一种微细粒度蜜胺氰脲酸盐,或微细粒度蜜胺氰脲酸盐与微细粒度蜜胺多磷酸盐的混合物,其中该微粒的约99%有小于或等于约15μm的直径。
本发明也涉及一种印刷电路板用预浸料坯或层压体,该预浸料坯或层压体包含
一种环氧树脂,和
一种阻燃剂组合,包含一种微细粒度蜜胺氰脲酸盐或微细粒度蜜胺氰脲酸盐与微细粒度蜜胺多磷酸盐的混合物,其中该微粒的约99%有小于或等于约15μm的直径,以及一种次膦酸盐和/或双次膦酸盐。
环氧预浸料坯和层压体和所得到的涂布电路板显示出用UL-94量度时符合V-0等级的优异阻燃性,有均匀的介电常数、良好热稳定性和热膨胀特征、均匀的外观、低密度和良好的可钻孔性。
美国专利申请公报No.2004/0166241和No.2004/0166325公开了包含蜜胺氰脲酸酯作为阻燃剂的电子学环氧成形组合物。
关于本发明的预浸料坯和组合物中可以使用的环氧树脂的类型,没有任何限制。它一般含有2个或更多个反应性环氧乙烷基团。例如,该环氧树脂可以选自双酚A型环氧树脂、可溶可熔酚醛树脂型环氧树脂例如环氧甲酚可溶可熔酚醛树脂和苯酚类可溶可熔酚醛树脂型环氧树脂、脂环族环氧树脂、缩水甘油基型环氧树脂、联苯环氧树脂、含萘环的环氧树脂、含环戊二烯的环氧树脂、多官能环氧树脂、氢醌环氧树脂、茋环氧树脂。该预浸料坯和层压体可以包括不止一种环氧树脂,例如环氧甲酚可溶可熔酚醛树脂和联苯环氧树脂。
已知为双环氧化物的双酚和联苯环氧树脂和已知为多官能环氧的环氧甲酚可溶可熔酚醛树脂可用于本发明。这样的环氧的支化度为2,就在于有侧链环氧的2个苯酚基是通过同一个碳原子连接的。例如,双酚A的二缩水甘油基醚是二官能的,包括2个有从中心碳原子延伸的侧链环氧的苯酚基。因此,它的支化度为2。环氧甲酚可溶可熔酚醛树脂往往称为“多官能的”,就在于它们是聚合物的化合物,而且有多个可以从该聚合物链延伸出来的侧链环氧片断。例如,环氧甲酚可溶可熔酚醛树脂包括如下结构:
当n=0时,这种结构的官能度是2。若n=1,则该官能度是3;若n=2,则该官能度是4等。这种化合物已知为多官能环氧树脂。由于只有2个苯酚基团从同一个碳或同一小簇碳延伸出来,因而这种树脂类型的支化度等于2。
在一种特别理想的实施方案中,该环氧树脂是一种该树脂主链内的支化度为至少3的多官能环氧树脂。因此,特别理想的多官能环氧树脂是从苯酚衍生的那些,而且包括至少三个从同一个中心碳原子或同一簇中心碳直接支化的苯酚基,且该至少三个苯酚基中每一个都连接一个侧链环氧乙烷基。
支化度为至少3的可用多官能环氧树脂的非限定性实例包括:
三(羟苯基)甲烷三缩水甘油基醚(其支化度为3,由从一个中心碳原子支化的三个末端缩水甘油基醚片断代表);
四苯酚基乙烷四缩水甘油基醚(其支化度为4,由从一个中心两碳簇乙基片断支化的4个末端缩水甘油基醚片断代表)。
特别理想的是从三苯酚甲烷衍生的环氧树脂,例如三(羟苯基)甲烷三缩水甘油基醚。
支化度为至少3的多官能树脂可以单独使用,也可以与惯常树脂例如以上所述的那些组合使用。
该环氧树脂的理论环氧当量为约150~250。例如,以该组合物的总重量为基准,该环氧树脂在本发明组合物中的存在量为约1~25wt%、通常4~约12wt%、更通常约5.5~约8.5wt%。
该预浸料坯含有一种固化剂(硬化剂)。该固化剂促进该树脂的交联,以在该组合物加热到至少约135℃的温度时生成一种聚合物组合物。本发明中可以包括的一些适用固化剂是苯酚可溶可熔酚醛树脂型硬化剂、甲酚可溶可熔酚醛树脂型硬化剂、二聚环戊二烯苯酚型硬化剂、苧烯型硬化剂、和酸酐。羟基当量大于约150的可挠曲硬化剂往往是理想的,例如赛洛克可溶可熔酚醛树脂型硬化剂。可挠曲硬化剂的非限定性实例包括可购自Borden Chemical公司的双酚M和可购自Dow Chemical的DEH 85。类似于环氧树脂成分,该组合物中可以包括不止一种固化剂类型。
就该环氧树脂成分而言,在本发明的一种实施方案中,支化度为至少3的多官能硬化剂是特别理想的。尤其理想的是从三苯酚甲烷衍生而且含有至少3个能与环氧基反应的官能团的那些。
以该组合物的总重量为基准,该固化剂在本发明组合物中的存在量是诸如约1wt%~约10wt%、通常约1.5wt%~约6wt%。
本组合物可以进一步包括一种用于促进该环氧树脂与该硬化剂的反应的催化剂。这样的环氧组合物掺入了催化剂例如叔胺、有取代的膦、咪唑等,而像1,8-二氮杂双环[5.4.0]十一碳-7-烯(DBU)、双氰胺(DICY)和三苯膦(TPP)这样的化合物作为催化剂的用途是尤其众所周知的。
该催化剂的存在量至少要足以在该组合物加热到至少约135℃的温度时催化地进行该环氧树脂与固化剂的交联。
该环氧树脂可以包含一种填料。该填料可以是例如聚合物微球或传统玻璃微球,如美国专利No.6,632,511中所公开的。
其它树脂可以适当用于印刷电路板应用。例如,树脂可以包含热固性树脂,例如环氧、苯酚类树脂、苯并噁嗪、聚酰亚胺、氰酸酯、双马来酰亚胺三嗪、聚酯、聚苯醚树脂、聚苯乙烯、聚苯醚、聚苯硫醚、聚砜、聚醚砜、聚醚酰亚胺、聚缩醛、聚碳酸酯、及其共聚物和共混物。
该树脂还可以包含单独或其各种组合和置换的各种各样添加剂。例如,该树脂可以任选地包含紫外线阻断染料、颜料例如TiO2或Fe2O3、或树脂,以提高该预浸料坯、层压体或印刷电路板对紫外线的不透明度。该树脂也可以任选地包含一种进一步阻燃剂例如卤素化合物如溴代环氧或溴代填料、或无卤素化合物如含有磷、氮、或硼的化合物,以提高耐火或耐燃性能。较好,不采用进一步阻燃剂。该树脂可以任选地包含一种表面活性剂例如Chemie BYK 322、一种无机的流动改性剂例如疏水性热解法二氧化硅、和/或一种触变剂。这些添加剂合计将包含该树脂的约3.0wt%~约20.0wt%。若该卤素物质是一种环氧树脂,则溴包含所述树脂的约15.0wt%~约60.0wt%、和总固体含量的约5.0wt%~约30.0wt%。若该卤素物质是一种填料,则溴包含所述填料的约20.0wt%~约85.0wt%、和总固体含量的约5.0wt%~约30wt%。
本发明的预浸料坯是通过用一种清漆浸渍一种增强材料形成的,该清漆包含(i)溶剂和(ii)一种诸如部分固化的聚合物树脂或树脂单体。所选择的增强材料一般取决于该成品层压体所希望的性能。这些包括厚度、介电常数(DK)、热膨胀系统(“CTE”)、和意向产品应用。一般来说,该增强材料可以是一种包含纤维性材料例如陶瓷纤维、玻璃纤维、或聚合物纤维的机织或非织造垫。可以使用低介电常数材料例如电子学级玻璃、D-玻璃、芳族聚酰胺例如Kevlar和Nomex-两者均为杜邦公司(E.I.Dupont de Nemours and Company)的注册商标、聚对亚苯基苯并联噻唑、聚对亚苯基苯并联噁唑、聚醚醚酮、PTFE、芳香族聚酯、石英、S-玻璃、纸等、或其组合来形成该纤维性材料垫。该增强材料可以呈共织造的或多根并合的形式。
本发明的层压体是使用惯常技术例如平床压机或高压釜层压从预浸料坯制备的。例如,将预浸料坯片材夹持于2枚铜片材之间,并在加热(例如约188℃)和加压(200~600psi,约13,75~40.0bar)下层压。提供电通道的铜线可以刻蚀到所得到的层压体上。这些可以用来作为单一基材,也可以与其它层压体、铜材、和预浸料坯片材压合,产生一种多层层压体或印刷电路板。
所得到的层压体较好有相对低介电常数。即,该层压体在50%树脂含量时较好有<4.2的介电常数。在一些实施方案中,该介电常数较好<3.9/50%树脂含量、更好<3.5/50%树脂含量,而且可以不大于3.0/5.0%树脂含量。
掺入了阻燃剂的预浸料坯、层压体和印刷电路可以按照本发明以现行设备和方法制备。例如,预浸料坯最经常在处理机上生产。处理机的主要部件包括进料辊、树脂浸渍槽、处理炉、和接受辊。将该增强织物(E-玻璃,例如)辊进一个大池中。然后,将该池放在进料辊上,该辊转动并慢慢卷出该玻璃。然后,该玻璃经由含有清漆的树脂浸渍槽移动。该清漆将该玻璃润湿。从该槽出来之后,有涂层的玻璃经由设定在约350~400°F(约175℃~200℃)的温度的立式处理炉向上移动,该清漆的溶剂就沸腾出去。此时该树脂开始聚合。当该复合材料从该塔出来时,它是充分固化的,以致该纤维网不湿或不粘。该固化过程尚未完成就停止,以致当制造层压体时可以进行额外固化。然后,该纤维网将该预浸料坯卷到接受辊上,该接受辊在这一实验完成时可以更换。然后,将一个新的卷材安装到该处理机上,从而可以开始新一轮实验。
按照本发明制备的层压体有良好的电性能例如相对低的介电常数、良好的热性能例如较好的分解温度、良好的T-260和T-288性能、以及良好的机械性能例如热膨胀特征(CTE和Z轴膨胀)。用这种方法制备的预浸料坯和层压体也有良好的机械加工性、低密度、和用现有预浸料坯制造设备/方法的加工性。
本发明也可以与印刷电路板的被动部件和主动部件一起使用。所得到的预浸料坯有良好的电性能、热性能、机械性能、和可加工性能以及钻孔及其它印刷电路板机加工作业方面的均匀性。
微细粒度密胺多磷酸盐和蜜胺氰脲酸盐阻燃剂有狭窄的粒度分布。例如,该微粒的约99.0%有小于或等于约15.0μm的直径。例如,该微粒的约99.0%有小于或等于约14.0或13.0μm的直径。例如,该微粒的约99.0%有小于或等于约12.0μm的直径。例如,该微粒的约50.0%有约3.0~约3.5μm的直径。
微细粒度密胺多磷酸盐或蜜胺氰脲酸盐是从用已知方法进一步研磨的、商业上可得的样品制备的。
微细粒度蜜胺氰脲酸盐、或蜜胺氰脲酸盐与蜜胺多磷酸盐的组合合计在该环氧树脂中的存在水平,以该树脂的重量为基准,可多达约20.0wt%。例如,以该环氧树脂为基准,可多达约17.0wt%、或可多达约15.0wt%。例如,以该树脂的重量为基准,该蜜胺系阻燃剂的存在量可多达约13.0wt%或例如约9.0wt%~约13.0wt%。
当作为阻燃剂的次膦酸盐或双次膦酸盐或其组合也存在时,它们一般地是以与蜜胺系阻燃剂的约1∶1重量比存在的。例如,次膦酸盐、双次膦酸盐或其组合是以相对于蜜胺系阻燃剂的重量而言约1∶10~约10∶1重量比存在的。例如,该重量比是约1∶5~约5∶1或约1∶3~约3∶1。
该次膦酸盐或双次膦酸盐阻燃剂以该环氧树脂的重量为基准的存在水平也是诸如可多达约20.0wt%。例如,以该环氧树脂为基准,可多达约17.0wt%、或可多达约15.0wt%。例如,该次膦酸盐或双次膦酸盐系阻燃剂以该树脂的重量为基准的存在水平可多达约13.0wt%或例如约9.0wt%~约13.0wt%。
次膦酸盐或双次膦酸盐阻燃剂公开于美国专利No.6,255,371中。代表性次膦酸盐或双次膦酸盐的化学式为
式中
R1和R2相同或不同,是线型或支化的C1-C6烷基或C6-C10芳基;
R3是线型或支化的C1-C10亚烷基、C6-C10亚芳基、C7-C14烷基亚芳基、或C7-C14芳基亚烷基;
M是镁、钙、铝或锌;
m是2或3;
n是1或3;且
x是1或2。
烷基是,例如,甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、正戊基或异戊基。
C1-C10芳基是诸如苯基或萘基,但也包含有C1-C4烷基取代的苯基。
烷芳基是,例如,邻、间或对甲基苯基、2,3-二甲基苯基、2,4-二甲基苯基、2,5-二甲基苯基、2,6-二甲基苯基、3,4-二甲基苯基、3,5-二甲基苯基、2-甲基-6-乙基苯基、4-叔丁基苯基、2-乙基苯基或2,6-二乙基苯基。
芳烷基是诸如苄基、α-甲基苄基、α,α-二甲基苄基、或2-苯基乙基,例如苄基和α,α-二甲基苄基。
亚芳基、烷基亚芳基或芳基亚烷基是一价芳基、芳烷基或烷芳基的二价版本。
以下实施例说明本发明:
该预浸料坯和层压体以及所得的有涂层电路板显示出可燃性等级为UL 94 V-1、更好UL 94 V-0。
该等级是通过按照UL 94 V可燃性试验(Underwriters LaboratoriesUL 94,Test for Flammability of Plastic Materials UL 94,July,1997)测定一种1/8英寸试条的总燃烧时间确定的。UL 94 V-0和UL 94 V-1等级要求一根单一试条的总燃烧时间分别小于或等于10秒和30秒。按照UL 94 V试验的等级列于下表:
等级 | 燃烧时间 | 燃烧滴 | 燃至夹具 |
V-0 | <10s | 否 | 否 |
V-1 | <30s | 否 | 否 |
V-2 | <30s | 是 | 否 |
失败 | <30s | 是 | |
失败 | >30s | 否 |
实施例
一种清漆含有190g环氧甲酚可溶可熔酚醛树脂,后者与0.5g 2-甲基咪唑/3.6g甲基·乙基酮和7.2g 1-甲氧基-2-丙醇混合。也添加的是12wt%微细粒度蜜胺氰脲酸盐和12wt%二乙基次膦酸铝。然后,该混合物充分搅拌4小时,并施用到7628型E-玻璃织物(BGF工业公司供应)上。然后,通过在171℃加热2.5min,使该玻璃织物粘合到部分固化的B-阶段上。通过在一台书型压机上以188℃和140psi将该预浸料坯和铜材压塑90min,制造一种四层层压体,使得一面上有一层Gould Foils公司的1盎司STD铜材、另一面上有一层Gould Foils公司的1盎司DST铜材。该预浸料坯和层压体显示出UL 94等级为V-0。
该蜜胺氰脲酸盐可以置换成蜜胺氰脲酸盐与蜜胺多磷酸盐的混合物。每种盐的粒度都是:该微粒的99.0%有小于或等于约12.0μm的直径、且该微粒的约50.0%有约3.0~约3.5μm的直径。
二乙基次膦酸铝可以置换成二乙基次膦酸锌。得到了优异的结果。
Claims (10)
2.按照权利要求1的预浸料坯或层压体,其中该蜜胺氰脲酸盐和蜜胺多磷酸盐微粒的50%有3.0~3.5μm的直径。
3.按照权利要求1的预浸料坯或层压体,其中该环氧树脂选自下列组成的一组:双酚A型环氧树脂,可熔可溶酚醛树脂型环氧树脂,脂环族环氧树脂,缩水甘油基型环氧树脂,联苯型环氧树脂,含有萘环的环氧树脂,含有环戊二烯的环氧树脂,多官能环氧树脂及其组合。
4.按照权利要求1的预浸料坯或层压体,进一步包含一种选自下列组成的一组的固化剂:苯酚可熔可溶酚醛树脂型硬化剂、甲酚可熔可溶酚醛树脂型硬化剂、二聚环戊二烯苯酚型硬化剂、苧烯型硬化剂、酸酐及其组合。
5.按照权利要求1的预浸料坯或层压体,进一步包含选自可挠曲型硬化剂的固化剂。
6.按照权利要求1的预浸料坯或层压体,其中,以该树脂的重量为基准,蜜胺氰脲酸盐和蜜胺多磷酸盐阻燃剂合计存在量可多达20.0wt%。
7.按照权利要求1的预浸料坯或层压体,其中,以该树脂的重量为基准,蜜胺氰脲酸盐和蜜胺多磷酸盐阻燃剂合计存在量为9wt%~13wt%。
8.按照权利要求1的预浸料坯或层压体,其中,次膦酸盐和双次膦酸盐阻燃剂与蜜胺氰脲酸盐和蜜胺多磷酸盐阻燃剂的重量比是1∶10~10∶1。
9.按照权利要求1的预浸料坯或层压体,其中,以该树脂的重量为基准,该次膦酸盐和/或双次膦酸盐的存在量可多达20wt%。
10.按照权利要求1的预浸料坯或层压体,其中,以该树脂的重量为基准,该次膦酸盐和/或双次膦酸盐的存在量为9.0wt%~13.0wt%。
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JP昭57-133147A 1982.08.17 |
JP特开2005-154511A 2005.06.16 |
Also Published As
Publication number | Publication date |
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JP5069692B2 (ja) | 2012-11-07 |
TW200732151A (en) | 2007-09-01 |
ATE496971T1 (de) | 2011-02-15 |
US20070111010A1 (en) | 2007-05-17 |
EP1948735A1 (en) | 2008-07-30 |
JP2009516379A (ja) | 2009-04-16 |
DE602006019896D1 (de) | 2011-03-10 |
CN101305049A (zh) | 2008-11-12 |
EP1948735B1 (en) | 2011-01-26 |
WO2007057311A1 (en) | 2007-05-24 |
TWI428242B (zh) | 2014-03-01 |
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