JPS57133147A - Flame-retardant epoxy resin composition - Google Patents

Flame-retardant epoxy resin composition

Info

Publication number
JPS57133147A
JPS57133147A JP1900681A JP1900681A JPS57133147A JP S57133147 A JPS57133147 A JP S57133147A JP 1900681 A JP1900681 A JP 1900681A JP 1900681 A JP1900681 A JP 1900681A JP S57133147 A JPS57133147 A JP S57133147A
Authority
JP
Japan
Prior art keywords
epoxy resin
adduct
melamine
phosphoric acid
flame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1900681A
Other languages
Japanese (ja)
Inventor
Naofumi Ebihara
Atsuo Kokubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1900681A priority Critical patent/JPS57133147A/en
Publication of JPS57133147A publication Critical patent/JPS57133147A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: A composition, prepared by incorporating a mixture of antimony trioxide with an organic compound containing bromine, an adduct of melamine with cyanuric acid and an adduct of melamine with phosphoric acid in an epoxy resin, and having improved flame retardancy without degrading the electrical cgaracteristics of the epoxy resin.
CONSTITUTION: An epoxy resin, particularly bisphenol A diglycidyl ether epoxy resin, is kneaded with 1W6wt% antimony trioxide, preferably having a particle diameter ≤100μ, 2W15wt% adduct of melamine with cyanuric acid, 1W6wt% adduct of melamine with phosphoric acid and an organic compound containing bromine, particularly bromobenzene, in an amount of 0.5W7 times that of the total amount of the adduct of the melamine with phosphoric acid.
COPYRIGHT: (C)1982,JPO&Japio
JP1900681A 1981-02-13 1981-02-13 Flame-retardant epoxy resin composition Pending JPS57133147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1900681A JPS57133147A (en) 1981-02-13 1981-02-13 Flame-retardant epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1900681A JPS57133147A (en) 1981-02-13 1981-02-13 Flame-retardant epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57133147A true JPS57133147A (en) 1982-08-17

Family

ID=11987424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1900681A Pending JPS57133147A (en) 1981-02-13 1981-02-13 Flame-retardant epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57133147A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003022948A3 (en) * 2001-09-07 2003-07-10 Hawo Oekologische Rohstoffe Gm Flame retarding agent and use thereof
WO2007057311A1 (en) * 2005-11-16 2007-05-24 Ciba Holding Inc. Flame retardant prepregs and laminates for printed circuit boards
JP2007131861A (en) * 2006-12-28 2007-05-31 Hitachi Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003022948A3 (en) * 2001-09-07 2003-07-10 Hawo Oekologische Rohstoffe Gm Flame retarding agent and use thereof
WO2007057311A1 (en) * 2005-11-16 2007-05-24 Ciba Holding Inc. Flame retardant prepregs and laminates for printed circuit boards
JP2009516379A (en) * 2005-11-16 2009-04-16 チバ ホールディング インコーポレーテッド Flame retardant prepregs and laminates for printed circuit boards
JP2007131861A (en) * 2006-12-28 2007-05-31 Hitachi Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device using the same

Similar Documents

Publication Publication Date Title
GB1508291A (en) High impact strength blends of polybutylene terephthalate
KR860700038A (en) Curable coating composition and epoxy resin additive useful therefor
JPS5610947A (en) Semiconductor sealing resin composition
JPS57125212A (en) Photo-polymerizable composition
JPS57133147A (en) Flame-retardant epoxy resin composition
JPS6431874A (en) Electroconductive resin paste for semiconductor
JPS5569616A (en) Epoxy resin composition for carbon fiber-reinforcement
IE832560L (en) Curable compositions
MY113697A (en) Process for the preparation of a flame-retardant epoxy resin moulding material
JPS5512103A (en) Flame-retardant resin composition
JPS5438520A (en) Manufacturing method of flyback transformer
JPS535253A (en) Flame-retardant polyphenylene ether resin compositions
JPS5740524A (en) Epoxy resin composition
JPS52121650A (en) Resin compositions having excellent flame retardancy
JPS5584348A (en) Flame-retardant acetal resin composition
JPS5584349A (en) Flame-retardant epoxy resin composition
JPS5618660A (en) Powdered paint composition for smoothing side seam of can
JPS5770152A (en) Flame-retardant epoxy resin composition
JPS57135854A (en) Flame-retardant resin composition
JPS562340A (en) Flame-retardant thermosetting resin composition
JPS57168A (en) Flame-retardant plastic composition
JPS5418860A (en) Stable dispersion composition of thermosetting resin
JPS5474899A (en) Flame retardant epoxy resin composition
JPS5723624A (en) Epoxy resin composition
JPS54139943A (en) Adhesive for bulb head