ATE496971T1 - Flammwidrige prepregs und laminate für leiterplatten - Google Patents
Flammwidrige prepregs und laminate für leiterplattenInfo
- Publication number
- ATE496971T1 ATE496971T1 AT06819255T AT06819255T ATE496971T1 AT E496971 T1 ATE496971 T1 AT E496971T1 AT 06819255 T AT06819255 T AT 06819255T AT 06819255 T AT06819255 T AT 06819255T AT E496971 T1 ATE496971 T1 AT E496971T1
- Authority
- AT
- Austria
- Prior art keywords
- laminates
- circuit boards
- prepregs
- particle size
- printed circuit
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5377—Phosphinous compounds, e.g. R2=P—OR'
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73730205P | 2005-11-16 | 2005-11-16 | |
PCT/EP2006/068093 WO2007057311A1 (en) | 2005-11-16 | 2006-11-06 | Flame retardant prepregs and laminates for printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE496971T1 true ATE496971T1 (de) | 2011-02-15 |
Family
ID=37575095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06819255T ATE496971T1 (de) | 2005-11-16 | 2006-11-06 | Flammwidrige prepregs und laminate für leiterplatten |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070111010A1 (de) |
EP (1) | EP1948735B1 (de) |
JP (1) | JP5069692B2 (de) |
CN (1) | CN101305049B (de) |
AT (1) | ATE496971T1 (de) |
DE (1) | DE602006019896D1 (de) |
TW (1) | TWI428242B (de) |
WO (1) | WO2007057311A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006316234A (ja) * | 2005-04-13 | 2006-11-24 | Shin Etsu Chem Co Ltd | 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
JP2006328112A (ja) * | 2005-05-23 | 2006-12-07 | Shin Etsu Chem Co Ltd | 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
US8268916B2 (en) * | 2006-09-25 | 2012-09-18 | Federal-Mogul World Wide, Inc. | Flame-retardant compound and method of forming a continuous material therefrom |
JP2008088302A (ja) * | 2006-10-02 | 2008-04-17 | Shin Etsu Chem Co Ltd | 難燃性接着剤組成物、ならびにそれを用いた接着剤シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
KR20080030934A (ko) * | 2006-10-02 | 2008-04-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 난연성 접착제 조성물, 및 그것을 이용한 접착제 시트,커버레이 필름 및 연성 동박 적층판 |
US8697786B2 (en) | 2010-06-16 | 2014-04-15 | Federal Mogul Powertrain, Inc. | Flame-retardant compound, continuous materials and products constructed therefrom and methods of manufacture thereof |
CN102850720B (zh) * | 2011-07-01 | 2015-07-22 | 台燿科技股份有限公司 | 熔合填料及其制法与应用 |
US20130081850A1 (en) | 2011-09-30 | 2013-04-04 | Ticona Llc | Fire-Resisting Thermoplastic Composition for Plenum Raceways and Other Conduits |
US9691636B2 (en) * | 2012-02-02 | 2017-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interposer frame and method of manufacturing the same |
TWI526493B (zh) * | 2012-09-10 | 2016-03-21 | 台燿科技股份有限公司 | 樹脂組合物及其應用 |
CN103146334B (zh) * | 2013-03-29 | 2014-08-20 | 黑龙江省科学院石油化学研究院 | 一种阻燃型的中温固化环氧胶膜及其制备方法 |
CN104610704A (zh) * | 2015-01-28 | 2015-05-13 | 清远市普塞呋磷化学有限公司 | 一种无卤阻燃酸酐固化环氧树脂组合物 |
JP6896591B2 (ja) * | 2017-11-14 | 2021-06-30 | Eneos株式会社 | プリプレグ、繊維強化複合材料及び成形体 |
KR102307896B1 (ko) * | 2019-12-10 | 2021-09-30 | 주식회사 포스코 | 난연성이 우수한 박판 유리접합 프린트 강판 및 이의 제조 방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57133147A (en) * | 1981-02-13 | 1982-08-17 | Toshiba Corp | Flame-retardant epoxy resin composition |
IL101664A (en) * | 1991-05-01 | 1996-01-31 | Rohm & Haas | Epoxy printing preparations for use in surface assembly |
EP0661342B1 (de) * | 1993-12-28 | 2003-04-02 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Additiv für thermoplastische Harze und flammhemmende Harzzusammensetzungen |
EP0742261B1 (de) * | 1995-04-10 | 2000-08-02 | Shin-Etsu Chemical Co., Ltd. | Epoxyharzmassen zur Einkapselung von Halbleitern, deren Herstellung und Verwendung, sowie damit eingekapselte Halbleiterbauteile |
JPH08302161A (ja) * | 1995-05-10 | 1996-11-19 | Hitachi Chem Co Ltd | 樹脂組成物及びその樹脂組成物をケミカルエッチングする方法 |
JPH1135795A (ja) * | 1997-07-14 | 1999-02-09 | Hitachi Chem Co Ltd | エポキシ樹脂組成物、エポキシ樹脂プリプレグ及びエポキシ樹脂積層板 |
DE19903707C2 (de) * | 1999-01-30 | 2003-05-28 | Clariant Gmbh | Flammwidrige duroplastische Massen |
DE19933901A1 (de) * | 1999-07-22 | 2001-02-01 | Clariant Gmbh | Flammschutzmittel-Kombination |
US6440567B1 (en) * | 2000-03-31 | 2002-08-27 | Isola Laminate Systems Corp. | Halogen free flame retardant adhesive resin coated composite |
US6384128B1 (en) * | 2000-07-19 | 2002-05-07 | Toray Industries, Inc. | Thermoplastic resin composition, molding material, and molded article thereof |
JP2002047334A (ja) * | 2000-08-02 | 2002-02-12 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物及び電気積層板 |
TW521548B (en) * | 2000-10-13 | 2003-02-21 | Zeon Corp | Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry |
US6632511B2 (en) * | 2001-11-09 | 2003-10-14 | Polyclad Laminates, Inc. | Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards |
US20040002559A1 (en) * | 2002-04-10 | 2004-01-01 | Malisa Troutman | Flame retardant coatings |
DE10244576A1 (de) * | 2002-09-25 | 2004-04-08 | Clariant Gmbh | Flammwidrige duroplastische Massen |
US20040166241A1 (en) * | 2003-02-20 | 2004-08-26 | Henkel Loctite Corporation | Molding compositions containing quaternary organophosphonium salts |
DE10321298B4 (de) * | 2003-05-13 | 2005-11-10 | Clariant Gmbh | Halogenhaltige Flammschutzmittel-Kombination und deren Verwendung |
DE10321297B4 (de) * | 2003-05-13 | 2005-11-10 | Clariant Gmbh | Flammwidrige duroplastische Massen, ein Verfahren zu ihrer Herstellung und ihre Verwendung |
DE10331887A1 (de) * | 2003-07-14 | 2005-02-17 | Clariant Gmbh | Flammschutzmittel-Zubereitung |
JP2005154511A (ja) * | 2003-11-21 | 2005-06-16 | Fujikura Ltd | ノンハロゲン難燃性接着剤組成物とその利用 |
DE102004009455A1 (de) * | 2004-02-27 | 2005-09-15 | Clariant Gmbh | Flammschutzmittel-Kombination für thermoplastische Polymere |
JP2005248048A (ja) * | 2004-03-05 | 2005-09-15 | Shin Etsu Chem Co Ltd | 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
-
2006
- 2006-11-06 JP JP2008540568A patent/JP5069692B2/ja not_active Expired - Fee Related
- 2006-11-06 EP EP20060819255 patent/EP1948735B1/de not_active Not-in-force
- 2006-11-06 CN CN2006800422401A patent/CN101305049B/zh not_active Expired - Fee Related
- 2006-11-06 WO PCT/EP2006/068093 patent/WO2007057311A1/en active Application Filing
- 2006-11-06 DE DE200660019896 patent/DE602006019896D1/de active Active
- 2006-11-06 AT AT06819255T patent/ATE496971T1/de not_active IP Right Cessation
- 2006-11-09 US US11/595,181 patent/US20070111010A1/en not_active Abandoned
- 2006-11-14 TW TW95142024A patent/TWI428242B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20070111010A1 (en) | 2007-05-17 |
CN101305049A (zh) | 2008-11-12 |
CN101305049B (zh) | 2011-08-03 |
TW200732151A (en) | 2007-09-01 |
JP2009516379A (ja) | 2009-04-16 |
EP1948735B1 (de) | 2011-01-26 |
DE602006019896D1 (de) | 2011-03-10 |
JP5069692B2 (ja) | 2012-11-07 |
WO2007057311A1 (en) | 2007-05-24 |
EP1948735A1 (de) | 2008-07-30 |
TWI428242B (zh) | 2014-03-01 |
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