ATE248203T1 - Unbrennbare harzzusammensetzung, prepreg, mehrschichtige platte, metallbedeckte mehrschichtige platte, leiterplatte und mehrschichtige leiterplatte - Google Patents

Unbrennbare harzzusammensetzung, prepreg, mehrschichtige platte, metallbedeckte mehrschichtige platte, leiterplatte und mehrschichtige leiterplatte

Info

Publication number
ATE248203T1
ATE248203T1 AT01124202T AT01124202T ATE248203T1 AT E248203 T1 ATE248203 T1 AT E248203T1 AT 01124202 T AT01124202 T AT 01124202T AT 01124202 T AT01124202 T AT 01124202T AT E248203 T1 ATE248203 T1 AT E248203T1
Authority
AT
Austria
Prior art keywords
layer
board
circuit board
resin composition
prepreg
Prior art date
Application number
AT01124202T
Other languages
German (de)
English (en)
Inventor
Nozomu Takano
Tomio Fukuda
Masato Miyatake
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of ATE248203T1 publication Critical patent/ATE248203T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31862—Melamine-aldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT01124202T 2000-10-13 2001-10-12 Unbrennbare harzzusammensetzung, prepreg, mehrschichtige platte, metallbedeckte mehrschichtige platte, leiterplatte und mehrschichtige leiterplatte ATE248203T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000313720 2000-10-13

Publications (1)

Publication Number Publication Date
ATE248203T1 true ATE248203T1 (de) 2003-09-15

Family

ID=18793092

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01124202T ATE248203T1 (de) 2000-10-13 2001-10-12 Unbrennbare harzzusammensetzung, prepreg, mehrschichtige platte, metallbedeckte mehrschichtige platte, leiterplatte und mehrschichtige leiterplatte

Country Status (9)

Country Link
US (1) US6706409B2 (enExample)
EP (1) EP1197514B1 (enExample)
JP (3) JP5186221B2 (enExample)
KR (2) KR100572532B1 (enExample)
CN (1) CN1212354C (enExample)
AT (1) ATE248203T1 (enExample)
DE (1) DE60100652T2 (enExample)
SG (1) SG108282A1 (enExample)
TW (2) TWI293320B (enExample)

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JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP2003003076A (ja) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、金属箔張積層板及びプリント配線板
WO2003087235A1 (en) * 2002-04-15 2003-10-23 Zeon Corporation Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particle and varnish
DE602005017509D1 (de) * 2004-11-26 2009-12-17 Lg Chemical Ltd Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
US7851536B2 (en) * 2005-09-15 2010-12-14 Rutgers, The State University Flame-retardant coating
EP2067824A1 (en) * 2006-09-29 2009-06-10 Nippon Shokubai Co., Ltd. Curable resin composition, optical material, and method of regulating optical material
CA2670273C (en) * 2006-11-20 2016-04-05 Grassroots Biotechnology, Inc. Plant growth and imaging devices and related methods and computer program products
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5539706B2 (ja) * 2009-12-16 2014-07-02 旭化成ケミカルズ株式会社 プリプレグ、金属箔張積層板、及びプリント配線板
JP5930549B2 (ja) * 2011-06-09 2016-06-08 住友精化株式会社 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
CN106364067B (zh) * 2016-08-29 2021-10-12 上海国纪电子材料有限公司 一种p10覆铜板
KR20220038380A (ko) 2019-07-18 2022-03-28 바스프 에스이 트윈 단량체 조성물 및 이의 유전 필름
KR102601266B1 (ko) * 2021-04-19 2023-11-13 주식회사 액시드 난연성 필름 및 난연성 필름을 위한 코팅 조성물
KR102807057B1 (ko) * 2021-06-18 2025-05-15 (주)엠케이켐앤텍 폴리실록산 난연성 코팅제, 난연성 폴리실록산, 이의 제조방법 및 이로부터 제조된 난연물품
JP7594819B2 (ja) 2022-10-25 2024-12-05 共立エレックス株式会社 自己消火性を有する樹脂材料

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JP4365987B2 (ja) * 2000-05-15 2009-11-18 協和化学工業株式会社 積層板用材料および電機および電子機器用樹脂組成物およびその成型品
JP3664124B2 (ja) * 2000-10-13 2005-06-22 日立化成工業株式会社 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Also Published As

Publication number Publication date
KR20040111217A (ko) 2004-12-31
JP2012122081A (ja) 2012-06-28
TWI293320B (enExample) 2008-02-11
JP2011099113A (ja) 2011-05-19
JP5186221B2 (ja) 2013-04-17
TWI293544B (enExample) 2008-02-11
TW200423831A (en) 2004-11-01
US6706409B2 (en) 2004-03-16
EP1197514B1 (en) 2003-08-27
DE60100652D1 (de) 2003-10-02
KR100570924B1 (ko) 2006-04-13
EP1197514A1 (en) 2002-04-17
JP2008179819A (ja) 2008-08-07
KR100572532B1 (ko) 2006-04-24
US20020068173A1 (en) 2002-06-06
SG108282A1 (en) 2005-01-28
CN1212354C (zh) 2005-07-27
CN1350031A (zh) 2002-05-22
KR20020029639A (ko) 2002-04-19
DE60100652T2 (de) 2004-06-24

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