CN1211855C - 带有冗余衬垫的铜导电线 - Google Patents
带有冗余衬垫的铜导电线 Download PDFInfo
- Publication number
- CN1211855C CN1211855C CNB001264206A CN00126420A CN1211855C CN 1211855 C CN1211855 C CN 1211855C CN B001264206 A CNB001264206 A CN B001264206A CN 00126420 A CN00126420 A CN 00126420A CN 1211855 C CN1211855 C CN 1211855C
- Authority
- CN
- China
- Prior art keywords
- barrier layer
- conductive barrier
- deelectric transferred
- metal
- high conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 229910052751 metal Inorganic materials 0.000 claims abstract description 157
- 239000002184 metal Substances 0.000 claims abstract description 157
- 230000004888 barrier function Effects 0.000 claims abstract description 93
- 239000010949 copper Substances 0.000 claims abstract description 67
- 229910052802 copper Inorganic materials 0.000 claims abstract description 66
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000009792 diffusion process Methods 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 36
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 229910052715 tantalum Inorganic materials 0.000 claims description 13
- 229910052721 tungsten Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 12
- 150000004767 nitrides Chemical class 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000010937 tungsten Substances 0.000 claims description 12
- -1 CuIn Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 11
- 229910016347 CuSn Inorganic materials 0.000 claims description 10
- 238000001465 metallisation Methods 0.000 claims description 10
- 229910016570 AlCu Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000012212 insulator Substances 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract 2
- 238000005137 deposition process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 127
- 238000005516 engineering process Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000008034 disappearance Effects 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000003870 refractory metal Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000090 poly(aryl ether) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 101150034459 Parpbp gene Proteins 0.000 description 1
- 229910004294 SiNxHy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76846—Layer combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (32)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/388132 | 1999-09-01 | ||
US09/388,132 US6433429B1 (en) | 1999-09-01 | 1999-09-01 | Copper conductive line with redundant liner and method of making |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1286497A CN1286497A (zh) | 2001-03-07 |
CN1211855C true CN1211855C (zh) | 2005-07-20 |
Family
ID=23532840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001264206A Expired - Lifetime CN1211855C (zh) | 1999-09-01 | 2000-08-31 | 带有冗余衬垫的铜导电线 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6433429B1 (zh) |
KR (1) | KR100345940B1 (zh) |
CN (1) | CN1211855C (zh) |
TW (1) | TW479340B (zh) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
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US6924226B2 (en) | 1999-10-02 | 2005-08-02 | Uri Cohen | Methods for making multiple seed layers for metallic interconnects |
US6610151B1 (en) * | 1999-10-02 | 2003-08-26 | Uri Cohen | Seed layers for interconnects and methods and apparatus for their fabrication |
US7105434B2 (en) * | 1999-10-02 | 2006-09-12 | Uri Cohen | Advanced seed layery for metallic interconnects |
US6420262B1 (en) | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
US6531407B1 (en) * | 2000-08-31 | 2003-03-11 | Micron Technology, Inc. | Method, structure and process flow to reduce line-line capacitance with low-K material |
US6794705B2 (en) * | 2000-12-28 | 2004-09-21 | Infineon Technologies Ag | Multi-layer Pt electrode for DRAM and FRAM with high K dielectric materials |
US20030008243A1 (en) * | 2001-07-09 | 2003-01-09 | Micron Technology, Inc. | Copper electroless deposition technology for ULSI metalization |
KR100460086B1 (ko) * | 2001-07-16 | 2004-12-04 | 주식회사 다산 씨.앤드.아이 | 확산방지막내에 동종 금속의 중간 금속박막을 적용한반도체 소자의 제조방법 |
US6724087B1 (en) * | 2002-07-31 | 2004-04-20 | Advanced Micro Devices, Inc. | Laminated conductive lines and methods of forming the same |
US6770491B2 (en) * | 2002-08-07 | 2004-08-03 | Micron Technology, Inc. | Magnetoresistive memory and method of manufacturing the same |
US20040175926A1 (en) * | 2003-03-07 | 2004-09-09 | Advanced Micro Devices, Inc. | Method for manufacturing a semiconductor component having a barrier-lined opening |
AU2003220989A1 (en) * | 2003-03-28 | 2004-10-25 | Fujitsu Limited | Semiconductor device |
US7709958B2 (en) * | 2004-06-18 | 2010-05-04 | Uri Cohen | Methods and structures for interconnect passivation |
US7956460B2 (en) * | 2004-12-28 | 2011-06-07 | Rohm Co., Ltd. | Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device |
US7138714B2 (en) * | 2005-02-11 | 2006-11-21 | International Business Machines Corporation | Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines |
US7279411B2 (en) * | 2005-11-15 | 2007-10-09 | International Business Machines Corporation | Process for forming a redundant structure |
JP4231055B2 (ja) * | 2006-02-06 | 2009-02-25 | 株式会社東芝 | 半導体装置及びその製造方法 |
KR100792358B1 (ko) | 2006-09-29 | 2008-01-09 | 주식회사 하이닉스반도체 | 반도체 소자의 금속배선 및 그 형성방법 |
TWI312578B (en) * | 2006-09-29 | 2009-07-21 | Innolux Display Corp | Thin film transistor substrate |
JP2008277339A (ja) * | 2007-04-25 | 2008-11-13 | Tdk Corp | 電子部品およびその製造方法 |
US20080265416A1 (en) * | 2007-04-27 | 2008-10-30 | Shen-Nan Lee | Metal line formation using advaced CMP slurry |
CN101330041B (zh) * | 2007-06-18 | 2010-05-19 | 中芯国际集成电路制造(上海)有限公司 | 金属前介质层内连接孔及其形成方法 |
KR101286239B1 (ko) * | 2007-08-24 | 2013-07-15 | 삼성전자주식회사 | 산소 포획 패턴을 갖는 반도체 소자의 배선 구조 및 그제조 방법 |
CN101593723B (zh) * | 2008-05-30 | 2010-09-22 | 中芯国际集成电路制造(北京)有限公司 | 通孔形成方法 |
US8461683B2 (en) * | 2011-04-01 | 2013-06-11 | Intel Corporation | Self-forming, self-aligned barriers for back-end interconnects and methods of making same |
US9117941B2 (en) * | 2011-09-02 | 2015-08-25 | King Dragon International Inc. | LED package and method of the same |
US20130056773A1 (en) * | 2011-09-02 | 2013-03-07 | Wen Kun Yang | Led package and method of the same |
US20150001570A1 (en) * | 2011-09-02 | 2015-01-01 | King Dragon International Inc. | LED Package and Method of the Same |
CN102332429A (zh) * | 2011-10-25 | 2012-01-25 | 上海华力微电子有限公司 | 大马士革结构制作方法 |
US9030013B2 (en) | 2012-09-21 | 2015-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structures comprising flexible buffer layers |
CN103794545B (zh) * | 2012-10-29 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | 一种制作金属互连线的方法 |
US20140138837A1 (en) * | 2012-11-20 | 2014-05-22 | Stmicroelectronics, Inc. | Sandwiched diffusion barrier and metal liner for an interconnect structure |
US9312203B2 (en) | 2013-01-02 | 2016-04-12 | Globalfoundries Inc. | Dual damascene structure with liner |
US9165824B2 (en) * | 2013-09-27 | 2015-10-20 | Intel Corporation | Interconnects with fully clad lines |
US9368448B2 (en) * | 2013-12-20 | 2016-06-14 | Applied Materials, Inc. | Metal-containing films as dielectric capping barrier for advanced interconnects |
US9281211B2 (en) | 2014-02-10 | 2016-03-08 | International Business Machines Corporation | Nanoscale interconnect structure |
US9812404B2 (en) * | 2015-12-30 | 2017-11-07 | Globalfoundries Inc | Electrical connection around a crackstop structure |
US10249501B2 (en) | 2016-03-28 | 2019-04-02 | International Business Machines Corporation | Single process for liner and metal fill |
CN107591357B (zh) * | 2016-07-07 | 2020-09-04 | 中芯国际集成电路制造(北京)有限公司 | 互连结构及其制造方法 |
US10283583B2 (en) | 2017-01-11 | 2019-05-07 | International Business Machines Corporation | 3D resistor structure with controlled resistivity |
US9972672B1 (en) | 2017-01-11 | 2018-05-15 | International Business Machines Corporation | Tunable resistor with curved resistor elements |
US9991330B1 (en) | 2017-01-11 | 2018-06-05 | International Business Machines Corporation | Resistors with controlled resistivity |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6373660A (ja) | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | 半導体装置 |
US4977440A (en) * | 1989-01-04 | 1990-12-11 | Stevens E Henry | Structure and process for contacting and interconnecting semiconductor devices within an integrated circuit |
JPH04259242A (ja) * | 1991-02-14 | 1992-09-14 | Fujitsu Ltd | 半導体装置の製造方法 |
US5164330A (en) | 1991-04-17 | 1992-11-17 | Intel Corporation | Etchback process for tungsten utilizing a NF3/AR chemistry |
JP3118785B2 (ja) | 1991-05-23 | 2000-12-18 | ソニー株式会社 | バリヤメタル構造の形成方法 |
US5262354A (en) | 1992-02-26 | 1993-11-16 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
US5300813A (en) | 1992-02-26 | 1994-04-05 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
JP2796919B2 (ja) * | 1992-05-11 | 1998-09-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | メタライゼーション複合体および半導体デバイス |
JP3326698B2 (ja) | 1993-03-19 | 2002-09-24 | 富士通株式会社 | 集積回路装置の製造方法 |
US5449947A (en) * | 1993-07-07 | 1995-09-12 | Actel Corporation | Read-disturb tolerant metal-to-metal antifuse and fabrication method |
EP0706215A3 (en) | 1994-09-15 | 1996-11-20 | Texas Instruments Inc | Semiconductor device improvements and manufacturing |
US5641992A (en) * | 1995-08-10 | 1997-06-24 | Siemens Components, Inc. | Metal interconnect structure for an integrated circuit with improved electromigration reliability |
US5723387A (en) | 1996-07-22 | 1998-03-03 | Industrial Technology Research Institute | Method and apparatus for forming very small scale Cu interconnect metallurgy on semiconductor substrates |
US6130161A (en) * | 1997-05-30 | 2000-10-10 | International Business Machines Corporation | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity |
US5847463A (en) * | 1997-08-22 | 1998-12-08 | Micron Technology, Inc. | Local interconnect comprising titanium nitride barrier layer |
US5942799A (en) * | 1997-11-20 | 1999-08-24 | Novellus Systems, Inc. | Multilayer diffusion barriers |
US6081021A (en) * | 1998-01-15 | 2000-06-27 | International Business Machines Corporation | Conductor-insulator-conductor structure |
US6130156A (en) * | 1998-04-01 | 2000-10-10 | Texas Instruments Incorporated | Variable doping of metal plugs for enhanced reliability |
JP2000049116A (ja) * | 1998-07-30 | 2000-02-18 | Toshiba Corp | 半導体装置及びその製造方法 |
US6346745B1 (en) * | 1998-12-04 | 2002-02-12 | Advanced Micro Devices, Inc. | Cu-A1 combined interconnect system |
US6221758B1 (en) * | 1999-01-04 | 2001-04-24 | Taiwan Semiconductor Manufacturing Company | Effective diffusion barrier process and device manufactured thereby |
US6204186B1 (en) * | 1999-01-13 | 2001-03-20 | Lucent Technologies Inc. | Method of making integrated circuit capacitor including tapered plug |
US6169010B1 (en) * | 1999-01-26 | 2001-01-02 | Lucent Technologies Inc. | Method for making integrated circuit capacitor including anchored plug |
JP3974284B2 (ja) * | 1999-03-18 | 2007-09-12 | 株式会社東芝 | 半導体装置の製造方法 |
-
1999
- 1999-09-01 US US09/388,132 patent/US6433429B1/en not_active Expired - Lifetime
-
2000
- 2000-07-31 TW TW089115302A patent/TW479340B/zh not_active IP Right Cessation
- 2000-08-25 KR KR1020000049627A patent/KR100345940B1/ko not_active IP Right Cessation
- 2000-08-31 CN CNB001264206A patent/CN1211855C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1286497A (zh) | 2001-03-07 |
US6433429B1 (en) | 2002-08-13 |
TW479340B (en) | 2002-03-11 |
KR100345940B1 (ko) | 2002-07-27 |
KR20010030134A (ko) | 2001-04-16 |
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