CN1209429C - 含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物 - Google Patents

含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物 Download PDF

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Publication number
CN1209429C
CN1209429C CNB008092818A CN00809281A CN1209429C CN 1209429 C CN1209429 C CN 1209429C CN B008092818 A CNB008092818 A CN B008092818A CN 00809281 A CN00809281 A CN 00809281A CN 1209429 C CN1209429 C CN 1209429C
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CN
China
Prior art keywords
silane
group
polishing
alkyl
propyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB008092818A
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English (en)
Chinese (zh)
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CN1367809A (zh
Inventor
史蒂文·K·格鲁姆宾
克里斯托弗·C·斯特赖恩兹
王淑敏
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Cabot Corp
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Cabot Corp
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Publication date
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H10P52/403—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Disintegrating Or Milling (AREA)
CNB008092818A 1999-07-07 2000-07-05 含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物 Expired - Lifetime CN1209429C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07
US60/142,706 1999-07-07

Publications (2)

Publication Number Publication Date
CN1367809A CN1367809A (zh) 2002-09-04
CN1209429C true CN1209429C (zh) 2005-07-06

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008092818A Expired - Lifetime CN1209429C (zh) 1999-07-07 2000-07-05 含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物

Country Status (14)

Country Link
US (2) US6582623B1 (enExample)
EP (1) EP1200532B1 (enExample)
JP (2) JP2003520283A (enExample)
KR (1) KR100590665B1 (enExample)
CN (1) CN1209429C (enExample)
AT (1) ATE338100T1 (enExample)
AU (1) AU5785700A (enExample)
CA (1) CA2378492A1 (enExample)
DE (1) DE60030444T2 (enExample)
HK (1) HK1046151A1 (enExample)
IL (1) IL147039A0 (enExample)
MY (1) MY126717A (enExample)
TW (1) TW538110B (enExample)
WO (1) WO2001004226A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104371553A (zh) * 2013-08-14 2015-02-25 安集微电子（上海）有限公司 一种化学机械抛光液以及应用
CN105985522A (zh) * 2014-12-24 2016-10-05 财团法人工业技术研究院 高分支聚硅氧烷与混成材料及其形成方法

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