IL147039A0 - Cmp composition containing silane modified abrasive particles - Google Patents

Cmp composition containing silane modified abrasive particles

Info

Publication number
IL147039A0
IL147039A0 IL14703900A IL14703900A IL147039A0 IL 147039 A0 IL147039 A0 IL 147039A0 IL 14703900 A IL14703900 A IL 14703900A IL 14703900 A IL14703900 A IL 14703900A IL 147039 A0 IL147039 A0 IL 147039A0
Authority
IL
Israel
Prior art keywords
abrasive particles
composition containing
containing silane
cmp composition
silane modified
Prior art date
Application number
IL14703900A
Other languages
English (en)
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of IL147039A0 publication Critical patent/IL147039A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Disintegrating Or Milling (AREA)
IL14703900A 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles IL147039A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07
PCT/US2000/018342 WO2001004226A2 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Publications (1)

Publication Number Publication Date
IL147039A0 true IL147039A0 (en) 2002-08-14

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14703900A IL147039A0 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Country Status (14)

Country Link
US (2) US6582623B1 (xx)
EP (1) EP1200532B1 (xx)
JP (2) JP2003520283A (xx)
KR (1) KR100590665B1 (xx)
CN (1) CN1209429C (xx)
AT (1) ATE338100T1 (xx)
AU (1) AU5785700A (xx)
CA (1) CA2378492A1 (xx)
DE (1) DE60030444T2 (xx)
HK (1) HK1046151A1 (xx)
IL (1) IL147039A0 (xx)
MY (1) MY126717A (xx)
TW (1) TW538110B (xx)
WO (1) WO2001004226A2 (xx)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
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WO2001004226A3 (en) 2002-10-03
TW538110B (en) 2003-06-21
CA2378492A1 (en) 2001-01-18
MY126717A (en) 2006-10-31
US20030209522A1 (en) 2003-11-13
DE60030444T2 (de) 2006-12-14
WO2001004226A2 (en) 2001-01-18
CN1209429C (zh) 2005-07-06
AU5785700A (en) 2001-01-30
DE60030444D1 (de) 2006-10-12
ATE338100T1 (de) 2006-09-15
KR20020026940A (ko) 2002-04-12
US6582623B1 (en) 2003-06-24
EP1200532B1 (en) 2006-08-30
CN1367809A (zh) 2002-09-04
KR100590665B1 (ko) 2006-06-19
JP2007088499A (ja) 2007-04-05
JP2003520283A (ja) 2003-07-02
EP1200532A1 (en) 2002-05-02

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