KR100590665B1 - 실란으로 개질된 연마제 입자를 함유하는 ｃｍｐ 조성물 - Google Patents

실란으로 개질된 연마제 입자를 함유하는 ｃｍｐ 조성물 Download PDF

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Publication number
KR100590665B1
KR100590665B1 KR20027000127A KR20027000127A KR100590665B1 KR 100590665 B1 KR100590665 B1 KR 100590665B1 KR 20027000127 A KR20027000127 A KR 20027000127A KR 20027000127 A KR20027000127 A KR 20027000127A KR 100590665 B1 KR100590665 B1 KR 100590665B1
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KR
South Korea
Prior art keywords
silane
alkyl
chemical mechanical
group
polishing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR20027000127A
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English (en)
Korean (ko)
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KR20020026940A (ko
Inventor
스티븐 케이. 그럼빈
크리스토퍼 씨. 스트레인즈
슈민 왕
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20020026940A publication Critical patent/KR20020026940A/ko
Application granted granted Critical
Publication of KR100590665B1 publication Critical patent/KR100590665B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H10P52/403—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Disintegrating Or Milling (AREA)
KR20027000127A 1999-07-07 2000-07-05 실란으로 개질된 연마제 입자를 함유하는 ｃｍｐ 조성물 Expired - Fee Related KR100590665B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07
US60/142,706 1999-07-07
PCT/US2000/018342 WO2001004226A2 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Publications (2)

Publication Number Publication Date
KR20020026940A KR20020026940A (ko) 2002-04-12
KR100590665B1 true KR100590665B1 (ko) 2006-06-19

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20027000127A Expired - Fee Related KR100590665B1 (ko) 1999-07-07 2000-07-05 실란으로 개질된 연마제 입자를 함유하는 ｃｍｐ 조성물

Country Status (14)

Country Link
US (2) US6582623B1 (enExample)
EP (1) EP1200532B1 (enExample)
JP (2) JP2003520283A (enExample)
KR (1) KR100590665B1 (enExample)
CN (1) CN1209429C (enExample)
AT (1) ATE338100T1 (enExample)
AU (1) AU5785700A (enExample)
CA (1) CA2378492A1 (enExample)
DE (1) DE60030444T2 (enExample)
HK (1) HK1046151A1 (enExample)
IL (1) IL147039A0 (enExample)
MY (1) MY126717A (enExample)
TW (1) TW538110B (enExample)
WO (1) WO2001004226A2 (enExample)

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KR102619857B1 (ko) * 2020-05-20 2023-12-29 삼성에스디아이 주식회사 텅스텐 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 연마 방법
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KR102577164B1 (ko) * 2020-12-29 2023-09-08 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 연마 조성물을 적용한 기판의 연마방법
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CN1367809A (zh) 2002-09-04
WO2001004226A3 (en) 2002-10-03
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US20030209522A1 (en) 2003-11-13
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AU5785700A (en) 2001-01-30
US6582623B1 (en) 2003-06-24
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WO2001004226A2 (en) 2001-01-18

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