CN1189930C - 机械性增强的焊接区界面及其方法 - Google Patents

机械性增强的焊接区界面及其方法 Download PDF

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CN1189930C
CN1189930C CNB001309676A CN00130967A CN1189930C CN 1189930 C CN1189930 C CN 1189930C CN B001309676 A CNB001309676 A CN B001309676A CN 00130967 A CN00130967 A CN 00130967A CN 1189930 C CN1189930 C CN 1189930C
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conductive
insulating layer
pad
layer
support structures
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CN1305224A (zh
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斯科特·K·鲍兹德尔
托马斯·S·科巴亚西
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NXP USA Inc
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Freescale Semiconductor Inc
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US20010051426A1 (en) 2001-12-13
KR100794476B1 (ko) 2008-01-14
US20050014356A1 (en) 2005-01-20
KR20010060374A (ko) 2001-07-06
US6803302B2 (en) 2004-10-12
CN1305224A (zh) 2001-07-25
JP2001156070A (ja) 2001-06-08
US7169694B2 (en) 2007-01-30

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