KR20010060374A - 기계적으로 로버스트 패드 인터페이스 및 방법 - Google Patents
기계적으로 로버스트 패드 인터페이스 및 방법 Download PDFInfo
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- KR20010060374A KR20010060374A KR1020000069538A KR20000069538A KR20010060374A KR 20010060374 A KR20010060374 A KR 20010060374A KR 1020000069538 A KR1020000069538 A KR 1020000069538A KR 20000069538 A KR20000069538 A KR 20000069538A KR 20010060374 A KR20010060374 A KR 20010060374A
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Abstract
Description
Claims (5)
- 반도체 소자를 형성하기 위한 방법에 있어서,반도체 기판(100) 위에 전도성 접착 패드(134)를 형성하는 단계;상기 전도성 접착 패드(134) 위에 유전체 층(136)을 형성하는 단계;상기 유전체 층(136) 부분들을 제거하는 단계로서,상기 전도성 접착 패드(134) 위에 놓이는 다수의 지지구조들(138)을 형성하고, 상기 전도성 접착 패드(134) 부분을 노출시키는 상기 유전체 층(136) 부분을 제거하는 단계;상기 다수의 지지구조들(138) 위에 놓이는 전도성 캐핑층(204)을 형성하는 단계로서, 상기 전도성 캐핑층(204)은 상기 전도성 접착 패드(134) 부분과 전기적으로 접촉하는 상기 전도성 캐핑층(204)을 형성하는 단계를 포함하는, 반도체 소자 형성 방법.
- 반도체 기판(100) 위에 전도성 접착 패드(134);상기 전도성 접착 패드(134) 위에 유전체 층(136);상기 전도성 접착 패드(134) 위에 놓이는 다수의 지지구조들(138);상기 다수의 지지구조들(138) 위에 놓이는 전도성 캐핑층(204)으로서, 상기 전도성 접착 패드(134) 부분과 전기적으로 접촉하는 상기 전도성 캐핑층(204)을 포함하는, 반도체 소자.
- 반도체 기판(100) 위에 전도성 접착 패드(134);상기 전도성 접착 패드(134) 위에 놓이는 다수의 지지구조들(138)을 포함하는 유전체 층(136)으로서, 상기 다수의 지지구조들(138)이 상기 유전체 층(136) 부분들과 상호 접속되는 상기 유전체 층(136);상기 다수의 지지구조들(138) 위에 놓이는 전도성 캐핑층(204)으로서, 상기 전도성 접착 패드(134) 부분과 전기적으로 접촉하는 상기 전도성 캐핑층(204)을 포함하는, 반도체 소자.
- 반도체 기판(100) 위에 전도성 접착 패드(134)로서, 다수의 유전체 스터드(stud; 302)들을 포함하는, 상기 전도성 접착 패드(134);전도성 접착 패드(134) 부분 위에 유전체 층(136);상기 전도성 접착 패드(134) 위에 다수의 지지구조들(138)로서, 상기 다수의 지지구조들(138) 중 적어도 한 부분은 상기 다수의 유전체 스터드(302)들 중 한 부분 위에 놓이는, 상기 다수의 지지구조들(138); 및상기 다수의 지지구조들(138) 위에 놓이는 전도성 캐핑층(204)으로서, 상기 전도성 접착 패드(134) 부분과 전기적으로 접촉하는 상기 전도서 캐핑층(204)을 포함하는, 반도체 소자.
- 반도체 기판(100) 위에 주로 구리를 함유하는 접착 패드(134);상기 주로 구리를 함유하는 접착 패드(134) 위에 놓이는 다수의 지지구조들(138)을 포함하는 유전체 층(136);상기 다수의 지지구조들(138) 위에 놓이는 알루미늄 함유 캐핑층(204)으로서, 상기 접착 패드(134) 부분들과 전기적으로 접촉하는 상기 알루미늄 함유 캐핑층(204)을 포함하는, 반도체 소자.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/443,443 | 1999-11-22 | ||
US09/443,443 US6803302B2 (en) | 1999-11-22 | 1999-11-22 | Method for forming a semiconductor device having a mechanically robust pad interface |
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KR20010060374A true KR20010060374A (ko) | 2001-07-06 |
KR100794476B1 KR100794476B1 (ko) | 2008-01-14 |
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US (2) | US6803302B2 (ko) |
JP (1) | JP2001156070A (ko) |
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CN (1) | CN1189930C (ko) |
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-
1999
- 1999-11-22 US US09/443,443 patent/US6803302B2/en not_active Expired - Lifetime
-
2000
- 2000-11-17 JP JP2000350865A patent/JP2001156070A/ja active Pending
- 2000-11-21 CN CNB001309676A patent/CN1189930C/zh not_active Expired - Lifetime
- 2000-11-22 KR KR1020000069538A patent/KR100794476B1/ko active IP Right Grant
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20180026613A (ko) * | 2016-09-02 | 2018-03-13 | 삼성디스플레이 주식회사 | 반도체 칩, 이를 구비한 전자장치 및 반도체 칩의 연결방법 |
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JP2001156070A (ja) | 2001-06-08 |
CN1189930C (zh) | 2005-02-16 |
US20050014356A1 (en) | 2005-01-20 |
KR100794476B1 (ko) | 2008-01-14 |
US20010051426A1 (en) | 2001-12-13 |
US7169694B2 (en) | 2007-01-30 |
CN1305224A (zh) | 2001-07-25 |
US6803302B2 (en) | 2004-10-12 |
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