CN116845058B - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN116845058B
CN116845058B CN202311046034.XA CN202311046034A CN116845058B CN 116845058 B CN116845058 B CN 116845058B CN 202311046034 A CN202311046034 A CN 202311046034A CN 116845058 B CN116845058 B CN 116845058B
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conductive
semiconductor
input terminal
semiconductor elements
resin
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Chinese (zh)
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CN116845058A (zh
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林健二
谷川昂平
福田谅介
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Rohm Co Ltd
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Rohm Co Ltd
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    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
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  • Inverter Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN202311046034.XA 2020-10-14 2021-09-27 半导体模块 Active CN116845058B (zh)

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Application Number Priority Date Filing Date Title
JP2020-173339 2020-10-14
JP2020173339 2020-10-14
CN202311046034.XA CN116845058B (zh) 2020-10-14 2021-09-27 半导体模块
CN202180064735.9A CN116195051A (zh) 2020-10-14 2021-09-27 半导体模块
PCT/JP2021/035261 WO2022080122A1 (ja) 2020-10-14 2021-09-27 半導体モジュール

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CN116845058A CN116845058A (zh) 2023-10-03
CN116845058B true CN116845058B (zh) 2024-08-27

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