CN113376974A - 光刻设备、用于卸载衬底的方法和用于装载衬底的方法 - Google Patents

光刻设备、用于卸载衬底的方法和用于装载衬底的方法 Download PDF

Info

Publication number
CN113376974A
CN113376974A CN202110667948.2A CN202110667948A CN113376974A CN 113376974 A CN113376974 A CN 113376974A CN 202110667948 A CN202110667948 A CN 202110667948A CN 113376974 A CN113376974 A CN 113376974A
Authority
CN
China
Prior art keywords
substrate
support table
gas
gas flow
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110667948.2A
Other languages
English (en)
Chinese (zh)
Inventor
A·B·热因克
R·F·J·马腾斯
Y·K·M·德沃斯
R·P·C·范多斯特
G·A·滕布林克
D·J·A·森登
C·H·M·巴尔蒂斯
J·J·H·格里特曾
J·M·卡姆明加
E·W·帕西蒂
T·波伊兹
A·C·沙伊贝利希
B·D·肖尔滕
A·施雷伊德
A·A·索伊硕特
S·A·特罗普
Y·J·G·范德威杰费
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV filed Critical ASML Holding NV
Publication of CN113376974A publication Critical patent/CN113376974A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202110667948.2A 2016-02-08 2016-12-22 光刻设备、用于卸载衬底的方法和用于装载衬底的方法 Pending CN113376974A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP16154599 2016-02-08
EP16154599.1 2016-02-08
EP16172678 2016-06-02
EP16172678.1 2016-06-02
CN201680081242.5A CN108604066B (zh) 2016-02-08 2016-12-22 光刻设备、用于卸载衬底的方法和用于装载衬底的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680081242.5A Division CN108604066B (zh) 2016-02-08 2016-12-22 光刻设备、用于卸载衬底的方法和用于装载衬底的方法

Publications (1)

Publication Number Publication Date
CN113376974A true CN113376974A (zh) 2021-09-10

Family

ID=57609912

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110667948.2A Pending CN113376974A (zh) 2016-02-08 2016-12-22 光刻设备、用于卸载衬底的方法和用于装载衬底的方法
CN201680081242.5A Active CN108604066B (zh) 2016-02-08 2016-12-22 光刻设备、用于卸载衬底的方法和用于装载衬底的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201680081242.5A Active CN108604066B (zh) 2016-02-08 2016-12-22 光刻设备、用于卸载衬底的方法和用于装载衬底的方法

Country Status (6)

Country Link
US (2) US11664264B2 (https=)
JP (4) JP6788678B2 (https=)
CN (2) CN113376974A (https=)
NL (1) NL2018051A (https=)
TW (1) TWI623824B (https=)
WO (1) WO2017137129A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388548B2 (en) * 2016-05-27 2019-08-20 Texas Instruments Incorporated Apparatus and method for operating machinery under uniformly distributed mechanical pressure
KR102450292B1 (ko) * 2017-06-06 2022-10-04 에이에스엠엘 네델란즈 비.브이. 지지 테이블로부터 대상물을 언로딩하는 방법
WO2019096554A1 (en) 2017-11-20 2019-05-23 Asml Netherlands B.V. Substrate holder, substrate support and method of clamping a substrate to a clamping system
CN108037638A (zh) * 2017-12-12 2018-05-15 中国科学院光电技术研究所 基于柔性铰链结构的超分辨光刻方法和装置
JP7164605B2 (ja) * 2017-12-13 2022-11-01 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置で使用するための基板ホルダ
TWI892652B (zh) * 2018-01-17 2025-08-01 日商東京威力科創股份有限公司 接合裝置及接合方法
KR102041044B1 (ko) * 2018-04-30 2019-11-05 피에스케이홀딩스 주식회사 기판 지지 유닛
KR102717708B1 (ko) * 2019-01-23 2024-10-15 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치에 사용되는 기판 홀더 및 디바이스 제조 방법
WO2021032356A1 (en) 2019-08-20 2021-02-25 Asml Netherlands B.V. Substrate holder, lithographic apparatus and method
CN110571168A (zh) * 2019-08-22 2019-12-13 长江存储科技有限责任公司 晶圆吸附盘、晶圆吸附系统以及晶圆键合设备
DE102019128667B3 (de) * 2019-10-23 2020-09-10 Semikron Elektronik Gmbh & Co. Kg Sinterpresse und Drucksinterverfahren zur Herstellung einer Sinterverbindung mittels der Sinterpresse
CN113075865B (zh) * 2020-01-06 2022-11-08 夏泰鑫半导体(青岛)有限公司 一种用于处理半导体衬底的装置和方法
NL2029255A (en) * 2020-10-16 2022-06-16 Asml Netherlands Bv Object table, stage apparatus, holding method and lithographic apparatus
EP4540659A1 (en) * 2022-06-15 2025-04-23 ASML Netherlands B.V. Substrate support and lithographic apparatus
CN119343633A (zh) * 2022-07-07 2025-01-21 Asml荷兰有限公司 衬底保持系统和光刻设备
CN119301525A (zh) 2022-07-11 2025-01-10 Asml荷兰有限公司 衬底保持器、光刻设备、计算机程序以及方法
WO2024217800A1 (en) 2023-04-20 2024-10-24 Asml Netherlands B.V. Method for evaluating the flatness of a substrate support
CN121312320A (zh) 2023-05-12 2026-01-09 Asml荷兰有限公司 衬底支撑件
WO2025021372A1 (en) 2023-07-25 2025-01-30 Asml Netherlands B.V. Substrate support
KR20250042075A (ko) 2023-09-19 2025-03-26 캐논 가부시끼가이샤 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법
JP2025043935A (ja) 2023-09-19 2025-04-01 キヤノン株式会社 情報処理装置、情報処理方法、およびプログラム
JP7762258B2 (ja) * 2023-09-19 2025-10-29 キヤノン株式会社 基板保持装置、基板処理装置、分離方法、および物品製造方法
WO2025098681A1 (en) 2023-11-07 2025-05-15 Asml Netherlands B.V. Substrate support, substrate support system and method to clamp a substrate on a substrate support
WO2025119563A2 (en) 2023-12-05 2025-06-12 Asml Netherlands B.V. Method of substrate support repair
JP7773576B2 (ja) * 2024-02-29 2025-11-19 キヤノン株式会社 保持装置、基板処理装置及び物品の製造方法
WO2026017338A1 (en) 2024-07-16 2026-01-22 Asml Netherlands B.V. Substrate support
WO2026073643A1 (en) 2024-10-03 2026-04-09 Asml Netherlands B.V. Substrate support

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5680141A (en) 1979-12-04 1981-07-01 Seiko Epson Corp Manufacture device of semiconductor
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
JPS6099538A (ja) 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 ピンチヤツク
DE69133413D1 (de) 1990-05-07 2004-10-21 Canon Kk Substratträger des Vakuumtyps
DE69130434T2 (de) * 1990-06-29 1999-04-29 Canon K.K., Tokio/Tokyo Platte zum Arbeiten unter Vakuum
JPH0945755A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd ウェハチャックおよびウェハ吸着方法
US5761023A (en) 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
JP2991110B2 (ja) 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置
JPH1092738A (ja) * 1996-09-18 1998-04-10 Canon Inc 基板保持装置およびこれを用いた露光装置
JP3102850B2 (ja) 1996-11-28 2000-10-23 株式会社日本マクシス 水晶ブランクの傷検査装置
JPH11163107A (ja) * 1997-11-28 1999-06-18 Nikon Corp ウエハホルダ
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
US6257564B1 (en) 1998-05-15 2001-07-10 Applied Materials, Inc Vacuum chuck having vacuum-nipples wafer support
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
EP1077393A2 (en) 1999-08-19 2001-02-21 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP2001332609A (ja) 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
KR20030028985A (ko) 2001-10-05 2003-04-11 삼성전자주식회사 반도체 소자 제조용 장비에서의 웨이퍼 척
US20030168174A1 (en) * 2002-03-08 2003-09-11 Foree Michael Todd Gas cushion susceptor system
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
JP2004165472A (ja) * 2002-11-14 2004-06-10 Nikon Corp 基板保持装置及び露光装置
EP1431825A1 (en) 2002-12-20 2004-06-23 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate holder
JP3769618B2 (ja) * 2003-04-21 2006-04-26 防衛庁技術研究本部長 真空吸着装置
JP2005012009A (ja) 2003-06-19 2005-01-13 Nikon Corp 基板保持装置、ステージ装置及び露光装置
JP4600286B2 (ja) 2003-12-16 2010-12-15 株式会社ニコン ステージ装置、露光装置、及び露光方法
JP2005191338A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd 基板の保持装置および方法
US7214548B2 (en) * 2004-08-30 2007-05-08 International Business Machines Corporation Apparatus and method for flattening a warped substrate
EP1843386A1 (en) 2005-01-18 2007-10-10 Nikon Corporation Liquid removing apparatus, exposure apparatus and device manufacturing method
JP4579004B2 (ja) * 2005-02-23 2010-11-10 株式会社日立ハイテクノロジーズ 露光装置、露光方法、及び表示用パネル基板の製造方法
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4634992B2 (ja) * 2005-11-04 2011-02-16 株式会社ニューフレアテクノロジー 位置計測装置及び位置ずれ量計測方法
JP4968076B2 (ja) 2005-12-08 2012-07-04 株式会社ニコン 基板保持装置、露光装置、露光方法、及びデバイス製造方法
KR100819556B1 (ko) * 2006-02-20 2008-04-07 삼성전자주식회사 웨이퍼 스테이지, 이를 갖는 노광설비 및 이를 사용한 웨이퍼 평평도 보정 방법
JP2007238290A (ja) * 2006-03-09 2007-09-20 Seiko Epson Corp ワークテーブル、ワーク矯正方法、ワーク処理装置、ワーク移載装置、ワーク搬送装置およびベルトコンベア
JP2007273693A (ja) 2006-03-31 2007-10-18 Nikon Corp 基板保持部材及び基板保持方法、基板保持装置、並びに露光装置及び露光方法
JPWO2007116752A1 (ja) * 2006-04-05 2009-08-20 株式会社ニコン ステージ装置、露光装置、ステージ制御方法、露光方法、およびデバイス製造方法
JP5029611B2 (ja) * 2006-09-08 2012-09-19 株式会社ニコン クリーニング用部材、クリーニング方法、露光装置、並びにデバイス製造方法
JP4899879B2 (ja) * 2007-01-17 2012-03-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
WO2008156366A1 (en) 2007-06-21 2008-12-24 Asml Netherlands B.V. Clamping device and object loading method
NL1035942A1 (nl) 2007-09-27 2009-03-30 Asml Netherlands Bv Lithographic Apparatus and Method of Cleaning a Lithographic Apparatus.
JP2009117567A (ja) 2007-11-06 2009-05-28 Nihon Ceratec Co Ltd 真空チャック
JP5219599B2 (ja) * 2008-04-14 2013-06-26 株式会社日立ハイテクノロジーズ プロキシミティ露光装置、プロキシミティ露光装置の基板吸着方法、及び表示用パネル基板の製造方法
NL1036835A1 (nl) * 2008-05-08 2009-11-11 Asml Netherlands Bv Lithographic Apparatus and Method.
JP2010039227A (ja) * 2008-08-06 2010-02-18 Hitachi High-Technologies Corp 露光装置、露光方法及び基板載置方法
TW201009895A (en) 2008-08-11 2010-03-01 Nikon Corp Exposure apparatus, maintaining method and device fabricating method
JP2010128079A (ja) 2008-11-26 2010-06-10 Hitachi High-Technologies Corp プロキシミティ露光装置、プロキシミティ露光装置の基板支持方法、及び表示用パネル基板の製造方法
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
JP2010153585A (ja) * 2008-12-25 2010-07-08 Ebara Corp 基板保持具および基板保持方法
JP5665336B2 (ja) * 2009-04-06 2015-02-04 キヤノン株式会社 基板保持装置、及びそれを用いたリソグラフィー装置
JP2011029565A (ja) * 2009-07-29 2011-02-10 Toppan Printing Co Ltd 基板保持装置
NL2006536A (en) * 2010-05-13 2011-11-15 Asml Netherlands Bv A substrate table, a lithographic apparatus, a method of flattening an edge of a substrate and a device manufacturing method.
JP2012151407A (ja) * 2011-01-21 2012-08-09 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
JP5778093B2 (ja) 2011-08-10 2015-09-16 エーエスエムエル ネザーランズ ビー．ブイ． 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法
JP2013187465A (ja) * 2012-03-09 2013-09-19 Nikon Corp 露光装置、クリーニング工具、メンテナンス方法、及びデバイス製造方法
CN103367217B (zh) 2012-04-11 2016-08-24 上海微电子装备有限公司 一种硅片吸附装置及其吸附方法
US9022392B2 (en) 2012-08-31 2015-05-05 United Microelectronics Corporation Chuck and semiconductor process using the same
WO2014084060A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 載置用部材およびその製造方法
JP6108803B2 (ja) 2012-12-07 2017-04-05 日本特殊陶業株式会社 基板保持部材
CN103904013B (zh) 2012-12-28 2016-12-28 上海微电子装备有限公司 一种真空吸附装置及吸附测校方法
JP2015018927A (ja) 2013-07-10 2015-01-29 株式会社ニコン 基板保持方法及び装置、並びに露光方法及び装置
JP6376871B2 (ja) * 2013-07-18 2018-08-22 株式会社ブイ・テクノロジー 密着露光装置
AT517792A3 (de) 2013-09-26 2018-04-15 Suss Microtec Lithography Gmbh Aufspannvorrichtung zum Ansaugen und Halten eines Wafers
EP3137945B1 (en) 2014-04-30 2020-05-06 ASML Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
WO2015169616A1 (en) 2014-05-06 2015-11-12 Asml Netherlands B.V. Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method
JP6650275B2 (ja) 2016-01-20 2020-02-19 日本特殊陶業株式会社 基板保持装置

Also Published As

Publication number Publication date
WO2017137129A1 (en) 2017-08-17
TW201740209A (zh) 2017-11-16
JP2021043450A (ja) 2021-03-18
JP2022177165A (ja) 2022-11-30
JP6788678B2 (ja) 2020-11-25
JP2025041598A (ja) 2025-03-26
NL2018051A (en) 2017-08-11
TWI623824B (zh) 2018-05-11
US11664264B2 (en) 2023-05-30
JP2019505841A (ja) 2019-02-28
CN108604066B (zh) 2021-06-29
US20230260820A1 (en) 2023-08-17
US20190043749A1 (en) 2019-02-07
CN108604066A (zh) 2018-09-28

Similar Documents

Publication Publication Date Title
CN108604066B (zh) 光刻设备、用于卸载衬底的方法和用于装载衬底的方法
US10599053B2 (en) Lithographic apparatus and method for loading a substrate
EP3137945B1 (en) Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
EP3391149B1 (en) A substrate holder, a lithographic apparatus and method of manufacturing devices
CN105683839B (zh) 用于光刻设备的支撑台、光刻设备以及器件制造方法
JP6420900B2 (ja) リソグラフィ装置用の支持テーブル、基板をロードする方法、リソグラフィ装置及びデバイス製造方法
KR20220145343A (ko) 기판 지지체 및 기판 테이블
US11385547B2 (en) Extraction body for lithographic apparatus
CN120188104A (zh) 衬底支撑件和光刻设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination