CN113192867B - 芯片贴装装置以及半导体器件的制造方法 - Google Patents

芯片贴装装置以及半导体器件的制造方法 Download PDF

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Publication number
CN113192867B
CN113192867B CN202110446716.4A CN202110446716A CN113192867B CN 113192867 B CN113192867 B CN 113192867B CN 202110446716 A CN202110446716 A CN 202110446716A CN 113192867 B CN113192867 B CN 113192867B
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wafer
substrate
robot
chip
bare chip
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CN113192867A (zh
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冈本直树
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202110446716.4A 2016-03-11 2016-11-18 芯片贴装装置以及半导体器件的制造方法 Active CN113192867B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110446716.4A CN113192867B (zh) 2016-03-11 2016-11-18 芯片贴装装置以及半导体器件的制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-048988 2016-03-11
JP2016048988A JP6705668B2 (ja) 2016-03-11 2016-03-11 ダイボンディング装置および半導体装置の製造方法
CN202110446716.4A CN113192867B (zh) 2016-03-11 2016-11-18 芯片贴装装置以及半导体器件的制造方法
CN201611028985.4A CN107180772B (zh) 2016-03-11 2016-11-18 芯片贴装装置以及半导体器件的制造方法

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CN113192867A CN113192867A (zh) 2021-07-30
CN113192867B true CN113192867B (zh) 2024-01-23

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CN201611028985.4A Active CN107180772B (zh) 2016-03-11 2016-11-18 芯片贴装装置以及半导体器件的制造方法

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JP (1) JP6705668B2 (https=)
KR (2) KR101835232B1 (https=)
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TW (1) TWI615905B (https=)

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JP7018338B2 (ja) * 2018-03-19 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7102271B2 (ja) * 2018-07-17 2022-07-19 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102113118B1 (ko) * 2018-11-21 2020-05-20 제너셈(주) 패키지 언로딩 장치
KR102687859B1 (ko) 2018-11-29 2024-07-24 삼성디스플레이 주식회사 기판 이송 시스템 및 기판 이송 방법
JP7146352B2 (ja) * 2018-12-10 2022-10-04 株式会社ディスコ 試験装置
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
KR20200119971A (ko) 2019-04-11 2020-10-21 주식회사 지와이엘테크놀로지 반도체 본딩 장치 및 그 방법
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
JP6880158B1 (ja) * 2019-11-29 2021-06-02 キヤノンマシナリー株式会社 ワーク移載装置、ワーク移載方法、移載体の製造方法、半導体装置の製造方法、及びダイボンダ
JP7530793B2 (ja) * 2020-10-02 2024-08-08 ニデックインスツルメンツ株式会社 産業用ロボット
KR102434404B1 (ko) * 2022-04-05 2022-08-18 홍문복 자동차 클러스터 조립을 위한 옵티컬 본딩 공정 설비 및 이를 이용한 본딩 방법
WO2025028244A1 (ja) * 2023-07-28 2025-02-06 東京エレクトロン株式会社 接合装置、接合システム、及び接合方法

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Also Published As

Publication number Publication date
KR20170106175A (ko) 2017-09-20
KR20180028057A (ko) 2018-03-15
CN107180772B (zh) 2021-04-30
KR101990242B1 (ko) 2019-09-24
CN107180772A (zh) 2017-09-19
JP6705668B2 (ja) 2020-06-03
TW201732961A (zh) 2017-09-16
CN113192867A (zh) 2021-07-30
TWI615905B (zh) 2018-02-21
JP2017163121A (ja) 2017-09-14
KR101835232B1 (ko) 2018-03-06

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