CN110352470B - 基板处理系统、基板处理装置以及基板处理方法 - Google Patents
基板处理系统、基板处理装置以及基板处理方法 Download PDFInfo
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- CN110352470B CN110352470B CN201780087607.XA CN201780087607A CN110352470B CN 110352470 B CN110352470 B CN 110352470B CN 201780087607 A CN201780087607 A CN 201780087607A CN 110352470 B CN110352470 B CN 110352470B
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- 239000000758 substrate Substances 0.000 title claims abstract description 522
- 238000003672 processing method Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 claims abstract description 53
- 238000002360 preparation method Methods 0.000 claims 3
- 230000032258 transport Effects 0.000 description 10
- 230000006870 function Effects 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
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- 238000011144 upstream manufacturing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Business, Economics & Management (AREA)
- Automation & Control Theory (AREA)
- Human Resources & Organizations (AREA)
- General Business, Economics & Management (AREA)
- Economics (AREA)
- Marketing (AREA)
- Primary Health Care (AREA)
- Strategic Management (AREA)
- Tourism & Hospitality (AREA)
- General Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Health & Medical Sciences (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017039231A JP6949511B2 (ja) | 2017-03-02 | 2017-03-02 | 基板処理システムおよび基板処理装置 |
JP2017-039231 | 2017-03-02 | ||
PCT/JP2017/046520 WO2018159085A1 (ja) | 2017-03-02 | 2017-12-26 | 基板処理システム、基板処理装置、および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110352470A CN110352470A (zh) | 2019-10-18 |
CN110352470B true CN110352470B (zh) | 2023-03-28 |
Family
ID=63371246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780087607.XA Active CN110352470B (zh) | 2017-03-02 | 2017-12-26 | 基板处理系统、基板处理装置以及基板处理方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6949511B2 (ja) |
KR (1) | KR102349876B1 (ja) |
CN (1) | CN110352470B (ja) |
TW (1) | TWI646621B (ja) |
WO (1) | WO2018159085A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7145019B2 (ja) * | 2018-09-19 | 2022-09-30 | 株式会社Screenホールディングス | レシピ変換方法、レシピ変換プログラム、レシピ変換装置および基板処理システム |
JP2023140142A (ja) | 2022-03-22 | 2023-10-04 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法及びプログラム |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10256342A (ja) * | 1997-03-06 | 1998-09-25 | Kokusai Electric Co Ltd | 搬送制御方法 |
JP2000141181A (ja) * | 1998-11-10 | 2000-05-23 | Amada Co Ltd | 板金加工ラインの割り込み制御方法およびその装置 |
CN1255683A (zh) * | 1998-12-01 | 2000-06-07 | 日本电气株式会社 | 批量工件运送控制系统及其运送控制方法 |
JP2001351964A (ja) * | 2000-06-09 | 2001-12-21 | Nec Corp | 半導体製造ラインの搬送制御システム及び方法並びに記録媒体 |
US6496747B1 (en) * | 1998-10-13 | 2002-12-17 | Canon Kabushiki Kaisha | Semiconductor device manufacturing apparatus and information processing system therefor |
JP2003031453A (ja) * | 2001-07-16 | 2003-01-31 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2003092443A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | マルチチャンバ成膜装置の処理スケジューリング方法 |
JP2003197711A (ja) * | 2001-12-27 | 2003-07-11 | Tokyo Electron Ltd | 被処理体の搬送システム及び被処理体の搬送方法 |
JP2005148940A (ja) * | 2003-11-12 | 2005-06-09 | Kawasaki Microelectronics Kk | スケジューリング装置 |
JP2008084954A (ja) * | 2006-09-26 | 2008-04-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2008217058A (ja) * | 2007-02-28 | 2008-09-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2010225890A (ja) * | 2009-03-24 | 2010-10-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2011059927A (ja) * | 2009-09-09 | 2011-03-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2011146448A (ja) * | 2010-01-12 | 2011-07-28 | Ebara Corp | スケジューラ、基板処理装置、及び基板処理装置の運転方法 |
CN103010705A (zh) * | 2011-09-26 | 2013-04-03 | 大日本网屏制造株式会社 | 基板处理系统 |
CN104662640A (zh) * | 2012-09-21 | 2015-05-27 | 斯克林集团公司 | 调度表生成装置、程序以及方法、基板处理装置以及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6584369B2 (en) * | 2000-02-02 | 2003-06-24 | Texas Instruments Incorporated | Method and system for dispatching semiconductor lots to manufacturing equipment for fabrication |
JP2001345241A (ja) * | 2000-05-31 | 2001-12-14 | Tokyo Electron Ltd | 基板処理システム及び基板処理方法 |
JP5448682B2 (ja) | 2009-09-29 | 2014-03-19 | 大日本スクリーン製造株式会社 | 基板処理システム及びその制御方法 |
US8655472B2 (en) * | 2010-01-12 | 2014-02-18 | Ebara Corporation | Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus |
JP6880364B2 (ja) * | 2015-08-18 | 2021-06-02 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
-
2017
- 2017-03-02 JP JP2017039231A patent/JP6949511B2/ja active Active
- 2017-12-26 CN CN201780087607.XA patent/CN110352470B/zh active Active
- 2017-12-26 KR KR1020197025091A patent/KR102349876B1/ko active IP Right Grant
- 2017-12-26 WO PCT/JP2017/046520 patent/WO2018159085A1/ja active Application Filing
-
2018
- 2018-01-16 TW TW107101571A patent/TWI646621B/zh active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10256342A (ja) * | 1997-03-06 | 1998-09-25 | Kokusai Electric Co Ltd | 搬送制御方法 |
US6496747B1 (en) * | 1998-10-13 | 2002-12-17 | Canon Kabushiki Kaisha | Semiconductor device manufacturing apparatus and information processing system therefor |
JP2000141181A (ja) * | 1998-11-10 | 2000-05-23 | Amada Co Ltd | 板金加工ラインの割り込み制御方法およびその装置 |
CN1255683A (zh) * | 1998-12-01 | 2000-06-07 | 日本电气株式会社 | 批量工件运送控制系统及其运送控制方法 |
JP2001351964A (ja) * | 2000-06-09 | 2001-12-21 | Nec Corp | 半導体製造ラインの搬送制御システム及び方法並びに記録媒体 |
JP2003031453A (ja) * | 2001-07-16 | 2003-01-31 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2003092443A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | マルチチャンバ成膜装置の処理スケジューリング方法 |
JP2003197711A (ja) * | 2001-12-27 | 2003-07-11 | Tokyo Electron Ltd | 被処理体の搬送システム及び被処理体の搬送方法 |
JP2005148940A (ja) * | 2003-11-12 | 2005-06-09 | Kawasaki Microelectronics Kk | スケジューリング装置 |
JP2008084954A (ja) * | 2006-09-26 | 2008-04-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2008217058A (ja) * | 2007-02-28 | 2008-09-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2010225890A (ja) * | 2009-03-24 | 2010-10-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2011059927A (ja) * | 2009-09-09 | 2011-03-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP2011146448A (ja) * | 2010-01-12 | 2011-07-28 | Ebara Corp | スケジューラ、基板処理装置、及び基板処理装置の運転方法 |
CN103010705A (zh) * | 2011-09-26 | 2013-04-03 | 大日本网屏制造株式会社 | 基板处理系统 |
CN104662640A (zh) * | 2012-09-21 | 2015-05-27 | 斯克林集团公司 | 调度表生成装置、程序以及方法、基板处理装置以及方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2018159085A1 (ja) | 2018-09-07 |
KR20190112069A (ko) | 2019-10-02 |
KR102349876B1 (ko) | 2022-01-10 |
JP6949511B2 (ja) | 2021-10-13 |
CN110352470A (zh) | 2019-10-18 |
TW201834124A (zh) | 2018-09-16 |
TWI646621B (zh) | 2019-01-01 |
JP2018147952A (ja) | 2018-09-20 |
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