CN110352470B - 基板处理系统、基板处理装置以及基板处理方法 - Google Patents

基板处理系统、基板处理装置以及基板处理方法 Download PDF

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Publication number
CN110352470B
CN110352470B CN201780087607.XA CN201780087607A CN110352470B CN 110352470 B CN110352470 B CN 110352470B CN 201780087607 A CN201780087607 A CN 201780087607A CN 110352470 B CN110352470 B CN 110352470B
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lot
substrate processing
schedule
processing apparatus
temporary
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Chinese (zh)
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CN110352470A (zh
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柴田英树
木村隆一
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Automation & Control Theory (AREA)
  • Human Resources & Organizations (AREA)
  • General Business, Economics & Management (AREA)
  • Economics (AREA)
  • Marketing (AREA)
  • Primary Health Care (AREA)
  • Strategic Management (AREA)
  • Tourism & Hospitality (AREA)
  • General Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Health & Medical Sciences (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
CN201780087607.XA 2017-03-02 2017-12-26 基板处理系统、基板处理装置以及基板处理方法 Active CN110352470B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017039231A JP6949511B2 (ja) 2017-03-02 2017-03-02 基板処理システムおよび基板処理装置
JP2017-039231 2017-03-02
PCT/JP2017/046520 WO2018159085A1 (ja) 2017-03-02 2017-12-26 基板処理システム、基板処理装置、および基板処理方法

Publications (2)

Publication Number Publication Date
CN110352470A CN110352470A (zh) 2019-10-18
CN110352470B true CN110352470B (zh) 2023-03-28

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CN201780087607.XA Active CN110352470B (zh) 2017-03-02 2017-12-26 基板处理系统、基板处理装置以及基板处理方法

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Country Link
JP (1) JP6949511B2 (ja)
KR (1) KR102349876B1 (ja)
CN (1) CN110352470B (ja)
TW (1) TWI646621B (ja)
WO (1) WO2018159085A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7145019B2 (ja) * 2018-09-19 2022-09-30 株式会社Ｓｃｒｅｅｎホールディングス レシピ変換方法、レシピ変換プログラム、レシピ変換装置および基板処理システム
JP2023140142A (ja) 2022-03-22 2023-10-04 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256342A (ja) * 1997-03-06 1998-09-25 Kokusai Electric Co Ltd 搬送制御方法
JP2000141181A (ja) * 1998-11-10 2000-05-23 Amada Co Ltd 板金加工ラインの割り込み制御方法およびその装置
CN1255683A (zh) * 1998-12-01 2000-06-07 日本电气株式会社 批量工件运送控制系统及其运送控制方法
JP2001351964A (ja) * 2000-06-09 2001-12-21 Nec Corp 半導体製造ラインの搬送制御システム及び方法並びに記録媒体
US6496747B1 (en) * 1998-10-13 2002-12-17 Canon Kabushiki Kaisha Semiconductor device manufacturing apparatus and information processing system therefor
JP2003031453A (ja) * 2001-07-16 2003-01-31 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2003092443A (ja) * 2001-09-18 2003-03-28 Hitachi Ltd マルチチャンバ成膜装置の処理スケジューリング方法
JP2003197711A (ja) * 2001-12-27 2003-07-11 Tokyo Electron Ltd 被処理体の搬送システム及び被処理体の搬送方法
JP2005148940A (ja) * 2003-11-12 2005-06-09 Kawasaki Microelectronics Kk スケジューリング装置
JP2008084954A (ja) * 2006-09-26 2008-04-10 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2008217058A (ja) * 2007-02-28 2008-09-18 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2010225890A (ja) * 2009-03-24 2010-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2011059927A (ja) * 2009-09-09 2011-03-24 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2011146448A (ja) * 2010-01-12 2011-07-28 Ebara Corp スケジューラ、基板処理装置、及び基板処理装置の運転方法
CN103010705A (zh) * 2011-09-26 2013-04-03 大日本网屏制造株式会社 基板处理系统
CN104662640A (zh) * 2012-09-21 2015-05-27 斯克林集团公司 调度表生成装置、程序以及方法、基板处理装置以及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6584369B2 (en) * 2000-02-02 2003-06-24 Texas Instruments Incorporated Method and system for dispatching semiconductor lots to manufacturing equipment for fabrication
JP2001345241A (ja) * 2000-05-31 2001-12-14 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP5448682B2 (ja) 2009-09-29 2014-03-19 大日本スクリーン製造株式会社 基板処理システム及びその制御方法
US8655472B2 (en) * 2010-01-12 2014-02-18 Ebara Corporation Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus
JP6880364B2 (ja) * 2015-08-18 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256342A (ja) * 1997-03-06 1998-09-25 Kokusai Electric Co Ltd 搬送制御方法
US6496747B1 (en) * 1998-10-13 2002-12-17 Canon Kabushiki Kaisha Semiconductor device manufacturing apparatus and information processing system therefor
JP2000141181A (ja) * 1998-11-10 2000-05-23 Amada Co Ltd 板金加工ラインの割り込み制御方法およびその装置
CN1255683A (zh) * 1998-12-01 2000-06-07 日本电气株式会社 批量工件运送控制系统及其运送控制方法
JP2001351964A (ja) * 2000-06-09 2001-12-21 Nec Corp 半導体製造ラインの搬送制御システム及び方法並びに記録媒体
JP2003031453A (ja) * 2001-07-16 2003-01-31 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2003092443A (ja) * 2001-09-18 2003-03-28 Hitachi Ltd マルチチャンバ成膜装置の処理スケジューリング方法
JP2003197711A (ja) * 2001-12-27 2003-07-11 Tokyo Electron Ltd 被処理体の搬送システム及び被処理体の搬送方法
JP2005148940A (ja) * 2003-11-12 2005-06-09 Kawasaki Microelectronics Kk スケジューリング装置
JP2008084954A (ja) * 2006-09-26 2008-04-10 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2008217058A (ja) * 2007-02-28 2008-09-18 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2010225890A (ja) * 2009-03-24 2010-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2011059927A (ja) * 2009-09-09 2011-03-24 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2011146448A (ja) * 2010-01-12 2011-07-28 Ebara Corp スケジューラ、基板処理装置、及び基板処理装置の運転方法
CN103010705A (zh) * 2011-09-26 2013-04-03 大日本网屏制造株式会社 基板处理系统
CN104662640A (zh) * 2012-09-21 2015-05-27 斯克林集团公司 调度表生成装置、程序以及方法、基板处理装置以及方法

Also Published As

Publication number Publication date
WO2018159085A1 (ja) 2018-09-07
KR20190112069A (ko) 2019-10-02
KR102349876B1 (ko) 2022-01-10
JP6949511B2 (ja) 2021-10-13
CN110352470A (zh) 2019-10-18
TW201834124A (zh) 2018-09-16
TWI646621B (zh) 2019-01-01
JP2018147952A (ja) 2018-09-20

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