CN109524313B - 半导体制造装置、半导体器件的制造方法及筒夹 - Google Patents

半导体制造装置、半导体器件的制造方法及筒夹 Download PDF

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Publication number
CN109524313B
CN109524313B CN201811085188.9A CN201811085188A CN109524313B CN 109524313 B CN109524313 B CN 109524313B CN 201811085188 A CN201811085188 A CN 201811085188A CN 109524313 B CN109524313 B CN 109524313B
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collet
block
bare chip
push
suction
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CN109524313A (zh
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齐藤明
冈本直树
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN201811085188.9A 2017-09-19 2018-09-17 半导体制造装置、半导体器件的制造方法及筒夹 Active CN109524313B (zh)

Applications Claiming Priority (2)

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JP2017-178987 2017-09-19
JP2017178987A JP6967411B2 (ja) 2017-09-19 2017-09-19 半導体製造装置、半導体装置の製造方法およびコレット

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CN109524313A CN109524313A (zh) 2019-03-26
CN109524313B true CN109524313B (zh) 2022-12-30

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JP (1) JP6967411B2 (enExample)
KR (1) KR102101760B1 (enExample)
CN (1) CN109524313B (enExample)
TW (1) TWI705524B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377654B2 (ja) * 2019-09-17 2023-11-10 ファスフォードテクノロジ株式会社 ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法
JP7343402B2 (ja) * 2020-01-08 2023-09-12 ファスフォードテクノロジ株式会社 ダイボンディング装置、半導体装置の製造方法およびエキスパンド装置
JP7412219B2 (ja) * 2020-02-25 2024-01-12 ファスフォードテクノロジ株式会社 ダイボンディング装置、半導体装置の製造方法および剥離装置
JP7488062B2 (ja) * 2020-03-02 2024-05-21 東京エレクトロン株式会社 接合装置、接合システム、接合方法および記憶媒体
TW202347464A (zh) * 2020-03-23 2023-12-01 日商捷進科技有限公司 晶片接合裝置、剝離治具及半導體裝置的製造方法
KR102405424B1 (ko) * 2020-06-25 2022-06-07 한화정밀기계 주식회사 웨이퍼 스테이지 장치
KR102819884B1 (ko) * 2020-07-20 2025-06-12 한화세미텍 주식회사 다이 박리 장치 및 이를 이용한 다이 박리 방법
WO2022123645A1 (ja) * 2020-12-08 2022-06-16 株式会社新川 半導体ダイのピックアップ装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274202A (ja) * 1998-03-24 1999-10-08 Fuji Xerox Co Ltd バンプ形成装置およびバンプ形成に使用されるチップトレイ
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2012169399A (ja) * 2011-02-14 2012-09-06 Fuji Mach Mfg Co Ltd ダイピックアップ装置
JP2012248778A (ja) * 2011-05-31 2012-12-13 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2013214683A (ja) * 2012-04-04 2013-10-17 Mitsubishi Electric Corp 半導体チップのピックアップ装置
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP5888455B1 (ja) * 2015-04-01 2016-03-22 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848606B2 (ja) * 2002-08-26 2006-11-22 日東電工株式会社 コレットおよびそれを用いてチップ部品をピックアップする方法
JP4405211B2 (ja) * 2003-09-08 2010-01-27 パナソニック株式会社 半導体チップの剥離装置、剥離方法、及び半導体チップの供給装置
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JPWO2005029574A1 (ja) * 2003-09-18 2006-11-30 キヤノンマシナリー株式会社 コレット、ダイボンダおよびチップのピックアップ方法
JP2005322815A (ja) * 2004-05-11 2005-11-17 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法
TWI463580B (zh) * 2007-06-19 2014-12-01 瑞薩科技股份有限公司 Manufacturing method of semiconductor integrated circuit device
JP4945339B2 (ja) * 2007-06-22 2012-06-06 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP4864816B2 (ja) * 2007-06-19 2012-02-01 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR20120002556A (ko) * 2007-10-09 2012-01-05 히다치 가세고교 가부시끼가이샤 접착 필름이 부착된 반도체칩의 제조 방법 및 이 제조 방법에 사용되는 반도체용 접착 필름, 및 반도체 장치의 제조 방법
JP4397429B1 (ja) * 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5123357B2 (ja) * 2010-06-17 2013-01-23 株式会社日立ハイテクインスツルメンツ ダイボンダ及びピックアップ装置
JP5805411B2 (ja) * 2011-03-23 2015-11-04 ファスフォードテクノロジ株式会社 ダイボンダのピックアップ方法およびダイボンダ
JP2013065628A (ja) * 2011-09-15 2013-04-11 Hitachi High-Tech Instruments Co Ltd ダイボンダ並びにダイピックアップ装置及びダイピックアップ方法
JP2013165230A (ja) * 2012-02-13 2013-08-22 Elpida Memory Inc 吸着コレット及び半導体装置の製造方法
JP5647308B2 (ja) * 2013-08-02 2014-12-24 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2015076410A (ja) 2013-10-04 2015-04-20 株式会社日立ハイテクインスツルメンツ ボンディング方法及びダイボンダ
JP6400938B2 (ja) * 2014-04-30 2018-10-03 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6573813B2 (ja) * 2015-09-30 2019-09-11 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274202A (ja) * 1998-03-24 1999-10-08 Fuji Xerox Co Ltd バンプ形成装置およびバンプ形成に使用されるチップトレイ
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2012169399A (ja) * 2011-02-14 2012-09-06 Fuji Mach Mfg Co Ltd ダイピックアップ装置
JP2012248778A (ja) * 2011-05-31 2012-12-13 Hitachi High-Tech Instruments Co Ltd ダイボンダ及びボンディング方法
JP2013214683A (ja) * 2012-04-04 2013-10-17 Mitsubishi Electric Corp 半導体チップのピックアップ装置
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP5888455B1 (ja) * 2015-04-01 2016-03-22 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法

Also Published As

Publication number Publication date
TWI705524B (zh) 2020-09-21
JP2019054209A (ja) 2019-04-04
KR102101760B1 (ko) 2020-04-20
TW201923963A (zh) 2019-06-16
JP6967411B2 (ja) 2021-11-17
CN109524313A (zh) 2019-03-26
KR20190032180A (ko) 2019-03-27

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