CN108352298B - 底部处理 - Google Patents

底部处理 Download PDF

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Publication number
CN108352298B
CN108352298B CN201680064396.3A CN201680064396A CN108352298B CN 108352298 B CN108352298 B CN 108352298B CN 201680064396 A CN201680064396 A CN 201680064396A CN 108352298 B CN108352298 B CN 108352298B
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substrate
backside
film
strain
processing
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CN108352298A (zh
Inventor
约瑟夫·M·拉内什
阿伦·缪尔·亨特
斯瓦米纳坦·T·斯里尼瓦桑
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Applied Materials Inc
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Applied Materials Inc
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Priority to CN202211543021.9A priority Critical patent/CN116435167A/zh
Priority to CN202310350135.XA priority patent/CN116435172A/zh
Publication of CN108352298A publication Critical patent/CN108352298A/zh
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    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Recrystallisation Techniques (AREA)
  • Physical Vapour Deposition (AREA)
CN201680064396.3A 2015-11-09 2016-10-10 底部处理 Active CN108352298B (zh)

Priority Applications (2)

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US20170133328A1 (en) 2017-05-11
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