CN107481751B - 一种铁电存储集成电路 - Google Patents
一种铁电存储集成电路 Download PDFInfo
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- CN107481751B CN107481751B CN201710793719.9A CN201710793719A CN107481751B CN 107481751 B CN107481751 B CN 107481751B CN 201710793719 A CN201710793719 A CN 201710793719A CN 107481751 B CN107481751 B CN 107481751B
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2273—Reading or sensing circuits or methods
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/221—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements using ferroelectric capacitors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2259—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2275—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/82—Array having, for accessing a cell, a word line, a bit line and a plate or source line receiving different potentials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710793719.9A CN107481751B (zh) | 2017-09-06 | 2017-09-06 | 一种铁电存储集成电路 |
| CN201880003413.1A CN109791785B (zh) | 2017-09-06 | 2018-02-28 | 铁电存储集成电路及其操作方法和制备方法 |
| US16/322,032 US11145664B2 (en) | 2017-09-06 | 2018-02-28 | Ferroelectric memory IC as well as method of operating the same and method of preparing the same |
| PCT/CN2018/077485 WO2019047489A1 (zh) | 2017-09-06 | 2018-02-28 | 铁电存储集成电路及其操作方法和制备方法 |
| JP2019504796A JP7079769B2 (ja) | 2017-09-06 | 2018-02-28 | 強誘電体メモリ集積回路及びその操作方法並びに製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710793719.9A CN107481751B (zh) | 2017-09-06 | 2017-09-06 | 一种铁电存储集成电路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107481751A CN107481751A (zh) | 2017-12-15 |
| CN107481751B true CN107481751B (zh) | 2020-01-10 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710793719.9A Active CN107481751B (zh) | 2017-09-06 | 2017-09-06 | 一种铁电存储集成电路 |
| CN201880003413.1A Active CN109791785B (zh) | 2017-09-06 | 2018-02-28 | 铁电存储集成电路及其操作方法和制备方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880003413.1A Active CN109791785B (zh) | 2017-09-06 | 2018-02-28 | 铁电存储集成电路及其操作方法和制备方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11145664B2 (enExample) |
| JP (1) | JP7079769B2 (enExample) |
| CN (2) | CN107481751B (enExample) |
| WO (1) | WO2019047489A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107481751B (zh) | 2017-09-06 | 2020-01-10 | 复旦大学 | 一种铁电存储集成电路 |
| CN108417574B (zh) * | 2018-03-12 | 2020-05-12 | 复旦大学 | 基于soi的铁电存储器的制造方法 |
| CN109378313B (zh) * | 2018-09-23 | 2020-10-30 | 复旦大学 | 一种低功耗三维非易失性存储器及其制备方法 |
| US11646374B2 (en) * | 2018-12-26 | 2023-05-09 | Intel Corporation | Ferroelectric transistors to store multiple states of resistances for memory cells |
| CN112310214B (zh) | 2019-07-31 | 2021-09-24 | 复旦大学 | 一种非易失性铁电存储器及其制备方法 |
| CN114342075A (zh) * | 2019-09-26 | 2022-04-12 | 华为技术有限公司 | 一种存储器、存储器阵列以及存储器的数据读写方法 |
| CN115053292A (zh) * | 2020-03-17 | 2022-09-13 | 华为技术有限公司 | 平面存储器、立体存储器以及电子设备 |
| US11398568B2 (en) * | 2020-06-17 | 2022-07-26 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Ferroelectric based transistors |
| WO2022104742A1 (zh) * | 2020-11-20 | 2022-05-27 | 华为技术有限公司 | 一种铁电存储器及电子设备 |
| CN112635665B (zh) * | 2020-12-22 | 2024-07-12 | 上海复存信息科技有限公司 | 一种基于多层掩膜套刻的面内岛状铁电阻变存储器单元结构及其制备方法 |
| CN118136073B (zh) * | 2024-03-20 | 2025-01-07 | 北京超弦存储器研究院 | 存储装置及其数据读取方法、电子设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105256376A (zh) * | 2015-11-18 | 2016-01-20 | 中国科学技术大学 | 一种控制铁电单晶电致形变取向的方法 |
| CN105655342A (zh) * | 2016-02-23 | 2016-06-08 | 复旦大学 | 非易失性铁电存储器及其制备方法和读/写操作方法 |
| CN107123648A (zh) * | 2017-04-12 | 2017-09-01 | 复旦大学 | 一种面内读/写操作铁电忆阻器及其制备方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100289975B1 (ko) * | 1996-07-09 | 2001-06-01 | 니시무로 타이죠 | 반도체장치의제조방법및반도체장치 |
| JP2002324892A (ja) * | 2001-04-25 | 2002-11-08 | Hitachi Ltd | 強誘電体メモリ |
| JP2004165351A (ja) * | 2002-11-12 | 2004-06-10 | Fujitsu Ltd | 半導体装置の製造方法 |
| JP4256670B2 (ja) * | 2002-12-10 | 2009-04-22 | 富士通株式会社 | 容量素子、半導体装置およびその製造方法 |
| US7304880B2 (en) * | 2003-05-08 | 2007-12-04 | Matsushita Electric Industrial Co., Ltd. | Electric switch and memory device using the same |
| JP4015968B2 (ja) * | 2003-06-09 | 2007-11-28 | 株式会社東芝 | 強誘電体メモリ |
| JP4171908B2 (ja) * | 2004-01-20 | 2008-10-29 | セイコーエプソン株式会社 | 強誘電体膜、強誘電体メモリ、及び圧電素子 |
| US20090230817A1 (en) * | 2005-10-19 | 2009-09-17 | Yamaju Ceramics Co., Ltd. | Ferroelectric single crystal, surface acoustic wave filter comprising the same, and production method thereof |
| JP2009212448A (ja) * | 2008-03-06 | 2009-09-17 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
| JP5487625B2 (ja) * | 2009-01-22 | 2014-05-07 | ソニー株式会社 | 半導体装置 |
| CN104637948B (zh) * | 2015-01-24 | 2017-11-17 | 复旦大学 | 非破坏性读出铁电存储器及其制备方法和读/写操作方法 |
| CN104637949B (zh) * | 2015-01-24 | 2017-11-17 | 复旦大学 | 非破坏性读出铁电存储器及其制备方法和操作方法 |
| CN108475523B (zh) * | 2016-04-12 | 2021-10-19 | 复旦大学 | 大电流读出铁电单晶薄膜存储器及其制备方法和操作方法 |
| CN107481751B (zh) * | 2017-09-06 | 2020-01-10 | 复旦大学 | 一种铁电存储集成电路 |
-
2017
- 2017-09-06 CN CN201710793719.9A patent/CN107481751B/zh active Active
-
2018
- 2018-02-28 US US16/322,032 patent/US11145664B2/en active Active
- 2018-02-28 JP JP2019504796A patent/JP7079769B2/ja active Active
- 2018-02-28 WO PCT/CN2018/077485 patent/WO2019047489A1/zh not_active Ceased
- 2018-02-28 CN CN201880003413.1A patent/CN109791785B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105256376A (zh) * | 2015-11-18 | 2016-01-20 | 中国科学技术大学 | 一种控制铁电单晶电致形变取向的方法 |
| CN105655342A (zh) * | 2016-02-23 | 2016-06-08 | 复旦大学 | 非易失性铁电存储器及其制备方法和读/写操作方法 |
| CN107123648A (zh) * | 2017-04-12 | 2017-09-01 | 复旦大学 | 一种面内读/写操作铁电忆阻器及其制备方法 |
Non-Patent Citations (2)
| Title |
|---|
| Improved Polarization Retention of BiFeO3 Thin Films Using GdScO3 (110) Substrates;许帅骑等;《Chinese Physics Letters》;20170125;第34卷(第2期);027701-1-027701-4 * |
| 铁电薄膜制备及新型铁电存储器研究;陈志辉;《中国博士学位论文全文数据库》;20150215(第2期);第1-111页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109791785A (zh) | 2019-05-21 |
| JP2020533779A (ja) | 2020-11-19 |
| US20210202509A9 (en) | 2021-07-01 |
| WO2019047489A1 (zh) | 2019-03-14 |
| CN107481751A (zh) | 2017-12-15 |
| CN109791785B (zh) | 2023-03-24 |
| JP7079769B2 (ja) | 2022-06-02 |
| US20200243549A1 (en) | 2020-07-30 |
| US11145664B2 (en) | 2021-10-12 |
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