CN114342075A - 一种存储器、存储器阵列以及存储器的数据读写方法 - Google Patents
一种存储器、存储器阵列以及存储器的数据读写方法 Download PDFInfo
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- CN114342075A CN114342075A CN201980099990.XA CN201980099990A CN114342075A CN 114342075 A CN114342075 A CN 114342075A CN 201980099990 A CN201980099990 A CN 201980099990A CN 114342075 A CN114342075 A CN 114342075A
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- 230000015654 memory Effects 0.000 title claims abstract description 372
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 314
- 239000010409 thin film Substances 0.000 claims abstract description 158
- 230000010287 polarization Effects 0.000 claims abstract description 82
- 239000010408 film Substances 0.000 claims abstract description 51
- 238000009826 distribution Methods 0.000 claims abstract description 40
- 230000008859 change Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 32
- 230000005684 electric field Effects 0.000 description 21
- 230000008569 process Effects 0.000 description 14
- 239000010410 layer Substances 0.000 description 11
- 238000004088 simulation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 229910021332 silicide Inorganic materials 0.000 description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000005621 ferroelectricity Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- -1 i.e. Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
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Abstract
一种存储器(10)、存储器阵列(200)以及存储器(10)的数据读写方法。其中,存储器(10)包括:第一半导体(101)、第一铁电薄膜(102)、第一写电极(103)、第一读电极(104)以及第二读电极(105);第一半导体(101)相对的两端分别设置第一读电极(104)与第二读电极(105);第一铁电薄膜(102)包裹第一半导体(101)的未被第一读电极(104)和第二读电极(105)连接的表面;第一铁电薄膜(102)的外表面与第一写电极(103)连接。通过第一写电极(103)向第一铁电薄膜(102)施加电压,以改变第一铁电薄膜(102)的极化状态。根据第一铁电薄膜(102)不同的极化状态调制第一半导体内电荷分布情况。使得第一半导体(101)在第一读电极(104)与第二读电极(105)施加相同读取电压时,产生不同的电流。
Description
PCT国内申请,说明书已公开。
Claims (19)
- PCT国内申请,权利要求书已公开。
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PCT/CN2019/108014 WO2021056299A1 (zh) | 2019-09-26 | 2019-09-26 | 一种存储器、存储器阵列以及存储器的数据读写方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023213102A1 (zh) * | 2022-05-05 | 2023-11-09 | 华为技术有限公司 | 一种采样装置、相关设备和控制方法 |
WO2024001574A1 (zh) * | 2022-06-29 | 2024-01-04 | 华为技术有限公司 | 存储器和存取方法 |
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WO2013017131A2 (de) * | 2011-07-12 | 2013-02-07 | Helmholtz-Zentrum Dresden - Rossendorf E.V. | Integrierte nichtflüchtige speicherelemente, aufbau und verwendung |
US9196335B2 (en) * | 2013-03-14 | 2015-11-24 | Kabushiki Kaisha Toshiba | Magnetic memory |
CN107123648B (zh) * | 2017-04-12 | 2020-09-01 | 复旦大学 | 一种面内读/写操作铁电忆阻器及其制备方法 |
CN107481751B (zh) * | 2017-09-06 | 2020-01-10 | 复旦大学 | 一种铁电存储集成电路 |
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2019
- 2019-09-26 CN CN201980099990.XA patent/CN114342075A/zh active Pending
- 2019-09-26 WO PCT/CN2019/108014 patent/WO2021056299A1/zh active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023213102A1 (zh) * | 2022-05-05 | 2023-11-09 | 华为技术有限公司 | 一种采样装置、相关设备和控制方法 |
WO2024001574A1 (zh) * | 2022-06-29 | 2024-01-04 | 华为技术有限公司 | 存储器和存取方法 |
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