CN114342075A - 一种存储器、存储器阵列以及存储器的数据读写方法 - Google Patents

一种存储器、存储器阵列以及存储器的数据读写方法 Download PDF

Info

Publication number
CN114342075A
CN114342075A CN201980099990.XA CN201980099990A CN114342075A CN 114342075 A CN114342075 A CN 114342075A CN 201980099990 A CN201980099990 A CN 201980099990A CN 114342075 A CN114342075 A CN 114342075A
Authority
CN
China
Prior art keywords
electrode
memory
read
semiconductor
reading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980099990.XA
Other languages
English (en)
Inventor
许俊豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN114342075A publication Critical patent/CN114342075A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B53/00Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors

Landscapes

  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)

Abstract

一种存储器(10)、存储器阵列(200)以及存储器(10)的数据读写方法。其中,存储器(10)包括:第一半导体(101)、第一铁电薄膜(102)、第一写电极(103)、第一读电极(104)以及第二读电极(105);第一半导体(101)相对的两端分别设置第一读电极(104)与第二读电极(105);第一铁电薄膜(102)包裹第一半导体(101)的未被第一读电极(104)和第二读电极(105)连接的表面;第一铁电薄膜(102)的外表面与第一写电极(103)连接。通过第一写电极(103)向第一铁电薄膜(102)施加电压,以改变第一铁电薄膜(102)的极化状态。根据第一铁电薄膜(102)不同的极化状态调制第一半导体内电荷分布情况。使得第一半导体(101)在第一读电极(104)与第二读电极(105)施加相同读取电压时,产生不同的电流。

Description

PCT国内申请,说明书已公开。

Claims (19)

  1. PCT国内申请,权利要求书已公开。
CN201980099990.XA 2019-09-26 2019-09-26 一种存储器、存储器阵列以及存储器的数据读写方法 Pending CN114342075A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/108014 WO2021056299A1 (zh) 2019-09-26 2019-09-26 一种存储器、存储器阵列以及存储器的数据读写方法

Publications (1)

Publication Number Publication Date
CN114342075A true CN114342075A (zh) 2022-04-12

Family

ID=75165434

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980099990.XA Pending CN114342075A (zh) 2019-09-26 2019-09-26 一种存储器、存储器阵列以及存储器的数据读写方法

Country Status (2)

Country Link
CN (1) CN114342075A (zh)
WO (1) WO2021056299A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023213102A1 (zh) * 2022-05-05 2023-11-09 华为技术有限公司 一种采样装置、相关设备和控制方法
WO2024001574A1 (zh) * 2022-06-29 2024-01-04 华为技术有限公司 存储器和存取方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013017131A2 (de) * 2011-07-12 2013-02-07 Helmholtz-Zentrum Dresden - Rossendorf E.V. Integrierte nichtflüchtige speicherelemente, aufbau und verwendung
US9196335B2 (en) * 2013-03-14 2015-11-24 Kabushiki Kaisha Toshiba Magnetic memory
CN107123648B (zh) * 2017-04-12 2020-09-01 复旦大学 一种面内读/写操作铁电忆阻器及其制备方法
CN107481751B (zh) * 2017-09-06 2020-01-10 复旦大学 一种铁电存储集成电路

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023213102A1 (zh) * 2022-05-05 2023-11-09 华为技术有限公司 一种采样装置、相关设备和控制方法
WO2024001574A1 (zh) * 2022-06-29 2024-01-04 华为技术有限公司 存储器和存取方法

Also Published As

Publication number Publication date
WO2021056299A1 (zh) 2021-04-01

Similar Documents

Publication Publication Date Title
US11545217B2 (en) Memory cells, memory cell arrays, methods of using and methods of making
US10242739B2 (en) Memory cells, memory cell arrays, methods of using and methods of making
TWI508267B (zh) 半導體記憶體裝置
JP5542550B2 (ja) 抵抗変化メモリ
US11170834B2 (en) Memory cells and methods of forming a capacitor including current leakage paths having different total resistances
WO2018111215A1 (en) One transistor and ferroelectric fet based memory cell
KR20140113024A (ko) 저항 변화 메모리 장치 및 그 구동방법
KR20190113192A (ko) 반도체 메모리 소자, 이의 구동 방법 및 이의 제조 방법
US10515982B2 (en) Semiconductor device
US11869803B2 (en) Single crystalline silicon stack formation and bonding to a CMOS wafer
US20220068922A1 (en) Memory structure
CN114342075A (zh) 一种存储器、存储器阵列以及存储器的数据读写方法
US20100019220A1 (en) Phase change random access memory device, method of fabricating the same, and method of operating the same
KR102084030B1 (ko) 변동 저저항 라인 비휘발성 메모리 소자 및 이의 동작 방법
USRE47381E1 (en) Forming semiconductor cells with regions of varying conductivity
US20190013319A1 (en) Memory Cells
US20230298659A1 (en) Memory device including semiconductor
US20230309287A1 (en) Semiconductor memory device
WO2024026979A1 (zh) 一种半导体组件及其操作方法、半导体结构
CN116615966A (zh) 垂直存储器设备及其形成方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination