CN106796931A - 引线框、半导体装置的制造方法 - Google Patents

引线框、半导体装置的制造方法 Download PDF

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CN106796931A
CN106796931A CN201480082449.5A CN201480082449A CN106796931A CN 106796931 A CN106796931 A CN 106796931A CN 201480082449 A CN201480082449 A CN 201480082449A CN 106796931 A CN106796931 A CN 106796931A
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narrow portion
end side
wide
lead terminal
lead frame
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CN106796931B (zh
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坂本健
鹿野武敏
川岛裕史
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

特征在于，具有：第1引线端子；第2引线端子，其设置为与该第1引线端子平行；以及连接杆，其将该第1引线端子和该第2引线端子连接，该连接杆具有：第1窄部，其与该第1引线端子接触；第2窄部，其与该第2引线端子接触；以及宽部，其宽度大于该第1窄部和该第2窄部，将该第1窄部和该第2窄部连接，在该宽部中的位于该第1窄部和该第2窄部之间的部分形成了通孔。

Description

引线框、半导体装置的制造方法
技术领域
本发明涉及引线框及具有引线框的半导体装置的制造方法。
背景技术
在专利文献1中公开有下述技术，即，在由树脂将引线框封装后，由分离针(breakpin)对无用树脂进行推压而将之去除。
专利文献1：日本特开2007－128930号公报
发明内容
通过流道推钉对作为无用树脂的一部分的流道进行推压，将流道敲落。流道的敲落优选在通过按压夹具对连接杆的一部分进行按压的状态下进行。为了通过按压夹具而将连接杆固定，优选连接杆宽度大。
另一方面，连接杆是在产品完成前被切断的部分。因此，为了易于将连接杆切断，优选连接杆宽度小。这样，存在下述问题，即，如果减小连接杆宽度则难以通过按压夹具而将连接杆固定，如果增大连接杆宽度则变得不能将连接杆容易地切断。
本发明就是为了解决上述问题而提出的，其目的在于提供一种易于通过按压夹具而对连接杆进行按压、且连接杆容易切断的引线框以及使用了该引线框的半导体装置的制造方法。
本发明所涉及的引线框的特征在于，具有：第1引线端子；第2引线端子，其设置为与该第1引线端子平行；以及连接杆，其将该第1引线端子和该第2引线端子连接，该连接杆具有：第1窄部，其与该第1引线端子接触；第2窄部，其与该第2引线端子接触；以及宽部，其宽度大于该第1窄部和该第2窄部，将该第1窄部和该第2窄部连接，在该宽部中的位于该第1窄部和该第2窄部之间的部分形成了通孔。
本发明所涉及的半导体装置的制造方法的特征在于，具有下述工序，即：将半导体元件固定至引线框的工序，该引线框具有第1引线端子、第2引线端子以及将该第1引线端子和该第2引线端子连接的连接杆；传递模塑工序，设置沿该连接杆的流道流路，形成将该半导体元件覆盖的树脂；去除工序，通过按压夹具而将具有第1窄部、第2窄部和宽部的该连接杆的该宽部的上端部或者下端部固定，并且将流道推钉插入至在该宽部中的位于该第1窄部和该第2窄部之间的部分设置的通孔，将附着于该连接杆的流道敲落，其中，该第1窄部与该第1引线端子接触，该第2窄部与该第2引线端子接触，该宽部的宽度大于该第1窄部和该第2窄部，该宽部将该第1窄部和该第2窄部连接；以及对该第1窄部和该第2窄部进行切断的工序。
本发明的其他特征在下面予以明确。
发明的效果
根据本发明，由于在连接杆设置了宽度大的部分和宽度小的部分，因此能够容易地实施由按压夹具对连接杆的按压、和连接杆的切断。
附图说明
图1是实施方式1所涉及的引线框的俯视图。
图2是表示引线框和半导体元件的俯视图。
图3是导线连接后的半导体装置的俯视图。
图4是树脂等的俯视图。
图5是去除工序中的引线框等的俯视图。
图6是图5的VI－VI虚线处的剖视图。
图7是图5的VII－VII虚线处的剖视图。
图8是通过实施方式1所涉及的半导体装置的制造方法而制造出的半导体装置的剖视图。
图9是实施方式2所涉及的引线框的局部俯视图。
图10是变形例所涉及的引线框的局部俯视图。
图11是实施方式3所涉及的引线框等的局部俯视图。
图12是实施方式4所涉及的引线框的局部俯视图。
图13是去除工序中的按压夹具等的剖视图。
图14是实施方式5所涉及的引线框的局部俯视图。
图15是去除工序中的按压夹具等的剖视图。
具体实施方式
参照附图，对本发明的实施方式所涉及的引线框以及半导体装置的制造方法进行说明。对相同或者相对应的结构要素标注相同的标号，有时省略重复的说明。
实施方式1
图1是本发明的实施方式1所涉及的引线框10的俯视图。引线框10具有外框12。在外框12连接有第1引线端子14、第2引线端子16、第3引线端子18以及第4引线端子20。这些引线端子是平行地设置的。
外框12和第1引线端子14、第1引线端子14和第2引线端子16、第2引线端子16和第3引线端子18、第3引线端子18和第4引线端子20分别由连接杆22进行连接。连接杆22具有第1窄部22a、第2窄部22b以及宽部22c。第1窄部22a与第1引线端子14接触。第2窄部22b与第2引线端子16接触。宽部22c将第1窄部22a和第2窄部22b连接。
宽部22c的宽度大于第1窄部22a和第2窄部22b。即，宽部22c与第1窄部22a和第2窄部22b相比向上方(y正向)延伸得更长，并且向下方(y负向)延伸得更长。在宽部22c中的位于第1窄部22a和第2窄部22b之间的部分形成有通孔22d。
对本发明的实施方式1所涉及的半导体装置的制造方法进行说明。首先，将半导体元件固定至引线框。图2是表示引线框和半导体元件的俯视图。半导体元件30、32是在表面具有发射极和基极、在背面具有集电极的IGBT(Insulated Gate Bipolar transistor)芯片。半导体元件34、36是在表面具有阳极、在背面具有阴极的二极管。通过焊料，将半导体元件30、32的集电极和半导体元件34、36的阴极固定至第1引线端子14的芯片焊盘部分。同样地，将半导体元件固定至第3引线端子18的芯片焊盘部分。
然后，进行必要的导线连接。图3是导线连接后的半导体装置的俯视图。导线40将半导体元件30的发射极、半导体元件34的阳极与第2引线端子16连接。导线42将半导体元件32的发射极、半导体元件36的阳极与第2引线端子16连接。导线44将半导体元件30的栅极和控制端子24连接。导线46将半导体元件32的栅极和控制端子24连接。这样，对半导体元件和引线框的一部分进行导线连接。此外，根据需要，将散热件焊料接合至引线框。
然后，使处理进入至传递模塑工序。在传递模塑工序中，通过1套模具对多个成型品进行成型。该成型方式称为侧流道浇口(side runner gate)方式。图4是通过传递模塑工序而形成的树脂等的俯视图。在传递模塑工序中，将引线框设置于模具的腔室内，进行合模。然后，将经由釜(pot)部(残料(cull)50所在之处)、连接杆22之上的流道流路、以及浇口流路后的树脂填充至腔室内。然后，通过使树脂硬化、进行开模，从而将引线框和树脂已一体化的成型品从模具取出。树脂包含残料50、流道52、浇口54以及封装件56。流道52沿连接杆22设置于连接杆22之上。流道52将宽部22c的通孔22d填埋，但不覆盖宽部22c的上端部和下端部。即，宽部22c的上端部在流道52的y正向上露出，宽部22c的下端部在流道52的y负向上露出。封装件56是将半导体元件覆盖、对半导体元件进行保护的部分。
然后，使处理进入至去除工序。去除工序是将附着于连接杆22的流道52敲落的工序。图5是去除工序中的引线框等的俯视图。在去除工序中，首先，由按压夹具60将连接杆22的宽部22c的上端部固定，由按压夹具62将宽部22c的下端部固定。
图6是图5的VI－VI虚线处的剖视图。按压夹具60具有上部60a和下部60b。上部60a与宽部22c的上端部的上表面接触，下部60b与宽部22c的上端部的下表面接触。然后，通过缩小上部60a和下部60b的距离，从而将宽部22c的上端部固定。按压夹具62具有上部62a和下部62b。上部62a与宽部22c的下端部的上表面接触，下部62b与宽部22c的下端部的下表面接触。然后，通过缩小上部62a和下部62b的距离，从而将宽部22c的下端部固定。
如上所述，在通过按压夹具60、62将宽部22c的上端部和下端部固定后的状态下，将流道52敲落。图7是图5的VII－VII虚线处的剖视图。将流道推钉70插入至在宽部22c设置的通孔22d，将流道52敲落。即，通过流道推钉70而对在通孔22d形成的树脂进行推压，将流道52敲落。为了通过流道推钉70而将流道52敲落，必须在通孔22d形成有作为流道52的一部分的树脂。这样，使流道52与连接杆22分离。
然后，实施用于使封装件56完全硬化的加热工序。然后，对连接杆22的第1窄部22a和第2窄部22b进行切断。并且，对例如外框12等引线框10的无用部分进行切断。然后，经过引线端子的成型、产品测试等，完成半导体装置。图8是通过本发明的实施方式1所涉及的半导体装置的制造方法而制造出的半导体装置的剖视图。通过实施上述各工序，从而形成多个图8所示的半导体装置。
实施方式1所涉及的引线框10的连接杆22具有第1窄部22a、第2窄部22b以及宽部22c。在去除工序中，通过按压夹具60、62而将宽部22c的上端部和下端部固定。由于宽部22c的宽度大于第1窄部22a和第2窄部22b，因此能够通过按压夹具60、62容易地将宽部22c固定。通过将宽部22c固定，从而能够将流道推钉70的力高效地施加于流道52，可靠地将流道52去除。
另外，在对连接杆22进行切断时，是对宽度比宽部22c小的第1窄部22a和第2窄部22b进行切断。因此，能够降低切割连接杆时的夹合压力，或者减少夹合次数。即，能够容易地对连接杆22进行切断。
在去除工序中，通过按压夹具60、62而将宽部22c的上端部和下端部固定，但是也可以将上端部和下端部中的任一方固定。另外，也可以省略宽部的上端部和下端部中的任一方。例如，在图1中，也可以维持宽部的上端与第1窄部22a和第2窄部22b的上端相比在y正向上延伸得更长的状态，并且使宽部的下端的y坐标与第1窄部22a和第2窄部22b的下端的y坐标一致。在该情况下，通过按压夹具而将宽部的上端部固定。也可以在半导体元件的背面侧设置绝缘片。也可以利用除IGBT和二极管以外的器件作为半导体元件。
上述变形还能够应用于以下实施方式所涉及的引线框和半导体装置的制造方法。此外，对于以下实施方式所涉及的引线框及半导体装置的制造方法，由于与实施方式1的共同点多，因此以与实施方式1的不同点为中心进行说明。
实施方式2
图9是实施方式2所涉及的引线框的局部俯视图。宽部22e具有在俯视观察时向上凸出的梯形部分22f(上端部分)和在俯视观察时向下凸出的梯形部分22g(下端部分)。引线框是通过由冲模对金属板进行冲压而生产的。优选冲模对引线框的夹合压力小。因此，在宽部22e设置了梯形部分22f、22g。由此，与形成矩形形状的宽部的情况相比，能够减小冲模的夹合压力。
图10是变形例所涉及的引线框的局部俯视图。宽部22h的上端部分22i和下端部分22j在俯视观察时形成为半圆状。由此，宽部22h的外缘成为曲线。通过将宽部的外缘设为曲线，从而能够减小冲模的夹合压力。
实施方式3
图11是实施方式3所涉及的引线框等的局部俯视图。形成流道的区域以单点划线示出。第1窄部22a和第2窄部22b的宽度(y1)比流道的宽度(y2)小。由此，能够降低切割连接杆时的夹合压力，或者减少夹合次数。另外，通过使流道的宽度(y2)比第1窄部22a和第2窄部22b的宽度(y1)大，从而能够确保充分的宽度的流道流路。
实施方式4
图12是实施方式4所涉及的引线框的局部俯视图。在宽部22c的上端侧形成有上端侧通孔22k，在宽部22c的下端侧形成有下端侧通孔22m。通孔22d位于夹在上端侧通孔22k和下端侧通孔22m之间的位置。
图13是去除工序中的按压夹具等的剖视图。图13所示的连接杆的宽部22c是图12的XIII－XIII线处的宽部。按压夹具60具有与上部60a一体形成的凸部60c，按压夹具62具有与上部62a一体形成的凸部62c。在去除工序中，将凸部60c插入至上端侧通孔22k，将凸部62c插入至下端侧通孔22m。由此，能够将引线框的位置设为预先确定的位置，因此能够使流道推钉可靠地穿过通孔22d。
插入至上端侧通孔22k和下端侧通孔22m的凸部60c、62c抑制引线框的左右方向的位移。因此，能够防止流道52的成型收缩所导致的引线框的位移及上浮。而且，由于上端侧通孔22k和下端侧通孔22m设置于连接杆22的一部分，因此插入至上端侧通孔22k和下端侧通孔22m中的凸部60c、62c接近于流道52。因此，能够充分地抑制引线框的位移。此外，也可以仅设置上端侧通孔和下端侧通孔中的任一方。
实施方式5
图14是实施方式5所涉及的引线框的局部俯视图。在宽部22c的上端侧形成有上端侧凹部22o，在宽部22c的下端侧形成有下端侧凹部22p。通孔22d位于夹在上端侧凹部22o和下端侧凹部22p之间的位置，该上端侧凹部22o位于宽部22c的上端部，该下端侧凹部22p位于宽部22c的下端部。
图15是去除工序中的按压夹具等的剖视图。按压夹具60、62分别具有凸部60c、62c。在去除工序中，将凸部60c插入至上端侧凹部22o，将凸部62c插入至下端侧凹部22p。由此，能够使引线框位于预先确定的场所。而且，由于将凸部60c、62c按压于宽部22c，因此能够提高防止引线框的上浮的效果。
此外，也可以适当地对上述各实施方式所涉及的引线框和半导体装置的制造方法的特征进行组合。
标号的说明
10引线框，12外框，14第1引线端子，16第2引线端子，18第3引线端子，20第4引线端子，22连接杆，22a第1窄部，22b第2窄部，22c宽部，22d通孔，22k上端侧通孔，22m下端侧通孔，22o上端侧凹部，22p下端侧凹部，24控制端子，30、32、34、36半导体元件，50残料，52流道，54浇口，56封装件，60、62按压夹具，70流道推钉。
权利要求书(按照条约第19条的修改)
1.一种引线框，其特征在于，具有：
第1引线端子；
第2引线端子，其设置为与所述第1引线端子平行；以及
连接杆，其将所述第1引线端子和所述第2引线端子连接，
所述连接杆具有：
第1窄部，其与所述第1引线端子接触；
第2窄部，其与所述第2引线端子接触；以及
宽部，其宽度大于所述第1窄部和所述第2窄部，将所述第1窄部和所述第2窄部连接，
在所述宽部中的位于所述第1窄部和所述第2窄部之间的部分形成了通孔，
所述通孔仅位于所述宽部。
2.根据权利要求1所述的引线框，其特征在于，
所述宽部具有在俯视观察时向上凸出的梯形部分和在俯视观察时向下凸出的梯形部分。
3.根据权利要求1所述的引线框，其特征在于，
所述宽部的外缘是曲线。
4.根据权利要求1至3中任一项所述的引线框，其特征在于，
在所述宽部的上端侧形成了上端侧通孔，在所述宽部的下端侧形成了下端侧通孔。
5.根据权利要求1至3中任一项所述的引线框，其特征在于，
在所述宽部的上端侧形成了上端侧凹部，在所述宽部的下端侧形成了下端侧凹部。
6.一种半导体装置的制造方法，其特征在于，具有下述工序，即：
将半导体元件固定至引线框的工序，该引线框具有第1引线端子、第2引线端子以及将所述第1引线端子和所述第2引线端子连接的连接杆；
传递模塑工序，设置沿所述连接杆的流道流路，形成将所述半导体元件覆盖的树脂；
去除工序，通过按压夹具而将具有第1窄部、第2窄部和宽部的所述连接杆的所述宽部的上端部或者下端部固定，并且将流道推钉插入至在所述宽部中的位于所述第1窄部和所述第2窄部之间的部分设置的通孔，将附着于所述连接杆的流道敲落，其中，该第1窄部与所述第1引线端子接触，该第2窄部与所述第2引线端子接触，该宽部的宽度大于所述第1窄部和所述第2窄部，该宽部将所述第1窄部和所述第2窄部连接；以及
对所述第1窄部和所述第2窄部进行切断的工序。
7.根据权利要求6所述的半导体装置的制造方法，其特征在于，
所述第1窄部和所述第2窄部的宽度比所述流道的宽度小。
8.根据权利要求6或7所述的半导体装置的制造方法，其特征在于，
在所述宽部形成在所述上端部设置的上端侧通孔、或者在所述下端部设置的下端侧通孔，
所述按压夹具具有凸部，在所述去除工序中，将所述凸部插入至所述上端侧通孔或者所述下端侧通孔，将所述引线框的位置设为预先确定的位置。
9.根据权利要求6或7所述的半导体装置的制造方法，其特征在于，
在所述宽部形成在所述上端部设置的上端侧凹部、或者在所述下端部设置的下端侧凹部，
所述按压夹具具有凸部，在所述去除工序中，将所述凸部插入至所述上端侧凹部或者所述下端侧凹部，将所述引线框的位置设为预先确定的位置。
说明或声明(按照条约第19条的修改)
向权利要求1中追加了“所述通孔仅位于所述宽部”这一技术特征。

Claims (9)

1.一种引线框，其特征在于，具有：
第1引线端子；
第2引线端子，其设置为与所述第1引线端子平行；以及
连接杆，其将所述第1引线端子和所述第2引线端子连接，
所述连接杆具有：
第1窄部，其与所述第1引线端子接触；
第2窄部，其与所述第2引线端子接触；以及
宽部，其宽度大于所述第1窄部和所述第2窄部，将所述第1窄部和所述第2窄部连接，
在所述宽部中的位于所述第1窄部和所述第2窄部之间的部分形成了通孔。
2.根据权利要求1所述的引线框，其特征在于，
所述宽部具有在俯视观察时向上凸出的梯形部分和在俯视观察时向下凸出的梯形部分。
3.根据权利要求1所述的引线框，其特征在于，
所述宽部的外缘是曲线。
4.根据权利要求1至3中任一项所述的引线框，其特征在于，
在所述宽部的上端侧形成了上端侧通孔，在所述宽部的下端侧形成了下端侧通孔。
5.根据权利要求1至3中任一项所述的引线框，其特征在于，
在所述宽部的上端侧形成了上端侧凹部，在所述宽部的下端侧形成了下端侧凹部。
6.一种半导体装置的制造方法，其特征在于，具有下述工序，即：
将半导体元件固定至引线框的工序，该引线框具有第1引线端子、第2引线端子以及将所述第1引线端子和所述第2引线端子连接的连接杆；
传递模塑工序，设置沿所述连接杆的流道流路，形成将所述半导体元件覆盖的树脂；
去除工序，通过按压夹具而将具有第1窄部、第2窄部和宽部的所述连接杆的所述宽部的上端部或者下端部固定，并且将流道推钉插入至在所述宽部中的位于所述第1窄部和所述第2窄部之间的部分设置的通孔，将附着于所述连接杆的流道敲落，其中，该第1窄部与所述第1引线端子接触，该第2窄部与所述第2引线端子接触，该宽部的宽度大于所述第1窄部和所述第2窄部，该宽部将所述第1窄部和所述第2窄部连接；以及
对所述第1窄部和所述第2窄部进行切断的工序。
7.根据权利要求6所述的半导体装置的制造方法，其特征在于，
所述第1窄部和所述第2窄部的宽度比所述流道的宽度小。
8.根据权利要求6或7所述的半导体装置的制造方法，其特征在于，
在所述宽部形成在所述上端部设置的上端侧通孔、或者在所述下端部设置的下端侧通孔，
所述按压夹具具有凸部，在所述去除工序中，将所述凸部插入至所述上端侧通孔或者所述下端侧通孔，将所述引线框的位置设为预先确定的位置。
9.根据权利要求6或7所述的半导体装置的制造方法，其特征在于，
在所述宽部形成在所述上端部设置的上端侧凹部、或者在所述下端部设置的下端侧凹部，
所述按压夹具具有凸部，在所述去除工序中，将所述凸部插入至所述上端侧凹部或者所述下端侧凹部，将所述引线框的位置设为预先确定的位置。
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