CN105870271A - 包含窗口层和导光结构的半导体发光器件 - Google Patents
包含窗口层和导光结构的半导体发光器件 Download PDFInfo
- Publication number
- CN105870271A CN105870271A CN201610396252.XA CN201610396252A CN105870271A CN 105870271 A CN105870271 A CN 105870271A CN 201610396252 A CN201610396252 A CN 201610396252A CN 105870271 A CN105870271 A CN 105870271A
- Authority
- CN
- China
- Prior art keywords
- layer
- light
- type region
- bonding
- transparent conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/178,902 US10147843B2 (en) | 2008-07-24 | 2008-07-24 | Semiconductor light emitting device including a window layer and a light-directing structure |
| US12/178902 | 2008-07-24 | ||
| CN200980128853.0A CN102106004B (zh) | 2008-07-24 | 2009-07-15 | 包含窗口层和导光结构的半导体发光器件 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980128853.0A Division CN102106004B (zh) | 2008-07-24 | 2009-07-15 | 包含窗口层和导光结构的半导体发光器件 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870271A true CN105870271A (zh) | 2016-08-17 |
Family
ID=41153263
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610396252.XA Pending CN105870271A (zh) | 2008-07-24 | 2009-07-15 | 包含窗口层和导光结构的半导体发光器件 |
| CN200980128853.0A Active CN102106004B (zh) | 2008-07-24 | 2009-07-15 | 包含窗口层和导光结构的半导体发光器件 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980128853.0A Active CN102106004B (zh) | 2008-07-24 | 2009-07-15 | 包含窗口层和导光结构的半导体发光器件 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10147843B2 (enExample) |
| EP (1) | EP2308107B1 (enExample) |
| JP (4) | JP2011529267A (enExample) |
| KR (1) | KR20110031999A (enExample) |
| CN (2) | CN105870271A (enExample) |
| TW (1) | TWI505501B (enExample) |
| WO (1) | WO2010010485A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100279437A1 (en) * | 2009-05-01 | 2010-11-04 | Koninklijke Philips Electronics N.V. | Controlling edge emission in package-free led die |
| US10147843B2 (en) | 2008-07-24 | 2018-12-04 | Lumileds Llc | Semiconductor light emitting device including a window layer and a light-directing structure |
| US8703521B2 (en) * | 2009-06-09 | 2014-04-22 | International Business Machines Corporation | Multijunction photovoltaic cell fabrication |
| US8633097B2 (en) | 2009-06-09 | 2014-01-21 | International Business Machines Corporation | Single-junction photovoltaic cell |
| JP5657012B2 (ja) * | 2010-02-25 | 2015-01-21 | ライタイザー コリア カンパニー リミテッド | 発光ダイオード及びその製造方法 |
| WO2011126000A1 (ja) | 2010-04-08 | 2011-10-13 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| US8232117B2 (en) * | 2010-04-30 | 2012-07-31 | Koninklijke Philips Electronics N.V. | LED wafer with laminated phosphor layer |
| CN105244422B (zh) | 2010-05-31 | 2018-09-04 | 日亚化学工业株式会社 | 发光装置及其制造方法 |
| JP2012186414A (ja) * | 2011-03-08 | 2012-09-27 | Toshiba Corp | 発光装置 |
| CN103748696B (zh) | 2011-08-26 | 2018-06-22 | 亮锐控股有限公司 | 加工半导体结构的方法 |
| JP6104915B2 (ja) * | 2011-10-06 | 2017-03-29 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 半導体発光デバイスの表面処理 |
| KR101939333B1 (ko) * | 2011-10-07 | 2019-01-16 | 서울바이오시스 주식회사 | 발광 다이오드 패키지 |
| CN103811593B (zh) * | 2012-11-12 | 2018-06-19 | 晶元光电股份有限公司 | 半导体光电元件的制作方法 |
| WO2014141028A1 (en) * | 2013-03-13 | 2014-09-18 | Koninklijke Philips N.V. | Method and apparatus for creating a porous reflective contact |
| JP7068771B2 (ja) * | 2013-07-08 | 2022-05-17 | ルミレッズ ホールディング ベーフェー | 波長変換式半導体発光デバイス |
| EP3092666B1 (en) * | 2014-01-07 | 2019-08-28 | Lumileds Holding B.V. | Glueless light emitting device with phosphor converter |
| DE102014102029A1 (de) * | 2014-02-18 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement |
| DE102014110719A1 (de) * | 2014-07-29 | 2016-02-04 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Beleuchtungsvorrichtung und Verfahren zur Herstellung eines Halbleiterbauelements |
| KR102282141B1 (ko) * | 2014-09-02 | 2021-07-28 | 삼성전자주식회사 | 반도체 발광소자 |
| CN104681684A (zh) * | 2014-12-30 | 2015-06-03 | 深圳市华星光电技术有限公司 | 一种发光器件及发光器件封装 |
| CN105023975B (zh) * | 2015-06-08 | 2017-10-27 | 严敏 | 一种红色倒装晶片的制造方法和红色倒装晶片 |
| US10297581B2 (en) | 2015-07-07 | 2019-05-21 | Apple Inc. | Quantum dot integration schemes |
| KR101733043B1 (ko) | 2015-09-24 | 2017-05-08 | 안상정 | 반도체 발광소자 및 이의 제조방법 |
| EP3398211B1 (en) | 2015-12-29 | 2020-07-29 | Lumileds Holding B.V. | Flip chip led with side reflectors and phosphor |
| JP6974324B2 (ja) | 2015-12-29 | 2021-12-01 | ルミレッズ ホールディング ベーフェー | 側面反射器と蛍光体とを備えるフリップチップled |
| WO2018223391A1 (en) * | 2017-06-09 | 2018-12-13 | Goertek. Inc | Micro-led array transfer method, manufacturing method and display device |
| JP2019102715A (ja) * | 2017-12-06 | 2019-06-24 | スタンレー電気株式会社 | 半導体発光装置およびその製造方法 |
| US11404400B2 (en) | 2018-01-24 | 2022-08-02 | Apple Inc. | Micro LED based display panel |
| DE112018007310T5 (de) | 2018-03-21 | 2020-12-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische vorrichtung, die eine leuchtstoffplatte aufweist und verfahren zur herstellung der optoelektronischen vorrichtung |
| CN108550666A (zh) * | 2018-05-02 | 2018-09-18 | 天津三安光电有限公司 | 倒装四元系发光二极管外延结构、倒装四元系发光二极管及其生长方法 |
| US10804440B2 (en) | 2018-12-21 | 2020-10-13 | Lumileds Holding B.V. | Light extraction through adhesive layer between LED and converter |
| CN111446337B (zh) | 2019-01-16 | 2021-08-10 | 隆达电子股份有限公司 | 发光二极管结构 |
| GB202213149D0 (en) * | 2022-09-08 | 2022-10-26 | Poro Tech Ltd | Method of separating a semiconductor device from a substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070057269A1 (en) * | 2003-06-05 | 2007-03-15 | Matsushita Electric Industrial Co., Ltd. | Phosphor, semiconductor light emitting device, and fabrication method thereof |
| US20070284607A1 (en) * | 2006-06-09 | 2007-12-13 | Philips Lumileds Lighting Company, Llc | Semiconductor Light Emitting Device Including Porous Layer |
Family Cites Families (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5376580A (en) | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
| JP2950106B2 (ja) | 1993-07-14 | 1999-09-20 | 松下電器産業株式会社 | 光素子実装体の製造方法 |
| US6784463B2 (en) * | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
| US6229160B1 (en) * | 1997-06-03 | 2001-05-08 | Lumileds Lighting, U.S., Llc | Light extraction from a semiconductor light-emitting device via chip shaping |
| JP2001345484A (ja) | 2000-06-01 | 2001-12-14 | Seiwa Electric Mfg Co Ltd | 発光ダイオードチップ及び発光ダイオードランプ |
| US20020017652A1 (en) | 2000-08-08 | 2002-02-14 | Stefan Illek | Semiconductor chip for optoelectronics |
| TW474034B (en) | 2000-11-07 | 2002-01-21 | United Epitaxy Co Ltd | LED and the manufacturing method thereof |
| JP4639520B2 (ja) | 2001-04-27 | 2011-02-23 | パナソニック株式会社 | 窒化物半導体チップの製造方法 |
| RU2207663C2 (ru) | 2001-07-17 | 2003-06-27 | Ооо Нпц Оэп "Оптэл" | Светодиод |
| JP3874701B2 (ja) * | 2002-06-26 | 2007-01-31 | 株式会社東芝 | 半導体発光素子及び半導体発光装置 |
| US7041529B2 (en) | 2002-10-23 | 2006-05-09 | Shin-Etsu Handotai Co., Ltd. | Light-emitting device and method of fabricating the same |
| JP4174581B2 (ja) | 2002-10-23 | 2008-11-05 | 信越半導体株式会社 | 発光素子の製造方法 |
| JP2004319685A (ja) | 2003-04-15 | 2004-11-11 | Toshiba Corp | 半導体発光素子および半導体発光装置 |
| US20040211972A1 (en) * | 2003-04-22 | 2004-10-28 | Gelcore, Llc | Flip-chip light emitting diode |
| TWI330413B (en) | 2005-01-25 | 2010-09-11 | Epistar Corp | A light-emitting device |
| TW200509408A (en) | 2003-08-20 | 2005-03-01 | Epistar Corp | Nitride light-emitting device with high light-emitting efficiency |
| US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
| US7012279B2 (en) * | 2003-10-21 | 2006-03-14 | Lumileds Lighting U.S., Llc | Photonic crystal light emitting device |
| US7119372B2 (en) * | 2003-10-24 | 2006-10-10 | Gelcore, Llc | Flip-chip light emitting diode |
| JP4160597B2 (ja) * | 2004-01-07 | 2008-10-01 | 浜松ホトニクス株式会社 | 半導体発光素子及びその製造方法 |
| JP4357311B2 (ja) | 2004-02-04 | 2009-11-04 | シチズン電子株式会社 | 発光ダイオードチップ |
| TWI244221B (en) | 2004-03-01 | 2005-11-21 | Epistar Corp | Micro-reflector containing flip-chip light emitting device |
| WO2005093863A1 (en) | 2004-03-29 | 2005-10-06 | Showa Denko K.K | Compound semiconductor light-emitting device and production method thereof |
| TWM255518U (en) | 2004-04-23 | 2005-01-11 | Super Nova Optoelectronics Cor | Vertical electrode structure of Gallium Nitride based LED |
| JP4386789B2 (ja) | 2004-05-12 | 2009-12-16 | ローム株式会社 | 発光ダイオード素子の製造方法 |
| US20070267646A1 (en) * | 2004-06-03 | 2007-11-22 | Philips Lumileds Lighting Company, Llc | Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic |
| US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
| JP4857596B2 (ja) | 2004-06-24 | 2012-01-18 | 豊田合成株式会社 | 発光素子の製造方法 |
| US7560294B2 (en) | 2004-06-07 | 2009-07-14 | Toyoda Gosei Co., Ltd. | Light emitting element and method of making same |
| US7553683B2 (en) * | 2004-06-09 | 2009-06-30 | Philips Lumiled Lighting Co., Llc | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
| TWM277111U (en) | 2004-06-18 | 2005-10-01 | Super Nova Optoelectronics Cor | Vertical electrode structure for white-light LED |
| WO2005124401A1 (ja) | 2004-06-21 | 2005-12-29 | Idemitsu Kosan Co., Ltd. | バックシャーシ一体型反射器、バックライト装置及び液晶表示装置 |
| JP4812369B2 (ja) | 2004-08-27 | 2011-11-09 | 京セラ株式会社 | 発光素子の製造方法 |
| US20060054919A1 (en) | 2004-08-27 | 2006-03-16 | Kyocera Corporation | Light-emitting element, method for manufacturing the same and lighting equipment using the same |
| JP4667803B2 (ja) | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
| DE102004060358A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip |
| US7256483B2 (en) * | 2004-10-28 | 2007-08-14 | Philips Lumileds Lighting Company, Llc | Package-integrated thin film LED |
| US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
| US7419839B2 (en) * | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
| JP2006147787A (ja) | 2004-11-18 | 2006-06-08 | Sony Corp | 発光素子及びその製造方法 |
| JP4901117B2 (ja) | 2005-03-04 | 2012-03-21 | 株式会社東芝 | 半導体発光素子及び半導体発光素子の製造方法 |
| KR100606551B1 (ko) | 2005-07-05 | 2006-08-01 | 엘지전자 주식회사 | 발광소자 제조방법 |
| TWI253770B (en) | 2005-07-11 | 2006-04-21 | Univ Nat Central | Light emitting diode and manufacturing method thereof |
| US7609444B2 (en) * | 2005-10-21 | 2009-10-27 | Hewlett-Packard Development Company, L.P. | Projection partitioning and aligning |
| US7514721B2 (en) | 2005-11-29 | 2009-04-07 | Koninklijke Philips Electronics N.V. | Luminescent ceramic element for a light emitting device |
| KR100723247B1 (ko) | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | 칩코팅형 led 패키지 및 그 제조방법 |
| US8269236B2 (en) * | 2006-02-08 | 2012-09-18 | Showa Denko K.K. | Light-emitting diode and fabrication method thereof |
| JP2007214276A (ja) * | 2006-02-08 | 2007-08-23 | Mitsubishi Chemicals Corp | 発光素子 |
| JP5019755B2 (ja) * | 2006-02-08 | 2012-09-05 | 昭和電工株式会社 | 発光ダイオード及びその製造方法 |
| KR101030659B1 (ko) * | 2006-03-10 | 2011-04-20 | 파나소닉 전공 주식회사 | 발광 소자 |
| JP2007273975A (ja) * | 2006-03-10 | 2007-10-18 | Matsushita Electric Works Ltd | 発光素子 |
| JP4889361B2 (ja) | 2006-04-20 | 2012-03-07 | 昭和電工株式会社 | 半導体発光素子の製造方法 |
| CN100452327C (zh) | 2006-05-19 | 2009-01-14 | 友达光电股份有限公司 | 薄膜晶体管的制作方法 |
| TW200807760A (en) * | 2006-05-23 | 2008-02-01 | Alps Electric Co Ltd | Method for manufacturing semiconductor light emitting element |
| US7829905B2 (en) * | 2006-09-07 | 2010-11-09 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Semiconductor light emitting device |
| US7800122B2 (en) * | 2006-09-07 | 2010-09-21 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Light emitting diode device, and manufacture and use thereof |
| JP4353232B2 (ja) | 2006-10-24 | 2009-10-28 | ソニー株式会社 | 発光素子 |
| KR101271225B1 (ko) | 2006-10-31 | 2013-06-03 | 삼성디스플레이 주식회사 | 발광 다이오드 칩 및 발광 다이오드 광원 모듈의 제조 방법 |
| US9178121B2 (en) | 2006-12-15 | 2015-11-03 | Cree, Inc. | Reflective mounting substrates for light emitting diodes |
| JP2008159708A (ja) | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
| TW200828624A (en) * | 2006-12-27 | 2008-07-01 | Epistar Corp | Light-emitting diode and method for manufacturing the same |
| TW200830577A (en) | 2007-01-05 | 2008-07-16 | Uni Light Touchtek Corp | Method for manufacturing light emitting diode devices |
| ATE526382T1 (de) | 2007-02-07 | 2011-10-15 | Koninkl Philips Electronics Nv | Beleuchtungssystem mit einem monolithischen keramischen verbundlumineszenzumwandler |
| US7601989B2 (en) | 2007-03-27 | 2009-10-13 | Philips Lumileds Lighting Company, Llc | LED with porous diffusing reflector |
| JP5158472B2 (ja) | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
| US9634191B2 (en) * | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
| US10147843B2 (en) | 2008-07-24 | 2018-12-04 | Lumileds Llc | Semiconductor light emitting device including a window layer and a light-directing structure |
| US20110062469A1 (en) | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Molded lens incorporating a window element |
-
2008
- 2008-07-24 US US12/178,902 patent/US10147843B2/en active Active
-
2009
- 2009-07-15 CN CN201610396252.XA patent/CN105870271A/zh active Pending
- 2009-07-15 JP JP2011519263A patent/JP2011529267A/ja active Pending
- 2009-07-15 EP EP09786606.5A patent/EP2308107B1/en active Active
- 2009-07-15 WO PCT/IB2009/053065 patent/WO2010010485A1/en not_active Ceased
- 2009-07-15 CN CN200980128853.0A patent/CN102106004B/zh active Active
- 2009-07-15 KR KR1020117004185A patent/KR20110031999A/ko not_active Ceased
- 2009-07-21 TW TW098124585A patent/TWI505501B/zh active
-
2015
- 2015-01-09 JP JP2015003148A patent/JP2015084451A/ja active Pending
- 2015-09-29 JP JP2015191125A patent/JP6074005B2/ja active Active
-
2017
- 2017-01-05 JP JP2017000636A patent/JP2017059858A/ja active Pending
-
2018
- 2018-12-03 US US16/208,045 patent/US20190189838A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070057269A1 (en) * | 2003-06-05 | 2007-03-15 | Matsushita Electric Industrial Co., Ltd. | Phosphor, semiconductor light emitting device, and fabrication method thereof |
| US20070284607A1 (en) * | 2006-06-09 | 2007-12-13 | Philips Lumileds Lighting Company, Llc | Semiconductor Light Emitting Device Including Porous Layer |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2308107A1 (en) | 2011-04-13 |
| US20100019260A1 (en) | 2010-01-28 |
| JP2017059858A (ja) | 2017-03-23 |
| US20190189838A1 (en) | 2019-06-20 |
| CN102106004A (zh) | 2011-06-22 |
| JP2015084451A (ja) | 2015-04-30 |
| TW201027795A (en) | 2010-07-16 |
| EP2308107B1 (en) | 2020-03-25 |
| JP2016021592A (ja) | 2016-02-04 |
| US10147843B2 (en) | 2018-12-04 |
| JP6074005B2 (ja) | 2017-02-01 |
| JP2011529267A (ja) | 2011-12-01 |
| CN102106004B (zh) | 2016-07-06 |
| TWI505501B (zh) | 2015-10-21 |
| KR20110031999A (ko) | 2011-03-29 |
| WO2010010485A1 (en) | 2010-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102106004B (zh) | 包含窗口层和导光结构的半导体发光器件 | |
| JP4885521B2 (ja) | パッケージ統合された薄膜led | |
| US6838704B2 (en) | Light emitting diode and method of making the same | |
| TWI527205B (zh) | 成長基板已移除之串聯覆晶發光二極體 | |
| KR101431247B1 (ko) | 다공성 확산 반사체를 갖는 led | |
| CN101140977B (zh) | 氮化物半导体发光元件及其制造方法 | |
| JP2005150675A (ja) | 半導体発光ダイオードとその製造方法 | |
| JP2016213490A (ja) | 半導体構造の処理方法 | |
| KR20050089120A (ko) | 발광 다이오드 및 그 제조 방법 | |
| KR101438812B1 (ko) | 반사 구조물 및 이를 구비하는 발광 장치 | |
| CN111164766A (zh) | 一种制作半导体发光元件的方法 | |
| CN1998094A (zh) | 半导体发光二极管上的反射层的制造 | |
| KR20090105462A (ko) | 수직구조 그룹 3족 질화물계 반도체 발광다이오드 소자 및이의 제조 방법 | |
| KR20050013047A (ko) | 발광 다이오드 및 그 제조 방법 | |
| KR100530986B1 (ko) | 발광 다이오드와 그 제조 방법 및 사파이어 기판의 식각방법 | |
| US7118930B1 (en) | Method for manufacturing a light emitting device | |
| CN101271949A (zh) | 发光二极管的制作方法 | |
| KR100629929B1 (ko) | 수직 전극 구조를 가지는 발광 다이오드 | |
| TWI239662B (en) | A method of making high power light emitting diode and the product made therefrom | |
| KR20140134425A (ko) | 발광소자 패키지 및 그 제조 방법 | |
| KR100557855B1 (ko) | 발광 다이오드와 그 제조 방법 및 사파이어 기판의 식각방법 | |
| KR20040067397A (ko) | 반도체 발광 다이오드 제조 방법 | |
| JP2013207108A (ja) | 発光ダイオード素子およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: California, USA Applicant after: LUMILEDS LLC Applicant after: KONINKLIJKE PHILIPS N.V. Address before: California, USA Applicant before: Philips Ramildes Lighting Equipment Co.,Ltd. Applicant before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200828 Address after: Holland Schiphol Applicant after: KONINKLIJKE PHILIPS NV Address before: California, USA Applicant before: LUMILEDS LLC Applicant before: KONINKLIJKE PHILIPS N.V. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160817 |